Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018The influence of environmental conditions on the properties of housing materials for power electronics
Böttge, B.; Bernhardt, R.; Klengel, S.; Wels, S.; Claudi, A.
Conference Paper
2018Investigation of Material Dynamic Processes During Shear Test of Aluminum Heavy Wire Bond Contacts
Klengel, R.; Naumann, F.; Tismer, S.; Klengel, S.
Conference Paper
2018Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density
Böttge, B.; Naumann, F.; Behrendt, S.; Scheibel, M.G.; Kässner, S.; Klengel, S.; Petzold, M.; Nickel, K.G.; Hejtmann, G.; Miric, A.-Z.; Eisele, R.
Conference Paper
2018A new method for prediction of corrosion processes in Aluminum housing materials for electronic components
Klengel, S.; Stephan, T.; Mühs-Portius, B.
Conference Paper
2018A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques
Klengel, R.; Klengel, S.; Schusser, G.; Krause, M.
Conference Paper
2017A new method for prediction of corrosion processes in metallization systems for substrates and electrical contacts
Klengel, S.; Stpehan, T.; Spohn, U.
Conference Paper
2016Comparative Reliability Study of Au Wire Bond Contacts on Al Metallization vs. over Pad Metallization
Klengel, R.; Schischka, J.; Berthold, L.; Klengel, S.
Conference Paper
2016Failure analysis and material characterization in power electronics packaging
Boettge, B.; Schak, M.; Klengel, R.; Schischka, J.; Klengel, S.
Conference Paper
2014Challenges and solutions in preparation for high resolution failure analysis of power electronics
Klengel, R.; Klengel, S.; Böttge, B.
Conference Paper
2014Improvement of nickel wire bonding using Al nano coating
Klengel, R.; Klengel, S.; Schischka, J.; Lorenz, G.; Petzold, M.
Conference Paper
2014Novel failure diagnostic methods for smart card systems
Klengel, S.; Brand, S.; Große, C.; Altmann, F.; Petzold, M.
Conference Paper
2013Acoustic imaging of bump defects in flip-chip devices using split spectrum analysis
Tismer, S.; Brand, S.; Klengel, S.; Petzold, M.; Czurratis, P.
Conference Paper
2013Defect analysis using high throughput plasma FIB in packaging reliability investigations
Altmann, F.; Klengel, S.; Schischka, J.; Petzold, M.
Conference Paper
2013Novel investigation of influencing factors for corrosive interface degradation in wire bond contacts
Klengel, R.; Klengel, S.; Stephan, T.; Petzold, M.
Conference Paper
2013Packaging material issues in high temperature power electronics
Boettge, B.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M.
Conference Paper
2012High resolution analyzes of resistance behavior in eWLB metal contacts
Klengel, S.; Krause, M.; Berthold, L.; Petzold, M.; Förster, J.; Pressel, K.; Meyer, T.
Conference Paper
2012Microstructural and mechanical characterization of ceramic substrates with different metallization for power applications
Böttge, B.; Klengel, S.; Schischka, J.; Lorenz, G.; Knoll, H.
Conference Paper
2011High resolution microstructural investigation of leadfree Aluminium-Germanium and Aluminum-Germanium-Copper alloys for high temperature silicon die attach
Klengel, S.; Böttge, B.; Petzold, M.; Schneider, W.
Conference Paper
2011Reduction of soldering induced stresses in solar cells by microstructural optimization of copper-ribbons
Meier, R.; Pander, M.; Klengel, R.; Dietrich, S.; Klengel, S.; Ebert, M.; Bagdahn, J.
Conference Paper