Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Polymer brushes on hexagonal boron nitride
Sheng, Wenbo; Amin, Ihsan; Neumann, Christof; Dong, Renhao; Zhang, Tao; Wegener, Erik; Chen, Wei-Liang; Förster, Paul; Tran, Hai Quang; Löffler, Markus; Winter, Andreas; Rodriguez, Raul D.; Zschech, Ehrenfried; Ober, Christopher K.; Feng, Xinliang; Turchanin, Andrey; Jordan, Rainer
Journal Article
2018Copper-surface-mediated synthesis of acetylenic carbon-rich nanofibers for active metal-free photocathodes
Zhang, Tao; Hou, Yang; Dzhagan, Volodymyr M.; Liao, Zhongquan; Chai, Guoliang; Löffler, Markus; Olianas, Davide; Milani, Alberto; Xu, Shunqi; Tommasini, Matteo; Zahn, Dietrich R.T.; Zheng, Zhikun; Zschech, Ehrenfried; Jordan, Rainer Andreas; Feng, Xinliang
Journal Article
2018Polymer-based doping control for performance enhancement of wet-processed short-channel CNTFETs
Hartmann, M.; Schubel, R.; Claus, M.; Jordan, R.; Schulz, S.E.; Hermann, S.
Journal Article
2018Polymerization driven monomer passage through monolayer chemical vapour deposition graphene
Zhang, Tao; Liao, Zhongquan; Medrano Sandonas, Leonardo; Dianat, Arezoo; Liu, Xiaoling; Xiao, Peng; Amin, Ihsan; Gutierrez, Rafael; Chen, Tao; Zschech, Ehrenfried; Cuniberti, Gianaurelio; Jordan, Rainer
Journal Article
2017In-Situ Stretching Patterned Graphene Nanoribbons in the Transmission Electron Microscope
Liao, Zhongquan; Sandonas, Leonardo Medrano; Zhang, Tao; Gall, Martin; Dianat, Arezoo; Gutierrez, Rafael; Mühle, Uwe; Gluch, Jürgen; Jordan, Rainer; Cuniberti, Gianaurelio; Zschech, Ehrenfried
Journal Article
2016Enhancement of carbon nanotube FET performance via direct synthesis of poly (sodium 4-styrenesulfonate) in the transistor channel
Toader, M.; Schubel, R.; Hartmann, M.; Scharfenberg, L.; Jordan, R.; Mertig, M.; Schulz, S.E.; Gessner, T.; Hermann, S.
Journal Article
2016Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications
Kroehnert, Kevin; Glaw, V.; Engelmann, G.; Jordan, R.; Samulewicz, K.; Hauck, K.; Cronin, R.; Robertson, M.; Ehrmann, O.; Lang, K.-D.
Conference Paper
2015Large Area LED Package
Goullon, L.; Jordan, R.; Braun, T.; Bauer, J.; Becker, F.; Hutter, M.; Schneider-Ramelow, M.; Lang, K.D.
Conference Paper
2015Lateral damage in graphene carved by high energy focused gallium ion beams
Liao, Zhongquan; Zhang, Tao; Gall, Martin; Dianat, Arezoo; Rosenkranz, Rüdiger; Jordan, Rainer; Cuniberti, Gianaurelio; Zschech, Ehrenfried
Journal Article
2015System und Verfahren zur bedarfsgerechten Zuführung von Beleuchtungsenergie an Pflanzen
Jordan, Rafael
Patent
2014Advanced packaging methods for high-power LED modules
Jordan, R.C.; Weber, C.; Ehrhardt, C.; Wilke, M.
Conference Paper
2014Human papillomavirus DNA and host gene mRNA biomarker detection in a "micro total analysis aystem" (microTAS) device to aid diagnosis of cervical intraepithelial neoplasia
Keegan, H.; Pilkington, L.; Jordan, R.; Mozes, J.; Varga, N.; Benczik, M.; Riegger, L.; Koltay, P.; Sauer, U.; Preininger, C.; Koger, B.; Brandenburg, A.; Müller, W.; Faltin, B.; Roth, G.; Martin, C.; Jeney, C.; O'Leary, J.J.
Abstract
2014Human Papillomavirus DNA and Host Gene mRNA Biomarker Detection in a "Micro Total Analysis System" (microTAS) Device to Aid Diagnosis of Cervical Intraepithelial Neoplasia
Keegan, H.; Pilkington, L.; Jordan, R.; Mozes, J.; Varga, N.; Benczik, M.; Riegger, L.; Koltay, P.; Sauer, U.; Preininger, C.; Koger, B.; Brandenburg, A.; Muller, W.; Faltin, B.; Roth, C.; Martin, C.; Jeney, C.; O'Leary, J.J.
Abstract
2014On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Journal Article, Conference Paper
2013Active or passive fiber-chip-alignment: Approaches to efficient solutions
Böttger, G.; Schröder, H.; Jordan, R.
Conference Paper
2013On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Conference Paper
2013Panel level packaging for LED lighting
Braun, T.; Bauer, J.; Becker, K.-F.; Kahle, R.; Bader, V.; Voges, S.; Jordan, R.; Aschenbrenner, R.; Lang, K.D.
Conference Paper
2012Challenges in LED packaging and green lighting
Jordan, R.; Hutter, M.; Oppermann, H.
Conference Paper
2012Mass flows of selected target materials in LED products
Marwede, M.; Chancerel, P.; Deubzer, O.; Jordan, R.; Nissen, N.F.; Lang, K.-D.
Conference Paper
2011Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications
Fritzsch, T.; Jordan, R.; Oppermann, H.; Ehrmann, O.; Töpper, M.; Baumgartner, T.; Lang, K.-D.
Journal Article
2011Nanostructured polymer brushes and protein density gradients on diamond by carbon templating
Hutter, N.A.; Steenackers, M.; Reitinger, A.; Williams, O.A.; Garrido, J.A.; Jordan, R.
Journal Article
2011Verfahren zur Herstellung von mechanischen Anschlägen zur Selbstjustage und Vorrichtung mit Anschlägen zur Selbstjustage
Oppermann, Hermann; Jordan, Rafael; Glaw, Veronika; Mukhopadhyay, Biswajit
Patent
2010Microstructured poly(2-oxazoline) bottle-brush brushes on nanocrystalline diamond
Hutter, N.A.; Reitinger, A.; Zhang, N.; Steenackers, M.; Williams, O.A.; Garrido, J.A.; Jordan, R.
Journal Article
2009VCSEL-based miniature laser-self-mixing interferometer with integrated optical and electronic components
Pruijmboom, A.; Booij, S.; Schemmann, M.; Werner, K.; Hoeven, P.; Limpt, H. van; Intemann, S.; Jordan, R.; Fritzsch, T.; Oppermann, H.; Barge, M.
Conference Paper
2008Effizienter Wellenlaengenkonverter und Leuchtvorrichtung mit einem effizienten Wellenlaengenkonverter
Jordan, R.; Oppermann, H.
Patent
2007Converter film technology for homogeneous white light
Jordan, R.C.; Bauer, J.; Oppermann, H.
Conference Paper
2007ECD wafer bumping and packaging for pixel detector applications
Fritzsch, T.; Jordan, R.; Ehrmann, O.; Reichl, H.
Conference Paper
2007Verfahren zum Herstellen einer Mikrostruktur oder Nanostruktur und mit Mikrostruktur oder Nanostruktur versehenes Substrat
Oppermann, H.; Wolf, J.; Jordan, R.; Schmidt, R.; Engelmann, G.
Patent
2006Experience in fabrication of multichip-modules for the ATLAS pixel detector
Fritzsch, T.; Jordan, R.; Töpper, M.; Kuna, I.; Lutz, M.; Defo Kamga, F.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper, Journal Article
2006Optimized heat transfer and homogeneous color converting for ultra high brightness LED package
Jordan, R.; Bauer, J.; Oppermann, H.
Conference Paper
2006Packaging of radiation and particle detectors
Fritzsch, T.; Jordan, R.; Glaw, V.; Töpper, M.; Dietrich, L.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.; Wermes, N.
Conference Paper
2006Stackable thin film multi layer substrates with integrated passive components
Zoschke, K.; Buschick, K.; Scherpinski, K.; Fischer, T.; Wolf, J.; Ehrmann, O.; Jordan, R.; Reichl, H.; Schmuckle, F.J.
Conference Paper
2006Thin film substrate technology and FC interconnection for very high frequency applications
Töpper, M.; Rosin, T.; Fritzsch, T.; Jordan, R.; Mekonnen, G.; Sakkas, C.; Kunkel, R.; Scherpinski, K.; Schmidt, D.; Oppermann, H.; Dietrich, L.; Beling, A.; Eckhardt, T.; Bach, H.-G.; Reichl, H.
Conference Paper
2005Development of a scalelable interconnection technology for nano packaging
Becker, K.-F.; Löher, T.; Pahl, B.; Wittler, O.; Jordan, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Fabrication of Multichip-Modules for Pixel Detectors
Fritzsch, T.; Jordan, R.; Töpper, M.; Röder, J.; Kuna, I.; Lutz, M.; Wolf, M.J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper
2005Investigation of Different Flip Chip Assembly Processes Using Au/Sn Microbumps
Hutter, M.; Thomas, T.; Jordan, R.; Engelmann, G.; Oppermann, H.; Reichl, H.; Wang, Y.; Howlader, M.; Higurashi, E.; Suga, T.
Conference Paper
2005Technology Requirements for Chip-On-Chip Packaging Solution
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H.
Conference Paper
2005Technology requirements for chip-on-chip packaging solutions
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H.
Conference Paper
2004Flip Chip Assembly Using AuSn Solder Bumps for GaAs Applications
Oppermann, H.; Hutter, M.; Jordan, R.; Klein, M.; Engelmann, G.; Wolf, J.; Reichl, H.
Conference Paper