Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2009Stress measurement on chip level optimizes packaging and assembly of microsystems
Schreier-Alt, T.; Schindler-Saefkow, F.; Niehoff, K.; Ansorge, F.; Kittel, H.
Journal Article
2009Thermo-mechanical stress analysis
Niehoff, K.; Schreier-Alt, T.; Schindler-Saefkow, F.; Ansorge, F.; Kittel, H.
Conference Paper
2008Encapsulation of systems in package - process characterization and optimization
Schreier-Alt, T.; Schindler-Saefkow, F.; Wittler, O.; Kittel, H.
Conference Paper
2008Novel stress measurement system for evaluation of package induced stress
Kittel, H.; Endler, S.; Osterwinter, H.; Österle, S.; Schindler-Saefkow, F.
Conference Paper
2008Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Kittel, H.; Michel, B.
Conference Paper
2008Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Schreier-Alt, T.; Kittel, H.; Michel, B.
Conference Paper