Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
20170.13-μm SiGe BiCMOS technology with More-than-Moore modules
Kaynak, M.; Wietstruck, M.; Göritz, A.; Wipf, S.T.; Inac, M.; Cetindogan, B.; Wipf, C.; Kaynak, C.B.; Wöhrmann, M.; Voges, S.; Braun, T.
Conference Paper
2017Development of a multi-project fan-out wafer level packaging platform
Braun, T.; Raatz, S.; Maass, U.; Dijk, M. van; Walter, H.; Hölck, O.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Wöhrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M.
Conference Paper
2017Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
Wipf, S.T.; Göritz, A.; Wietstruck, M.; Cirillo, M.; Wipf, C.; Zoschke, K.; Kaynak, M.
Conference Paper
2014Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Zoschke, K.; Wilke, M.; Wegner, M.; Kaletta, K.; Manier, C.A.; Oppermann, H.; Wietstruck, M.; Tillack, B.; Kaynak, M.; Lang, K.-D.
Conference Paper
2014Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding
Wietstruck, M.; Kaynak, M.; Marschmeyer, S.; Wipf, C.; Tekin, I.; Zoschke, K.; Tillack, B.
Conference Paper
2012Material properties characterization of BiCMOS BEOL metal stacks for RF-MEMS applications
Wietstruck, M.; Kaynak, M.; Zhang, W.; Wolansky, D.; Kurth, S.; Erler, B.; Tillack, B.
Conference Paper
2012Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Barth, R.; Knoll, D.; Korndorfer, F.; Scholz, R.; Schulz, K.; Wipf, C.; Tillack, B.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Ulusoy, A.C.; Purtova, T.; Liu, G.; Schumacher, H.
Conference Paper
2012RF-MEMS switch module in a 0.25 µm BiCMOS technology
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Scholz, R.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Elkhouly, M.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Mühlhaus, V.; Liu, G.; Purtova, T.; Ulusoy, A.C.; Schumacher, H.; Tillack, B.
Conference Paper
2011Materialcharakterisierung eines komplexen Metallschichtstapels fur einen monolithischintegrierten RF-MEMS-Schalter
Wietstruck, M.; Kaynak, M.; Tillack, B.; Kurth, S.; Erler, B.
Conference Paper
2011MEMS module integration into SiGe BiCMOS technology for embedded system applications
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Suchodoletz, M.V.; Zoschke, K.; Kaletta, K.; Ehrmann, O.; Leidich, S.; Kurth, S.; Tillack, B.
Conference Paper
2011MEMS module integration into SiGe BiCMOS technology for embedded system applications
Kaynak, M.; Wietstruck, M.; Zhang, W.; Scholz, R.; Drews, J.; Marschmeyer, S.; Knoll, D.; Korndorfer, F.; Schulz, K.; Wipf, C.; Wolansky, D.; Kaletta, K.; Wegner, M.; Ehrmann, O.; Tillack, B.
Conference Paper
2010BiCMOS embedded RF-MEMS switch for above 90 GHz applications using backside integration technique
Kaynak, M.; Wietstruck, M.; Scholz, R.; Drews, J.; Barth, R.; Ehwald, K.E.; Fox, A.; Haak, U.; Knoll, D.; Korndörfer, F.; Marschmeyer, S.; Schulz, K.; Wipf, C.; Wolansky, D.; Tillack, B.; Zoschke, K.; Fischer, T.; Kim, Y.S.; Kim, J.S.; Lee, W.-G.; Kim, J.W.
Conference Paper
2009BEOL embedded RF-MEMS switch for mm-wave applications
Kaynak, M.; Ehwald, K.-E.; Drews, J.; Scholz, R.; Korndorfer, F.; Knoll, D.; Tillack, B.; Barth, R.; Birkholz, M.; Schulz, K.; Sun, Y.M.; Wolansky, D.; Leidich, S.; Kurth, S.; Gurbuz, Y.
Conference Paper