Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Wafer-level integration of self-aligned high aspect ratio silicon 3D structures using the MACE method with Au, Pd, Pt, Cu, and Ir
Franz, M.; Junghans, R.; Schmitt, P.; Szeghalmi, A.; Schulz, S.E.
Journal Article
2017Temporary wafer bonding - key technology for MEMS devices
Wuensch, D.; Purwin, L.; Büttner, L.; Martinka, R.; Schubert, I.; Junghans, R.; Baum, M.; Wiemer, M.; Otto, T.
Conference Paper
2016Advanced carriers on legacy CMP tools - an intelligent solution for flexible production environments and R&D labs
Franz, M.; Schubert, I.; Junghans, R.; Martinka, R.; Rudolph, C.; Wachsmuth, H.; Trojan, D.; VanDevender, B.; Wrschka, P.; Gottfried, K.
Conference Paper