Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Aufbaukonzept für HF-Systeme
Ihle, Martin; Ziesche, Steffen; Zech, Christian; Baumann, Benjamin
Patent
2019Functional Printing of MMIC-Interconnects on LTCC Packages for sub-THz applications
Ihle, Martin; Ziesche, Steffen; Zech, Christian; Baumann, Benjamin
Conference Paper
2018Compact LTCC Packaging and Printing Technologies for Sub-THz Modules
Ihle, Martin; Ziesche, Steffen; Zech, Christian; Baumann, Benjamin
Conference Paper
2018Low temperature co-fired ceramics technology for active eddy current turbocharger speed sensors
Ihle, Martin; Ziesche, Steffen; Gierth, Paul; Tuor, Andreas; Tigelaar, Jonathan; Hirsch, Oliver
Journal Article, Conference Paper
2018Mikrofluidisches System zur Kultivierung von oder der Analyse an lebenden Zellen oder Biomolekülen sowie ein Verfahren zu seiner Herstellung
Busek, Mathias; Feller, Claudia; Grünzner, Stefan; Ihle, Martin; Partsch, Uwe
Patent
2016Ceramic substrate technology for wafer level packaging of MEMS
Ziesche, Steffen; Ihle, Martin; Gabler, Felix; Roscher, Frank
Conference Paper
2016Characterization of anodic bondable LTCC for wafer-level packaging
Hu, Xiaodong; Bäuscher, Manuel; MacKowiak, Piotr; Zhang, Yucheng; Hoelck, Ole; Walter, Hans; Ihle, Martin; Ziesche, Steffen; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klausdieter; Ngo, Haduong
Conference Paper
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016LTCC - packaging of a laser optical system for harsh environments
Ihle, Martin; Ziesche, Steffen; Beckert, Erik; Hornaff, Marcel
Conference Paper
2016Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments
Gabler, Felix; Roscher, Frank; Döring, Ralf; Otto, Alexander; Ziesche, Steffen; Ihle, Martin; Celik, Yusuf; Dietz, Dorothee; Goehlich, Andreas; Kappert, Holger; Vogt, Holger; Naumann, Falk; Geßner, Thomas
Conference Paper
2014Aerosol jet printing of two component thick film resistors on LTCC
Swiecinski, K.; Ihle, Martin; Jurk, Robert; Dietzen, E.; Partsch, Uwe; Eberstein, Markus
Conference Paper
2014Development of a robust, ceramic MEMS-package for hermetically sealed and highly shock-resistant SMD-devices
Goldberg, Adrian; Ihle, Martin; Ziesche, S.; Külls, Robert
Conference Paper
2014Synthesis of nano metal particles for low sintering conductive inks
Jurk, Robert; Mosch, Sindy; Fritsch, Marco; Ihle, Martin
Conference Paper
2013Entwicklung eines robusten, keramischen MEMS - Packaging als hermetisch dichtes und hoch-schockfestes SMD-Bauteil
Goldberg, Adrian; Ihle, Martin; Ziesche, Steffen; Külls, Robert
Conference Paper
2013Reliable wafer-level-bonding method for MEMS packaging using LTCC interposers
Ihle, Martin; Ziesche, Steffen; Roscher, Frank; Capraro, Beate; Partsch, Uwe
Conference Paper