Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2015Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems
Baranski, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Jia, C.P.; Frömel, J.; Wiemer, M.
Journal Article
2014Wafer-level fabrication of microcube-typed beam-splitters by saw-dicing of glass substrate
Baranski, M.; Bargiel, S.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M.
Journal Article
20133D micro-optical lens scanner made by multi-wafer bonding technology
Bargiel, S.; Gorecki, C.; Baranski, M.; Passilly, N.; Wiemer, M.; Jia, C.; Frömel, J.
Conference Paper
2013Wafer-level fabricated micro beam splitter based on 45-degree saw dicing of glass substrate
Bargiel, S.; Baranski, M.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M.
Conference Paper
2012A hierarchic bonding procedure for the assembly of micro confocal microscope
Jia, C.; Frömel, J.; Wiemer, M.; Gessner, T.; Bargiel, S.; Passilly, N.; Baraski, M.; Gorecki, C.
Conference Paper
2012Vertical integration technologies for optical transmissive 3-D microscanner based on glass microlenses
Bargiel, S.; Jia, C.; Baranski, M.; Frömel, J.; Passilly, N.; Gorecki, C.; Wiemer, M.
Journal Article, Conference Paper
2011FEM simulation and its application in MEMS design
Jia, C.; Reuter, D.; Wen, Z.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2011Investigations of thermocompression bonding with thin metal layers
Froemel, J.; Baum, M.; Wiemer, M.; Roscher, F.; Haubold, M.; Jia, C.; Gessner, T.
Conference Paper
2011Metal thermo compression bonding at wafer level and its capabilities for 3D integration
Baum, M.; Roscher, F.; Froemel, J.; Jia, C.; Rank, H.; Hausner, R.; Reichenbach, R.; Wiemer, M.; Gessner, T.
Conference Paper
2010Eutectic wafer bonding for 3D integration
Baum, M.; Jia, C.; Haubold, M.; Wiemer, M.; Schneider, A.; Rank, H.; Trautmann, A.; Gessner, T.
Conference Paper
2010A method for the fabrication of extra-thin silicon substrates
Jia, C.; Hiller, K.; Wiemer, M.; Reuter, D.; Gessner, T.
Conference Paper
2009New bonding technologies for MEMS
Wiemer, M.; Frömel, J.; Jia, C.; Gessner, T.
Book Article
2009A novel method for the fabrication of deep-submicron structure
Jia, C.; Wiemer, M.; Grunert, J.; Otto, T.; Gessner, T.
Conference Paper
2009Two lithography-based technologies for the fabrication of submicron to deep-submicron structures
Jia, C.; Wiemer, M.; Werner, T.; Otto, T.
Conference Paper
2008Developments trends in the field of wafer bonding technologies
Wiemer, M.; Haubold, M.; Jia, C.; Wünsch, D.; Frömel, J.; Gessner, T.
Conference Paper
2008Fabrication of a low-frequency ultrasonic transducer
Jia, C.; Wiemer, M.; Hiller, K.; Otto, T.; Gessner, T.
Conference Paper
2008Herstellung von Nanostrukturen und ihre Anwendung für Fügeverbindungen
Jia, C.; Frömel, J.; Wiemer, M.
Journal Article
2007Bulksiliziummikromechanik, Entwicklungstendenzen und Beispiele
Wiemer, M.; Frömel, J.; Hiller, K.; Reuter, D.; Jia, C.
Conference Paper
2007Design and fabrication of a micromechanical vertical resonator
Jia, C.; Wiemer, M.; Kurth, S.; Otto, T.; Gessner, T.
Conference Paper
2007Low-Temperature Ti-Si bonding and its application in micro-device fabrication
Jia, C.; Hiller, K.; Wiemer, M.; Otto, T.; Gessner, T.
Conference Paper
2007Wafer bonding with BCB and SU-8 for MEMS packaging
Wiemer, M.; Jia, C.; Toepper, M.; Hauck, K.
Conference Paper
2006Direct bonding with on-wafer metal interconnections
Jia, C.; Wiemer, M.; Gessner, T.
Conference Paper, Journal Article
2005Fabrication and characterization of a micro-machined ultrasonic transducer
Jia, C.; Wiemer, M.; Zichner, N.; Otto, T.; Gessner, T.
Conference Paper
2005Fabrication of embedded micro-channels by intended under-etching and trench filling
Jia, Chenping; Wiemer, M.; Müller, R.; Otto, T.; Geßner, T.
Conference Paper
2005Mikromechanischer Ultraschallwandler aus Silizium
Jia, C.
Dissertation
2003Bonding and contacting of MEMS-structures on wafer level
Wiemer, M.; Frömel, J.; Jia, C.; Gessner, T.
Conference Paper
2002Manufacture of specific structure of aluminum-doped zinc oxide films by patterning the substrate surface
Jiang, X.; Jia, C.L.; Szyszka, B.
Journal Article
2002Structure and defects of vapor-phase-grown diamond nanocrystals
Jiang, X.; Jia, C.L.
Journal Article
2001Epitaxy of diamond on Si(100) and surface-roughening-induced crystal misorientation
Jiang, X.; Jia, C.L.; Szameitat, M.; Rickers, C.
Journal Article
2000Direct local epitaxy of diamond on Si(100) and surface-roughening-induced crystal misorientation
Jiang, X.; Jia, C.L.
Journal Article
2000High quality heteroepitaxial diamond films on silicon
Jiang, X.; Fryda, M.; Jia, C.L.
Journal Article
1998Coalescence and overgrowth of diamond grains for improved heteroepitaxy on silicon (001)
Jiang, X.; Schiffmann, K.I.; Klages, C.-P.; Wittorf, D.; Jia, C.L.; Urban, K.; Jager, W.
Journal Article
1996The coalescence of (001) diamond grains heteroepitaxially grown on (001) silicon
Jiang, X.; Jia, C.L.
Journal Article
1995Diamond epitaxy on (001) silicon. An interface investigation
Jiang, P.; Jia, C.L.
Journal Article
1995Heteroepitaxial diamond films on silicon (001): Interface structure and crystallographic relations between film and substrate
Jia, C.L.; Urban, K.; Jiang, X.
Journal Article
1995Studies of heteroepitaxial nucleation and growth of diamond on silicon
Jiang, X.; Paul, M.; Klages, C.-P.; Jia, C.L.
Conference Paper