Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Corrosion mechanism in metallization systems for printed circuit boards
Klengel, S.; Stephan, T.; Mühs-Portius, B.; Klengel, R.
Conference Paper
2018Investigation of Material Dynamic Processes During Shear Test of Aluminum Heavy Wire Bond Contacts
Klengel, R.; Naumann, F.; Tismer, S.; Klengel, S.
Conference Paper
2018A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques
Klengel, R.; Klengel, S.; Schusser, G.; Krause, M.
Conference Paper
2016Comparative Reliability Study of Au Wire Bond Contacts on Al Metallization vs. over Pad Metallization
Klengel, R.; Schischka, J.; Berthold, L.; Klengel, S.
Conference Paper
2016Failure analysis and material characterization in power electronics packaging
Boettge, B.; Schak, M.; Klengel, R.; Schischka, J.; Klengel, S.
Conference Paper
2015Electrical and thermal analysis of frequency dependent filamentary switching in printed rectifying diodes
Heljo, P.S.; Schmidt, C.; Klengel, R.; Majumdar, H.S.; Lupo, D.
Journal Article
2014Challenges and solutions in preparation for high resolution failure analysis of power electronics
Klengel, R.; Klengel, S.; Böttge, B.
Conference Paper
2014Improvement of nickel wire bonding using Al nano coating
Klengel, R.; Klengel, S.; Schischka, J.; Lorenz, G.; Petzold, M.
Conference Paper
2014Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials
März, B.; Graff, A.; Klengel, R.; Petzold, M.
Journal Article
2014Microstructural study of the fatigue mechanism of aluminum cladded copper wires
Naumann, F.; März, B.; Klengel, R.; Schischka, J.; Petzold, M.
Conference Paper
2013Differences in intermetallic phase growth in thermally aged alloyed gold bond interconnections on aluminium
Maerz, B.; Graff, A.; Klengel, R.; Petzold, M.
Conference Paper
2013Novel investigation of influencing factors for corrosive interface degradation in wire bond contacts
Klengel, R.; Klengel, S.; Stephan, T.; Petzold, M.
Conference Paper
2013Packaging material issues in high temperature power electronics
Boettge, B.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M.
Conference Paper
2012The impact of material composition and process parameters on the cSi solar cell interconnection
Schindler, S.; Schneider, J.; Klengel, R.; Petzold, M.
Conference Paper
2012A proper alternative: Ultra sonic bonding for thin film solar cell interconnections
Klengel, R.; Stephan, T.; Petzold, M.; Schindler, S.; Schneider, J.; Spira, K.
Conference Paper
2011Improved testing of soldered Busbar interconnects on silicon solar cells
Klengel, R.; Petzold, M.; Schade, D.; Sykes, B.
Conference Paper
2011Reduction of soldering induced stresses in solar cells by microstructural optimization of copper-ribbons
Meier, R.; Pander, M.; Klengel, R.; Dietrich, S.; Klengel, S.; Ebert, M.; Bagdahn, J.
Conference Paper
2011Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire
Dohle, R.; Petzold, M.; Klengel, R.; Schulze, H.; Rudolf, F.
Journal Article
2010Hochauflösende Metrologie für die Mikro-Nanointegration
Krause, M.; Klengel, R.; Cismak, A.; Petzold, M.; Altmann, F.
Conference Paper
2010Improved quality test method for solder ribbon interconnects on silicon solar cells
Wendt, J.; Träger, M.; Klengel, R.; Petzold, M.; Schade, D.; Sykes, R.
Conference Paper
2010On the intermetallic corrosion of Cu-Al wire bonds
Boettcher, T.; Rother, M.; Liedtke, S.; Ullrich, M.; Bollmann, M.; Pinkernelle, A.; Gruber, D.; Funke, H.-J.; Kaiser, M.; Lee, K.; Li, M.; Leung, K.; Li, T.; Farrugia, M.L.; O'Halloran, O.; Petzold, M.; März, B.; Klengel, R.
Conference Paper
2009Advanced failure analysis methods and microstructural investigations of wire bond contacts for current microelectronic system
Klengel, R.; Bennemann, S.; Petzold, M.
Conference Paper
2009Application of He ion microscopy for material analysis
Altmann, F.; Simon, M.; Klengel, R.
Conference Paper
2009Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire
Petzold, M.; Klengel, R.; Dohle, R.; Schulze, H.; Rudolf, F.
Conference Paper
2006Intermetallic compound formation In Au/Al thermosonic wire bonding during high temperature annealing at 150 °C as a function of wire material
Klengel, R.; Knoll, H.; Petzold, M.; Wohnig, M.; Schräpler, L.
Conference Paper