Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Fabrication of partly encapsulated vertical nanoelectrodes for an intracellular microelectrode array
Allani, Sonja; Jupe, Andreas; Kappert, Holger; Vogt, Holger
Conference Paper
2019Fully integrated sensor electronics for inductive proximity switches operating up to 250 °C
Braun, Sebastian; Kordas, Norbert; Utz, Alexander; Kappert, Holger; Kokozinski, Rainer
Journal Article, Conference Paper
2019Herstellung nano-skalierter Gassensoren unter Verwendung neuer Metalloxid-ALDPrecursormaterialien
Knauß, Anna M.; Dietz, Dorothee; Jupe, Andreas; Kappert, Holger; Vogt, Holger; Mai, Lukas; Devi, Anjana
Conference Paper
2019On-turbine multisensors based on hybrid ceramic manufacturing technology
Ziesche, Steffen; Goldberg, Adrian; Partsch, Uwe; Kappert, Holger; Kind, Heidrun; Aden, Mirko; Naumann, Falk
Conference Paper
2019Post-CMOS 3D-integration of a nanopellistor
Münchenberger, Finja M.; Dreiner, Stefan; Kappert, Holger; Vogt, Holger
Conference Paper
2019Wafer-Level-3D-Integrationsverfahren für hochsensitive optische Sensoren
Kalwa, Lukas; Gläsener, Stefan; Ruskowski, Jennifer; Figge, Martin; Kappert, Holger; Vogt, Holger
Conference Paper
2018Evaluation of a median threshold based EEPROM-PUF concept implemented in a high temperature SOI CMOS technology
Willsch, Benjamin; Heesen, Marius te; Hauser, Julia; Dreiner, Stefan; Kappert, Holger; Vogt, Holger
Conference Paper
2018New concept for post-CMOS pellistor integration
Münchenberger, Finja M.; Dreiner, Stefan; Kappert, Holger; Vogt, Holger
Conference Paper
2018Penetrating nanoelectrodes for an electrical cell interface on CMOS ASIC
Allani, Sonja; Jupe, Andreas; Utz, Alexander; Schaal, Christopher; Rustom, Amin; Kappert, Holger; Vogt, Holger
Conference Paper
2018Thin film ALD materials as functional layer for 3D-integrated metal oxide gas-sensors
Knauß, Anna M.; Münchenberger, Finja M.; Dietz, Dorothee; Jupe, Andreas; Kappert, Holger; Vogt, Holger
Conference Paper
2017Analysis of semiconductor process variations by means of hierarchical median polish
Willsch, Benjamin; Hauser, Julia; Dreiner, Stefan; Goehlich, Andreas; Kappert, Holger; Vogt, Holger
Conference Paper
2017Heterogene Integration einer Miniatur-Solarzelle für autarke Sensoren
Krause, Christopher; Stühlmeyer, Martin; Figge, Martin; Goehlich, Andreas; Kappert, Holger
Conference Paper
2017High temperature EEPROM using a differential approach for high reliability
Kappert, Holger; Braun, Sebastian; Alfring, Michael; Kordas, Norbert; Kelberer, Andreas; Dreiner, Stefan; Kokozinski, Rainer
Journal Article, Conference Paper
2017Implementation of an integrated differential readout circuit for transistor-based physically unclonable functions
Willsch, Benjamin; Müller, Kai-Uwe; Zhang, Qi; Hauser, Julia; Dreiner, Stefan; Stanitzki, Alexander; Kappert, Holger; Kokozinski, Rainer; Vogt, Holger
Conference Paper
2017Untersuchung von dreidimensionalen Nanoelektroden für die intrazelluläre Kontaktierung auf integrierten Schaltungen
Allani, Sonja; Jupe, Andreas; Figge, Martin; Goehlich, Andreas; Kappert, Holger; Vogt, Holger
Conference Paper
2016Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C
Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Journal Article
2016High temperature GaN gate driver in SOI CMOS technology
Kappert, Holger; Braun, Sebastian; Kordas, Norbert; Dreiner, Stefan; Kokozinski, Rainer
Journal Article, Conference Paper
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments
Gabler, Felix; Roscher, Frank; Döring, Ralf; Otto, Alexander; Ziesche, Steffen; Ihle, Martin; Celik, Yusuf; Dietz, Dorothee; Goehlich, Andreas; Kappert, Holger; Vogt, Holger; Naumann, Falk; Geßner, Thomas
Conference Paper
2016Using Ion/Ioff to predict switch-based circuit accuracy in an extended temperature range up to 300°C
Tallhage, Jonas; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2015Entwicklung von Hochtemperatur Trench-Kondensatoren unter Verwendung von dünnen ALD-Dielektrika
Dietz, Dorothee; Celik, Yusuf; Goehlich, Andreas; Vogt, Holger; Kappert, Holger
Conference Paper
2015Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C
Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Conference Paper
2015Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C
Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Conference Paper, Journal Article
2015High temperature SOI CMOS technology and circuit realization for applications up to 300°C
Kappert, Holger; Kordas, Norbert; Dreiner, Stefan; Paschen, Uwe; Kokozinski, Rainer
Conference Paper
2015High-temperature trench capacitors, using thin-film ALD dielectrics
Dietz, Dorothee; Celik, Yusuf; Goehlich, Andreas; Vogt, Holger; Kappert, Holger
Journal Article, Conference Paper
2015High-temperature trench capacitors, using thin-film ALD dielectrics
Dietz, Dorothee; Celik, Yusuf; Goehlich, Andreas; Vogt, Holger; Kappert, Holger
Conference Paper
2014High temperature 0.35 micron Silicon-on-Insulator CMOS technology
Kappert, Holger; Dreiner, Stefan; Kordas, Norbert; Schmidt, Alexander; Paschen, Uwe; Kokozinski, Rainer
Conference Paper
2014Zuverlässigkeitsuntersuchungen an einer hochtemperaturtauglichen SOI-CMOS-Technologie
Dreiner, Stefan; Grella, Katharina; Heiermann, Wolfgang; Kelberer, Andreas; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Journal Article
2013Analog performance of PD-SOI MOSFETs at high temperatures using reverse body bias
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2013Enhanced high temperature performance of PD-SOI MOSFETs in analog circuits using reverse body biasing
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2013Enhanced high temperature performance of PD-SOI MOSFETs in analog circuits using reverse body biasing
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Journal Article
2013High temperature analog circuit design in PD-SOI CMOS technology using reverse body biasing
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2013High temperature characterization up to 450°C of MOSFETs and basic circuits realized in a Silicon-on-Insulator (SOI) CMOS-technology
Grella, Katharina; Dreiner, Stefan; Schmidt, Alexander; Heiermann, Wolfgang; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Journal Article
2013PD-SOI MOSFET performance optimization for high temperatures up to 400°C using reverse body biasing
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2012A cyclic RSD analog-digital-converter for application specific high temperature integrated circuits up to 250°C
Schmidt, Alexander; Kappert, Holger; Heiermann, Wolfgang; Kokozinski, Rainer
Conference Paper
2012High temperature characterization up to 450 °C of MOSFETs and basic circuits realized in a Silicon-on-Insulator (SOI) CMOS-technology
Grella, Katharina; Dreiner, Stefan; Schmidt, Alexander; Heiermann, Wolfgang; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Conference Paper
2012Hochtemperaturelektronik
Kappert, Holger
Conference Paper
2012Precision analog circuit design in SOI CMOS for a wide temperature range up to 350°C
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2012Process window of thermosonic palladium wire bonding on electroplated gold layers for high temperature applications
Heiermann, Wolfgang; Heß, Jennifer; Geruschke, Thomas; Bauer, Jochen; Ruß, Marco; Kappert, Holger; Vogt, Holger
Presentation