Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2004Strength and reliability testing for silicon based MEMS
Petzold, M.; Bagdahn, J.; Katzer, D.
Book Article
2004Zielgenaue Präparation von Proben für die Transmissionselektronenmikroskopie
Altmann, F.; Katzer, D.
Journal Article
2002Mikromechanische Modelle für das kristallographische Wachstum kurzer Risse
Sester, M.; Heilmann, A.; Burdack, M.; Katzer, D.
Conference Paper
2002Strength and long-term reliability testing of wafer-bonded MEMS
Petzold, M.; Katzer, D.; Wiemer, M.; Bagdahn, J.
Conference Paper
2001A new approach for handling and transferring of thin semiconductor materials
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.; Alexe, M.; Dragoi, V.; Gösele, U.
Conference Paper
2001Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.; Alexe, M.; Dragoi, V.; Gösele, U.
Conference Paper
2000The influence of surface oxide films on hardness and thermosonic wire bonding of Al bondpads
Petzold, M.; Berthold, L.; Katzer, D.; Knoll, H.; Memhard, D.; Meier, P.; Lang, K.-D.
Conference Paper
2000Microscopic lock-in thermography investigation of leakage sites in integrated circuits
Breitenstein, O.; Langenkamp, M.; Altmann, F.; Katzer, D.; Lindner, A.; Eggers, H.
Journal Article
2000Surface oxide films on aluminum bondpads: Influence on thermosonic wire bonding behavior and hardness
Petzold, M.; Berthold, L.; Katzer, D.; Knoll, H.; Memhard, D.; Meier, P.; Lang, K.-D.
Journal Article
1999Cross-sectional specimen preparation from ICs downside for SEM and TEM-failure analysis using focused ion beam etching
Altmann, F.; Katzer, D.
Journal Article
1999Determination of the pore size and the vertical structure of nanoporous aluminium oxide membranes
Heilmann, A.; Altmann, F.; Katzer, D.; Müller, F.; Sawitowski, T.; Schmid, G.
Journal Article
1999Quality and mechanical reliability assessment of wafer-bonded micromechanical components
Petzold, M.; Bagdahn, J.; Katzer, D.
Journal Article
1998High resolution EBIC imaging of shallow p-n junctions using FEG-SEM
Wellner, A.; Katzer, D.; Blumtritt, H.; Röder, A.
Conference Paper
1998Mechanical reliability of silicon wafer-bonded components
Bagdahn, J.; Katzer, D.; Petzold, M.
Conference Paper
1998Untersuchungen zum subkritischen Rißwachstum gebondeter Siliziumwafer
Bagdahn, J.; Katzer, D.; Petzold, M.
Conference Paper
1997The influence of sharp notches on the strength of directly bonded components
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.
Conference Paper
1997Microstructure and cohesion of thin ZnO interlayers in metal-duromer heterostructures
Morawietz, K.; Busch, M.; Katzer, D.; Neu, A.
Conference Paper
1997Strain measurement by means of convergent beam electron diffraction in submicron volumes
Langer, E.; Altmann, F.; Katzer, D.; Neumann, W.
Conference Paper
1996Charakterisierung strukturell-morphologischer Eigenschaften von Al-Bondpads mittels rastermikroskopischer Verfahren
Katzer, D.; Erfurth, W.
Conference Paper
1995Determination of mechanical properties of microparts
Katzer, D.; Sommer, E.
Conference Paper
1995In situ function testing of a dew-point microsensor in the environmental scanning electron microscope
Füting, M.; Katzer, D.; Heinze, D.; March, B.; Steinke, A.
Conference Paper
1995Structural investigations and indentation testing of aluminium bondpads
Katzer, D.; Petzold, M.; Koch, T.; Grellmann, W.
Conference Paper
1995TEM in situ bending test on micromechanical parts
Langer, E.; Katzer, D.
Conference Paper
1994Dislocation emission from moving cleavage cracks in silicon at room temperature
Langer, E.; Katzer, D.
Journal Article
1994The influence of local thermomechanical stress on grain growth in thin Al-1 per cent Si layers on SiO2/Si substrates
Gerth, D.; Katzer, D.; Schwarzer, R.A.
Journal Article
1994Korrelation von mechanischem Verhalten und Mikrostruktur in Fügeverbindungen
Katzer, D.; Petzold, M.
Conference Paper
1994TEM in situ test on micromechanical parts
Langer, E.; Katzer, D.
Conference Paper