Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
1997Effektives Simulationstool für das thermische Management elektronischer Packages
Kamp, A.; Hahn, R.; Schmidt, M.; Dai, W.; Reichl, H.
Journal Article
1997High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice
Hahn, R.; Töpper, M.; Schmidt, M.; Kamp, A.; Ginolas, A.; Wolf, J.; Glaw, V.; Buschick, K.; Ehrmann, O.; Reichl, H.
Conference Paper
1997High power multi chip modules employing the planar embedding technique and microchannel water heat sinks
Hahn, R.; Kamp, A.; Ginolas, A.; Schmidt, M.; Wolf, J.; Glaw, V.; Töpper, M.; Ehrmann, O.; Reichl, H.
Journal Article
1997High power multichip modules employing the planar embedding technique and microchannel water heat sinks
Töpper, M.; Hahn, R.; Kamp, A.; Ginolas, A.; Schmidt, M.; Wolf, J.; Glaw, V.; Ehrmann, O.; Reichl, H.
Conference Paper
1997Measurement of PbSn and AuSn flip chip area bump thermal resistance
Hahn, R.; Kamp, A.; Reichl, H.
Conference Paper
1997Thermal conductivity of PbSn and AuSn flip chip bumps
Hahn, R.; Kamp, A.; Reichl, H.
Conference Paper
1997Thermal simulation of aluminium nitride heat spreaders for varíous advanced electronic packaging applications
Hahn, R.; Kamp, A.; Hoehne, J.; Töpfer, M.; Reichl, H.
Conference Paper