Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2010Cellular metals based on wire structures
Studnitzky, T.; Kieselstein, E.; Hufenbach, W.; Weck, D.; Gottwald, R.; Stephani, G.; Kaina, S.
Conference Paper
2010Joining technologies and mechanical properties for a new kind of 3D wire structures
Kaina, S.; Kieback, B.; Hufenbach, W.; Gottwald, R.; Weck, D.; Kieselstein, E.; Studnitzky, T.; Stephani, G.
Conference Paper
2005Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten - Nutzen für die Kniegelenk-Endoprothetik
Rahm, J.; Glien, W.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U.
Journal Article
2005Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten Nutzen für die Kniegelenk-Endoprothetik
Rahm, J.; Glien, W.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U.
Journal Article
2004Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten für die Knie-Gelenkendoprothetik
Glien, W.; Rahm, J.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U.
Conference Paper
2003Fluidic power modules for power electronics and stacked modules
Kaulfersch, E.; Vogel, J.; Kieselstein, E.
Abstract
2003How to detect Edgar Allan Poe's 'purloined letter' - Or: Cross correlation algorithms in digitised video images for object identification, movement evaluation and deformation analysis
Dost, M.; Vogel, D.; Winkler, T.; Vogel, J.; Erb, R.; Kieselstein, E.; Michel, B.
Conference Paper
2003LONGLIFE - optical measuring techniques for reliability evaluation of MEMS
Dost, M.; Kieselstein, E.; Winkler, T.; Noack, E.
Abstract
2003Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten - Nutzen für die Kniegelenk-Endoprothetik
Rahm, J.; Glien, W.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U.
Journal Article, Conference Paper
2002Delamination risk evaluation for plastic packages based on mixed mode fracture mechanics approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Journal Article
2001Application of electroplating in MEMS-micromachining exemplified by a microrelay
Becker, M.; Notarp, D.L.; Vogel, J.; Kieselstein, E.; Sommer, J.P.; Brämer, K.; Grosser, V.; Benecke, W.; Michel, B.
Journal Article
2001Experimentelle und numerische Methoden zur Charakterisierung von Mikrobauteilen
Sommer, J.-P.; Kieselstein, E.; Seiler, B.; Dost, M.; Michel, B.
Conference Paper
2001Interfacial fracture toughness tests suited for reliability enhancements of advanced plastic packages
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2001Mixed mode interfacial fracture toughness evaluation for flip chip assemblies and CSP based on fracture mechanics approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2001Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2000Characterisation of micromaterials and microcomponents by combination of microbending test and UNIDAC
Seiler, B.; Kieselstein, E.; Dost, M.; Wielage, B.; Michel, B.
Conference Paper
2000Characterization of Micro Materials and Micro Components by Combination of the Micro-Bending Test and UNIDAC
Michel, B.; Seiler, B.; Dost, M.; Wielage, B.; Kieselstein, E.; Winkler, T.; Dudek, R.; Auersperg, J.; Schubert, A.; Schneider, W.
Conference Paper
2000Evaluation of GlobTop materials for COB applications
Walter, H.; Schubert, A.; Schneider, W.; Kieselstein, E.; Auerswald, E.; Michel, B.
Conference Paper
2000Experimental and numerical investigations of microelectroplated sensors
Vogel, J.; Sommer, J.-P.; Noack, E.; Kieselstein, E.; Auerswald, E.; Gentzsch, S.; Großer, V.; Winkler, T.; Michel, B.
Conference Paper
2000Interface fracture investigations on micro components
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2000Investigation of interface cracking in electronic packages
Kieselstein, E.; Seiler, B.; Winkler, T.; Auersperg, J.; Dudek, R.; Schubert, A.; Schneider, W.; Michel, B.
Conference Paper
2000Material Characterization and FE Analysis of Electroplated Microrelays
Vogel, J.; Sommer, J.-P.; Faust, W.; Kieselstein, E.; Michel, B.
Conference Paper
2000Mixed mode interfacial fracture toughness investigations for thermo-mechanical reliability enhancement of plastic packages
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2000UNIDAC: Cross correlation based deformation analysis at digitised micrographs to study material behaviour and parameters in MST
Dost, M.; Kieselstein, E.; Erb, R.; Seiler, B.; Vogel, J.; Bombach, C.; Großer, V.; Vogel, D.; Michel, B.
Conference Paper
2000X-ray diffraction at elevated temperatures in microsystem technology
Auerswald, E.; Anhöck, S.; Kieselstein, E.; Vogel, J.; Michel, B.
Conference Paper
1999Charakterisierung galvanisch abgeschiedener Sensorstrukturen
Auerswald, E.; Sommer, J.-P.; Michel, B.; Kieselstein, E.; Brämer, B.
Conference Paper
1999Correlation analysis at grey scale patterns in an in-situ measuring module for microsystem technology
Dost, M.; Rümmler, N.; Kieselstein, E.; Erb, R.; Hillmann, V.; Großer, V.
Book Article
1999Determination of material properties by the optical measuring procedure UNIDAC
Kieselstein, E.; Seiler, B.; Dost, M.; Michel, B.
Journal Article
1997Characterization of composite materials by means of correlation analysis of grey scale patterns
Kieselstein, E.; Penno, M.; Wielage, B.; Dost, M.; Michel, B.
Conference Paper