Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016Polymer-based integrated tuneable laser with on-chip wavelength locker
Felipe, D. de; Happach, M.; Kleiner, M.; Zawadzki, C.; Brinker, W.; Rehbein, W.; Moehrle, M.; Keil, N.; Hofmann, W.; Schell, M.
Conference Paper
2009Characterizing doctrine through a formalization of C2 processes
Hieb, M.R.; Kleiner, M.; Carey, S.; Schade, U.
Conference Paper
2008Metal forming progress since 2000
Jeswiet, J.; Geiger, M.; Engel, U.; Kleiner, M.; Schikorra, M.; Duflou, J.; Neugebauer, Reimund; Bariani, P.; Bruschi, S.
Journal Article
2006Sheet metal forming at elevated temperatures
Neugebauer, Reimund; Altan, T.; Geiger, M.; Kleiner, M.; Sterzing, A.
Conference Paper, Journal Article
1998Interchip via technology-three dimensional metallization for vertically integrated circuits
Bertagnolli, E.; Bollmann, D.; Braun, R.; Buchner, R.; Engelhardt, M.; Grassl, T.; Hieber, K.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Pamler, W.; Popp, R.; Ramm, P.; Renner, E.; Ruhl, G.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, J.; Sänger, A.
Conference Paper
1997Three dimensional metallization for vertically integrated circuits
Ramm, P.; Bollmann, D.; Braun, R.; Buchner, R.; Cao-Minh, U.; Engelhardt, M.; Errmann, G.; Grassl, T.; Hieber, K.; Hübner, H.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Lezec, H.; Muth, W.; Pamler, W.; Popp, R.; Renner, E.; Ruhl, G.; Scheler, U.; Schertel, A.; Schmidt, C.; Schwarzl, S.; Weber, J.; Weber, W.; Sänger, A.
Conference Paper
1997Three dimensional metallization for vertically integrated circuits
Bollmann, D.; Braun, R.; Buchner, R.; Cao-Minh, U.; Engelhardt, M.; Errmann, G.; Grassl, T.; Hieber, K.; Hübner, H.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Lezec, H.; Muth, W.; Pamler, W.; Popp, R.; Renner, E.; Ruhl, G.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, J.; Weber, W.; Ramm, P.; Sänger, A.
Conference Paper
1997Vertically integrated circuits. A key technology for future high performance systems
Engelhardt, M.; Hübner, H.; Jacobs, H.; Kleiner, M.; Kühn, S.; Pamler, W.; Renner, E.; Sänger, A.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, W.; Braun, R.; Grassl, T.; Hieber, K.; Kawala, G.; Klumpp, A.; Landesberger, C.; Popp, R.; Ramm, P.; Ruhl, G.; Weber, J.
Conference Paper