Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021A high temperature SOI-CMOS chipset focusing sensor electronics for operating temperatures up to 300 °C
Kappert, Holger; Braun, Sebastian; Kordas, Norbert; Kosfeld, Andre; Utz, Alexander; Weber, Constanze; Rämer, Olaf; Spanier, Malte; Ihle, Martin; Ziesche, Steffen; Kokozinski, Rainer
Journal Article
2020Approach for a Digital Operator Support System for Manual Machine Setup
Maier, Florian; Ihle, Martin; Paschke, Tina; Valea, Vlad
Conference Paper
2020Aufbaukonzept für HF-Systeme
Ihle, Martin; Ziesche, Steffen; Zech, Christian; Baumann, Benjamin
Patent
2019Functional Printing of MMIC-Interconnects on LTCC Packages for sub-THz applications
Ihle, Martin; Ziesche, Steffen; Zech, Christian; Baumann, Benjamin
Conference Paper
2018Compact LTCC Packaging and Printing Technologies for Sub-THz Modules
Ihle, Martin; Ziesche, Steffen; Zech, Christian; Baumann, Benjamin
Conference Paper
2018Low temperature co-fired ceramics technology for active eddy current turbocharger speed sensors
Ihle, Martin; Ziesche, Steffen; Gierth, Paul; Tuor, Andreas; Tigelaar, Jonathan; Hirsch, Oliver
Journal Article
2018Mikrofluidisches System zur Kultivierung von oder der Analyse an lebenden Zellen oder Biomolekülen sowie ein Verfahren zu seiner Herstellung
Busek, Mathias; Feller, Claudia; Grünzner, Stefan; Ihle, Martin; Partsch, Uwe
Patent
2018XplOit: An ontology-based data integration platform supporting the development of predictive models for personalized medicine
Weiler, G.; Schwarz, U.; Rauch, J.; Rohm, K.; Lehr, T.; Theobald, S.; Kiefer, S.; Götz, K.; Och, K.; Pfeifer, N.; Handl, L.; Smola, S.; Ihle, M.; Turki, A.T.; Beelen, D.W.; Rissland, J.; Bittenbring, J.; Graf, N.
Conference Paper
2016Ceramic substrate technology for wafer level packaging of MEMS
Ziesche, Steffen; Ihle, Martin; Gabler, Felix; Roscher, Frank
Conference Paper
2016Characterization of anodic bondable LTCC for wafer-level packaging
Hu, Xiaodong; Bäuscher, Manuel; MacKowiak, Piotr; Zhang, Yucheng; Hoelck, Ole; Walter, Hans; Ihle, Martin; Ziesche, Steffen; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klausdieter; Ngo, Haduong
Conference Paper
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016LTCC - packaging of a laser optical system for harsh environments
Ihle, Martin; Ziesche, Steffen; Beckert, Erik; Hornaff, Marcel
Conference Paper
2016Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments
Gabler, Felix; Roscher, Frank; Döring, Ralf; Otto, Alexander; Ziesche, Steffen; Ihle, Martin; Celik, Yusuf; Dietz, Dorothee; Goehlich, Andreas; Kappert, Holger; Vogt, Holger; Naumann, Falk; Geßner, Thomas
Conference Paper
2015Substrate integrated MM-wave antenna utilizing metalized cavity walls
Balcells-Ventura, J.; Leiss, J.; Uhlig, P.; Ihle, M.; Ziesche, S.; Bisognin, A.; Luxey, C.
Conference Paper
2014Aerosol jet printing of two component thick film resistors on LTCC
Swiecinski, K.; Ihle, Martin; Jurk, Robert; Dietzen, E.; Partsch, Uwe; Eberstein, Markus
Conference Paper
2014Development of a robust, ceramic MEMS-package for hermetically sealed and highly shock-resistant SMD-devices
Goldberg, Adrian; Ihle, Martin; Ziesche, S.; Külls, Robert
Conference Paper
2014Synthesis of nano metal particles for low sintering conductive inks
Jurk, Robert; Mosch, Sindy; Fritsch, Marco; Ihle, Martin
Conference Paper
2013Aerosol jet printing of two component thick film resistors on LTCC
Swiecinski, K.; Ihle, M.; Jurk, R.; Dietzen, E.; Partsch, U.; Eberstein, M.
Journal Article
2013Aerosol-printed horn-shaped antenna on LTCC
Balcells-Ventura, J.; Leiss, J.; Ihle, M.; Ziesche, S.; Uhlig, P.
Conference Paper
2013Entwicklung eines robusten, keramischen MEMS - Packaging als hermetisch dichtes und hoch-schockfestes SMD-Bauteil
Goldberg, Adrian; Ihle, Martin; Ziesche, Steffen; Külls, Robert
Conference Paper
2013Experience made using public cloud infrastructure to analyse clinical patient data
Ziegler, Wolfgang; Ihle, Matthias; Claus, Steffen; Senger, Philipp; Mohebbi, Pooya; Khan, Zakir; Fluck, Juliane; Griebel, Lena; Sedlmayr, Martin; Berger, Florian; Laufer, Julian; Chatziastros, Astros; Drepper, Johannes
Conference Paper
2013A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers
Roschner, F.; Otto, A.; Döring, R.; Ihle, M.; Ziesche, S.; Rzepka, S.; Wiemer, M.
Conference Paper
2013Reliable wafer-level-bonding method for MEMS packaging using LTCC interposers
Ihle, Martin; Ziesche, Steffen; Roscher, Frank; Capraro, Beate; Partsch, Uwe
Conference Paper
2012Aerosol printing of high resolution films for LTCC-multilayer components
Ihle, M.; Partsch, U.; Mosch, S.; Goldberg, A.
Conference Paper
2012Aerosol printing of high resolution films for LTCC-multilayer components
Ihle, M.; Partsch, U.; Mosch, S.; Goldberg, A.
Journal Article
2012High current conductors in LTCC
Ziesche, S.; Ihle, M.; Eberstein, M.
Conference Paper
2012Novel high-g accelerometer geometry requiring 90 degree contacting techniques
Külls, R.; Nau, S.; Salk, M.; Thoma, K.; Ihle, M.; Goldberg, A.
Conference Paper
2012Silver processing in thick film technology for power electronics
Eberstein, M.; Feller, C.; Seuthe, T.; Ihle, M.; Ziesche, S.; Gora, F.
Conference Paper
2012Towards highly conductive silver pastes for LTCC power electronics
Eberstein, M.; Kretzschmar, C.; Seuthe, T.; Marcinkowski, M.; Ihle, M.; Ziesche, S.; Partsch, U.; Gora, F.
Conference Paper
2011Aerosol printed co- and post-fired functional films for LTCC-multilayer components
Partsch, U.; Mosch, S.; Ihle, M.
Conference Paper
2011Novel technology options for multilayer-based ceramic microsystems
Partsch, U.; Goldberg, A.; Ihle, M.; Hagen, G.; Arndt, D.
Conference Paper
2010Aerosol printed conductors for miniaturized LTCC packaging
Partsch, U.; Mosch, S.; Ihle, M.
Conference Paper