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| 2012 | Large area sensor integration in textiles
Kallmayer, C.; Simon, E. | Conference Paper |
| 2012 | Lignin in der Elektronik
Rückschloss, Jana; Schmidt, Ralf; Müller, Jutta; Kallmayer, Christine; Haberland, Julian | Conference Paper |
| 2011 | Future Packaging
Pötter, H.; Oestermann, U.; Jung, E.; Kallmayer, C. | Journal Article |
| 2011 | Future Packaging - Technologien, Produkte, Visionen
Pötter, H.; Oestermann, U.; Jung, E.; Kallmayer, C. | Journal Article |
| 2011 | Heterogenous integration - packaging on and in organic substrates
Becker, Karl-Friedrich; Braun, T.; Bauer, J.; Böttcher, L.; Ostmann, A.; Pahl, B.; Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2011 | NCA flip-chip bonding with thermoplastic elastomer adhesives
Foerster, Philipp; Linz, Torsten; Krshiwoblozki, Malte von; Walter, Hans; Kallmayer, Christine; Aschenbrenner, Rolf | Conference Paper |
| 2011 | Novel approach for integrating electronics into textiles at room temperature using a force-fit interconnection
Simon, Erik; Kallmayer, Christine; Aschenbrenner, Rolf; Klaus-Dieter, Lang | Conference Paper |
| 2010 | Design and Characterization of a Small Encapsulated UHF RFID Tag for Wood Log Monitoring
Ohnimus, F.; Haberland, J.; Tschoban, C.; Ndip, I.; Heumann, K.; Kallmayer, C.; Guttowski, S.; Lang, K.-D. | Conference Paper |
| 2010 | Investigation on thermo-mechanical reliability of flip-chip assemblies using anisotropic conductive adhesive
Kallmayer, C.; Walter, H.; Aschenbrenner, R.; Michel, B. | Conference Paper |
| 2010 | New packaging and interconnect technologies for ultra thin chips
Kallmayer, C.; Aschenbrenner, R.; Haberland, J.; Reichl, H. | Conference Paper |
| 2009 | Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications
Linz, T.; Vieroth, R.; Dils, C.; Koch, M.; Braun, T.; Becker, K.-F.; Kallmayer, C.; Hong, S.-M. | Conference Paper |
| 2009 | Failure modeling of ACA-glued flip-chip on flex assemblies
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Gollhardt, A.; Michel, B.; Reichl, H. | Conference Paper, Journal Article |
| 2009 | Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology
Dieckerhoff, S.; Wernicke, T.; Kallmayer, C.; Guttowski, S.; Reichl, H. | Journal Article |
| 2009 | A new package for textile integrated RFID tags
Vieroth, R.; Kallmayer, C.; Aschenbrenner, R.; Herbert, R. | Conference Paper |
| 2009 | Stretchable circuit board technology and application
Vieroth, R.; Löher, T.; Seckel, M.; Dils, C.; Kallmayer, C.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2009 | Stretchable electronic systems: Realization and applications
Löher, T.; Seckel, M.; Vieroth, R.; Dils, C.; Kallmayer, C.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications
Linz, T.; Vieroth, R.; Dils, C.; Koch, M.; Braun, T.; Becker, K.-F.; Kallmayer, C.; Hong, S.-M. | Conference Paper |
| 2008 | Lifetime Model for Flip-Chip on Flex using Anisotropic Conductive Adhesive under Moisture and Temperature Loading
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H. | Conference Paper |
| 2008 | Low Temperature Au-Au Flip Chip Interconnections
Pahl, B.; Zwanzig, M.; Fiedler, S.; Kallmayer, C.; Töpper, M.; Schmidt, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Reliability modeling & test for flip-chip on flex substrates with Ag-filled anisotropic conductive adhesive
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H. | Conference Paper |
| 2008 | Verfahren zur Kontaktierung, Zusammensetzung fuer die Chipkontaktierung sowie deren Verwendung
Bauer, J.; Kallmayer, C.; Pahl, B. | Patent |
| 2007 | Electric characteristics of planar interconnect technologies for power MOSFETs
Dieckerhoff, S.; Kirfo, T.; Wernicke, T.; Kallmayer, C.; Ostmann, A.; Jung, E.; Wunderle, B.; Reichl, H. | Conference Paper |
| 2006 | Electronic textiles
Reichl, Herbert; Kallmayer, Christine; Linz, Torsten | Book Article |
| 2006 | Ergebnisdarstellung "SHIFT" - Chipintegrationstechnologie
Löher, T.; Kallmayer, C.; Neumann, A.; Pahl, B.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2006 | Fully integrated EKG shirt based on embroidered electrical interconnections with conductive yarn and miniaturized flexible electronics
Linz, T.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | Innovative substrate technologies for new products
Aschenbrenner, R.; Löher, T.; Ostmann, A.; Kallmayer, C.; Scheel, W.; Reichl, H. | Conference Paper |
| 2006 | Super Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology - Reliability Investigations and Applications
Haberland, J.; Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Chipmodul und Verfahren zur Herstellung eines Chipmoduls
Wegerer, G.; Ansorge, F.; Kallmayer, C.; Rebholz, C. | Patent |
| 2005 | Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric
Linz, T.; Kallmayer, C. | Conference Paper |
| 2005 | New Interconnection Technologies for the Integration of Electronics on Textile Substrates
Linz, T.; Kallmayer, C. | Conference Paper |
| 2005 | Packaging challenges in miniaturization
Kallmayer, C.; Niedermayer, M.; Guttowski, S.; Reichl, H. | Book Article |
| 2005 | System integration technologies for smart textiles
Kallmayer, Christine; Linz, Torsten; Aschenbrenner, Rolf; Reichl, Herbert | Journal Article |
| 2005 | Ultrathin assemblies on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2004 | Long-time reliability study of soldered flip chips on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2004 | Ultra thin flip chip interconnects
Haberland, J.; Kallmayer, C. | Journal Article |
| 2004 | Ultrathin soldered flip chip interconnections on flexible substrates
Pahl, B.; Loeher, T.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | New assembly technologies for textile transponder systems
Kallmayer, C.; Pisarek, R.; Neudeck, A.; Cichos, S.; Gimpel, S.; Aschenbrenner, R.; Reichlt, H. | Conference Paper |
| 2003 | Reliability of integrated passive components
Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Fabric-based communication
Kallmayer, C.; Griese, H. | Journal Article |
| 2002 | Long time reliability of flip chip interconnections on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Packaging technologies for flexible systems
Kallmayer, C.; Bock, K.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Reliability investigations of hard core solder bumps using mechanical palladium bumps and SnPb solder
Oppermann, H.; Kalicki, R.; Anhöck, S.; Kallmayer, C.; Klein, M.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2001 | Lead free alloys for flip chip bumping
Jung, E.; Aschenbrenner, R.; Kallmayer, C.; Coskina, P.; Reichl, H. | Conference Paper |
| 2001 | Processing design rules for reliable reflowable underfill application
Kallmayer, C.; Becker, K.-F.; Jung, E.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | A thermode bonding process for fine pitch flip chip applications down to 40 micron
Pahl, B.; Nieland, S.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Verfahren und Vorrichtung zum Erzeugen einer leitfaehigen Struktur auf einem Substrat
Nieland, C.; Kallmayer, C.; Miessner, R.; Aschenbrenner, R.; Ostmann, A. | Patent |
| 2000 | Advanced flip chip technologies in RF, microwave and MEMS applications
Oppermann, H.H.; Kallmayer, C.; Klein, M.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Lead free solders for area array packaging
Klöser, J.; Kallmayer, C.; Jung, E.; Coskina, P.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Lead free solders for area array packaging
Jung, E.; Klöser, J.; Kallmayer, C.; Coskina, P.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Manufacturing a CSP at wafer level
Simon, J.; Wolf, J.; Kallmayer, C.; Töpper, M.; Reichl, H. | Conference Paper |
| 2000 | Manufacturing CSP's at waferlevel or flip chip without underfill
Simon, J.; Wolf, J.; Kallmayer, C. | Conference Paper |
| 2000 | Study on reflowable underfill materials for different flip chip processes
Kallmayer, C.; Becker, K.-F.; Jung, E.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1999 | Entwicklung eines CSP auf Waferebene
Simon, J.; Auersperg, J.; Becker, K.-F.; Busse, E.; Heinricht, K.; Kallmayer, C.; Schütt, J.; Töpper, M.; Reichl, H. | Book Article |
| 1999 | Reliability investigations of flip-chip solder bumps on palladium
Kallmayer, C.; Oppermann, H.; Kalicki, R.; Klein, M.; Anhöck, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Reliability investigations for flip chip on flex using different solder materials
Kallmayer, C.; Oppermann, H.; Anhöck, S.; Azadeh, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1997 | Evaluation of ORMOCERs for microelectronics applications
Dabek, A.; Popall, M.; Olsowski, B.; Kallmayer, C.; Reichl, H. | Conference Paper |
| 1997 | A new approach to chip size package using meniscus soldering and FPC-bonding
Kallmayer, C.; Jung, E.; Kasulke, P.; Azadeh, R.; Azdasht, G.; Zakel, E.; Reichl, H. | Conference Paper |
| 1997 | Untermetallisierung fuer Lotmaterialien
Zakel, E.; Kallmayer, C.; Nave, J. | Patent |
| 1996 | Verfahren zur Substratfixierung von elektronischen Bauelementen
Oppermann, H.H.; Zakel, E.; Kallmayer, C.; Kloeser, A. | Patent |
| 1995 | Experimental results on the self-alignment process using Au/Sn metallurgy and the growth of the xi-phase during the reflow
Kallmayer, C.; Oppermann, H.; Klöser, J.; Zakel, E.; Reichl, H. | Conference Paper |