Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2015Improving the lifetime of a 3D radio frequency transceiver by finite element simulations
Dijk, M. van; Grams, A.; Kaletta, K.; Tschoban, C.; Wittler, O.; Ndip, I.; Lang, K.-D.
Conference Paper
2014Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Zoschke, K.; Wilke, M.; Wegner, M.; Kaletta, K.; Manier, C.A.; Oppermann, H.; Wietstruck, M.; Tillack, B.; Kaynak, M.; Lang, K.-D.
Conference Paper
2014Mechanical properties of individual composite poly(methyl-methacrylate) -multiwalled carbon nanotubes nanofibers
Grabbert, N.; Wang, B.; Avnon, A.; Zhuo, S.; Datsyuk, V.; Trotsenko, S.; Mackowiak, P.; Kaletta, K.; Lang, K.-D.; Ngo, H.-D.
Conference Paper
2012Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Barth, R.; Knoll, D.; Korndorfer, F.; Scholz, R.; Schulz, K.; Wipf, C.; Tillack, B.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Ulusoy, A.C.; Purtova, T.; Liu, G.; Schumacher, H.
Conference Paper
2012RF-MEMS switch module in a 0.25 µm BiCMOS technology
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Scholz, R.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Elkhouly, M.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Mühlhaus, V.; Liu, G.; Purtova, T.; Ulusoy, A.C.; Schumacher, H.; Tillack, B.
Conference Paper
2011MEMS module integration into SiGe BiCMOS technology for embedded system applications
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Suchodoletz, M.V.; Zoschke, K.; Kaletta, K.; Ehrmann, O.; Leidich, S.; Kurth, S.; Tillack, B.
Conference Paper
2011MEMS module integration into SiGe BiCMOS technology for embedded system applications
Kaynak, M.; Wietstruck, M.; Zhang, W.; Scholz, R.; Drews, J.; Marschmeyer, S.; Knoll, D.; Korndorfer, F.; Schulz, K.; Wipf, C.; Wolansky, D.; Kaletta, K.; Wegner, M.; Ehrmann, O.; Tillack, B.
Conference Paper
2007Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Kaletta, K.; Schmückle, F.J.; Reichl, H.
Journal Article