Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Modular power electronics, realized by PCB embedding technology
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Presentation
2013Large-scale manufacturing of embedded subsystems-in-substrates and a 3D-stacking approach for a miniaturised medical system integration
Manessis, Dionysios; Podlasly, Andreas; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2013Power electronics packages with embedded components - recent trends and developments
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Conference Paper
2011System Packaging by Embedding: Technologies, Examples and Perspectives
Löher, Thomas; Böttcher, Lars; Schütze, David; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf
Conference Paper
2010Implementation of chip embedding processes for the creation of miniaturized system-in-packages
Böttcher, Lars; Manessis, Dionysios; Ostmann, Andreas; Karaszkiewicz, Stefan; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2010Next generation system in a package manufacturing
Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert
Conference Paper
2010Next Generation System in a Package Manufacturing by Embedded Chip Technologies
Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert
Conference Paper, Journal Article