Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Materials and Concepts for Textile Sensor Systems
Aschenbrenner, Rolf; Kallmayer, Christine
Presentation
2014Printed electroluminescent structures for smart cards
Wróblewski, G.; Sloma, M.; Kallmayer, C.; Marques, J.; Haberland, J.; Janczak, D.; Jakubowska, M.
Conference Paper
2013Electronics in textiles – adhesive bonding technology for reliably embedding electronic modules into textile circuits
Krshiwoblozki, Malte von; Linz, Torsten; Neudeck, Andreas; Kallmayer, Christine
Conference Paper
2013Thermoplastic based system-in-package for RFID application
Kallmayer, C.; Pahl, B.; Grams, A.; Marques, J.; Lang, K.-D.; Suwald, T.
Conference Paper
2013Thermoplastic packaging and embedding technology for ID-cards
Marques, J.; Pahl, B.; Kallmayer, C.
Conference Paper
2012A "Velcro" type of metal-based micro connector
Schuck, H.; Bauerfeld, F.; Knoll, T.; Velten, T.; Zwanzig, M.; Schmidt, R.; Kallmayer, C.
Conference Paper
2012First approach to cost-efficient fine pitch NCA flip-chip assembly on thermoplastic polyurethane printed circuit boards
Foerster, P.; Dils, C.; Kallmayer, C.; Löher, T.; Lang, K.-D.
Conference Paper
2012Heterogenous integration - packaging on and in organic substrates
Becker, Karl-Friedrich; Braun, T.; Bauer, J.; Böttcher, L.; Ostmann, A.; Pahl, B.; Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2012Large area sensor integration in textiles
Kallmayer, C.; Simon, E.
Conference Paper
2012Lignin in der Elektronik
Rückschloss, Jana; Schmidt, Ralf; Müller, Jutta; Kallmayer, Christine; Haberland, Julian
Conference Paper
2011Future Packaging
Pötter, H.; Oestermann, U.; Jung, E.; Kallmayer, C.
Journal Article
2011Future Packaging - Technologien, Produkte, Visionen
Pötter, H.; Oestermann, U.; Jung, E.; Kallmayer, C.
Journal Article
2011NCA flip-chip bonding with thermoplastic elastomer adhesives
Foerster, Philipp; Linz, Torsten; Krshiwoblozki, Malte von; Walter, Hans; Kallmayer, Christine; Aschenbrenner, Rolf
Conference Paper
2011Novel approach for integrating electronics into textiles at room temperature using a force-fit interconnection
Simon, Erik; Kallmayer, Christine; Aschenbrenner, Rolf; Klaus-Dieter, Lang
Conference Paper
2010Design and Characterization of a Small Encapsulated UHF RFID Tag for Wood Log Monitoring
Ohnimus, F.; Haberland, J.; Tschoban, C.; Ndip, I.; Heumann, K.; Kallmayer, C.; Guttowski, S.; Lang, K.-D.
Conference Paper
2010Investigation on thermo-mechanical reliability of flip-chip assemblies using anisotropic conductive adhesive
Kallmayer, C.; Walter, H.; Aschenbrenner, R.; Michel, B.
Conference Paper
2010New packaging and interconnect technologies for ultra thin chips
Kallmayer, C.; Aschenbrenner, R.; Haberland, J.; Reichl, H.
Conference Paper
2010Ultrathin 3D ACA flipchip-in-flex technology
Haberland, J.; Becker, M.; Lutke-Notarp, D.; Kallmayer, Ch.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications
Linz, Torsten; Vieroth, R.; Dils, C.; Koch, M.; Braun, T.; Becker, K.-F.; Kallmayer, C.; Hong, S.-M.
Conference Paper
2009Failure modeling of ACA-glued flip-chip on flex assemblies
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper, Journal Article
2009Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology
Dieckerhoff, S.; Wernicke, T.; Kallmayer, C.; Guttowski, S.; Reichl, H.
Journal Article
2009A new package for textile integrated RFID tags
Vieroth, R.; Kallmayer, C.; Aschenbrenner, R.; Herbert, R.
Conference Paper
2009Stretchable circuit board technology and application
Vieroth, R.; Löher, T.; Seckel, M.; Dils, C.; Kallmayer, C.; Ostmann, A.; Reichl, H.
Conference Paper
2009Stretchable electronic systems: Realization and applications
Löher, T.; Seckel, M.; Vieroth, R.; Dils, C.; Kallmayer, C.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications
Linz, Torsten; Vieroth, R.; Dils, C.; Koch, M.; Braun, T.; Becker, K.-F.; Kallmayer, C.; Hong, S.-M.
Conference Paper
2008Lifetime Model for Flip-Chip on Flex using Anisotropic Conductive Adhesive under Moisture and Temperature Loading
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H.
Conference Paper
2008Low Temperature Au-Au Flip Chip Interconnections
Pahl, B.; Zwanzig, M.; Fiedler, S.; Kallmayer, C.; Töpper, M.; Schmidt, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Reliability modeling & test for flip-chip on flex substrates with Ag-filled anisotropic conductive adhesive
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H.
Conference Paper
2008Verfahren zur Kontaktierung, Zusammensetzung fuer die Chipkontaktierung sowie deren Verwendung
Bauer, J.; Kallmayer, C.; Pahl, B.
Patent
2007Electric characteristics of planar interconnect technologies for power MOSFETs
Dieckerhoff, S.; Kirfo, T.; Wernicke, T.; Kallmayer, C.; Ostmann, A.; Jung, E.; Wunderle, B.; Reichl, H.
Conference Paper
2006Assembly and reliability of ultrathin flip chips on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Electronic textiles
Reichl, Herbert; Kallmayer, Christine; Linz, Torsten
Book Article
2006Ergebnisdarstellung "SHIFT" - Chipintegrationstechnologie
Löher, T.; Kallmayer, C.; Neumann, A.; Pahl, B.; Ostmann, A.; Reichl, H.
Conference Paper
2006Fully integrated EKG shirt based on embroidered electrical interconnections with conductive yarn and miniaturized flexible electronics
Linz, Torsten; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Innovative substrate technologies for new products
Aschenbrenner, R.; Löher, T.; Ostmann, A.; Kallmayer, C.; Scheel, W.; Reichl, H.
Conference Paper
2006Super Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology - Reliability Investigations and Applications
Haberland, J.; Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Chipmodul und Verfahren zur Herstellung eines Chipmoduls
Wegerer, G.; Ansorge, F.; Kallmayer, C.; Rebholz, C.
Patent
2005Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric
Linz, Torsten; Kallmayer, C.
Conference Paper
2005New Interconnection Technologies for the Integration of Electronics on Textile Substrates
Linz, Torsten; Kallmayer, C.
Conference Paper
2005Packaging challenges in miniaturization
Kallmayer, C.; Niedermayer, M.; Guttowski, S.; Reichl, H.
Book Article
2005System integration technologies for smart textiles
Kallmayer, Christine; Linz, Torsten; Aschenbrenner, Rolf; Reichl, Herbert
Journal Article
2005Ultrathin assemblies on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2004Long-time reliability study of soldered flip chips on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Journal Article
2004Ultra thin flip chip interconnects
Haberland, J.; Kallmayer, C.
Journal Article
2004Ultrathin soldered flip chip interconnections on flexible substrates
Pahl, B.; Loeher, T.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2003New assembly technologies for textile transponder systems
Kallmayer, C.; Pisarek, R.; Neudeck, A.; Cichos, S.; Gimpel, S.; Aschenbrenner, R.; Reichlt, H.
Conference Paper
2003Reliability of integrated passive components
Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Fabric-based communication
Kallmayer, C.; Griese, H.
Journal Article
2002Long time reliability of flip chip interconnections on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Packaging technologies for flexible systems
Kallmayer, C.; Bock, K.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Reliability investigations of hard core solder bumps using mechanical palladium bumps and SnPb solder
Oppermann, H.; Kalicki, R.; Anhöck, S.; Kallmayer, C.; Klein, M.; Aschenbrenner, R.; Reichl, H.
Journal Article
2001Lead free alloys for flip chip bumping
Jung, E.; Aschenbrenner, R.; Kallmayer, C.; Coskina, P.; Reichl, H.
Conference Paper
2001Processing design rules for reliable reflowable underfill application
Kallmayer, C.; Becker, K.-F.; Jung, E.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001A thermode bonding process for fine pitch flip chip applications down to 40 micron
Pahl, B.; Nieland, S.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001Verfahren und Vorrichtung zum Erzeugen einer leitfaehigen Struktur auf einem Substrat
Nieland, C.; Kallmayer, C.; Miessner, R.; Aschenbrenner, R.; Ostmann, A.
Patent
2000Advanced flip chip technologies in RF, microwave and MEMS applications
Oppermann, H.H.; Kallmayer, C.; Klein, M.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Lead free solders for area array packaging
Klöser, J.; Kallmayer, C.; Jung, E.; Coskina, P.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Lead free solders for area array packaging
Jung, E.; Klöser, J.; Kallmayer, C.; Coskina, P.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Manufacturing a CSP at wafer level
Simon, J.; Wolf, J.; Kallmayer, C.; Töpper, M.; Reichl, H.
Conference Paper
2000Manufacturing CSP's at waferlevel or flip chip without underfill
Simon, J.; Wolf, J.; Kallmayer, C.
Conference Paper
2000Study on reflowable underfill materials for different flip chip processes
Kallmayer, C.; Becker, K.-F.; Jung, E.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Entwicklung eines CSP auf Waferebene
Simon, J.; Auersperg, J.; Becker, K.-F.; Busse, E.; Heinricht, K.; Kallmayer, C.; Schütt, J.; Töpper, M.; Reichl, H.
Book Article
1999Reliability investigations of flip-chip solder bumps on palladium
Kallmayer, C.; Oppermann, H.; Kalicki, R.; Klein, M.; Anhöck, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Reliability investigations for flip chip on flex using different solder materials
Kallmayer, C.; Oppermann, H.; Anhöck, S.; Azadeh, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1997Evaluation of ORMOCERs for microelectronics applications
Dabek, A.; Popall, M.; Olsowski, B.; Kallmayer, C.; Reichl, H.
Conference Paper
1997A new approach to chip size package using meniscus soldering and FPC-bonding
Kallmayer, C.; Jung, E.; Kasulke, P.; Azadeh, R.; Azdasht, G.; Zakel, E.; Reichl, H.
Conference Paper
1997Untermetallisierung fuer Lotmaterialien
Zakel, E.; Kallmayer, C.; Nave, J.
Patent
1996Verfahren zur Substratfixierung von elektronischen Bauelementen
Oppermann, H.H.; Zakel, E.; Kallmayer, C.; Kloeser, A.
Patent
1995Experimental results on the self-alignment process using Au/Sn metallurgy and the growth of the xi-phase during the reflow
Kallmayer, C.; Oppermann, H.; Klöser, J.; Zakel, E.; Reichl, H.
Conference Paper