Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Metallic Interconnection Technologies for High Power Vertical Cavity Surface Emitting Lasers Modules
Weber, Constanze; Goullon, Lena; Hutter, Matthias; Schneider-Ramelow, Martin
Book Article
2019Visual-Interactive Preprocessing of Multivariate Time Series Data
Bernard, Jürgen; Hutter, Marco; Reinemuth, Heiko; Pfeifer, Hendrik; Bors, Christian; Kohlhammer, Jörn
Journal Article, Conference Paper
2018Die attach for high power VCSEL array systems
Goullon, L.; Weber, C.; Hutter, M.; Schneider-Ramelow, M.
Conference Paper
2018Comparing visual-interactive labeling with active learning: An experimental study
Bernard, Jürgen; Hutter, Marco; Zeppelzauer, Matthias; Fellner, Dieter W.; Sedlmair, Michael
Journal Article
2018Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz
Curran, B.; Reyes, J.; Tschoban, C.; Höfer, J.; Grams, A.; Wüst, F.; Hutter, M.; Leiß, J.; Martínez-Vázquez, M.; Baggen, R.; Ndip, I.; Lang, K.-D.
Journal Article
2018Investigation of high pressure Ag sintered joints manufactured with different tools
Kripfgans, J.; Weber, C.; Hutter, M.
Conference Paper
2018Parameter driven monitoring for a flip-chip LED module under power cycling condition
Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Hutter, M.; Defregger, S.; Kraker, E.
Journal Article
2018Thermal transient measurement and modelling of a power cycled flip-chip LED module
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rosc, J.; Hammer, R.; Goullon, L.; Hutter, M.; Schrank, F.; Hörth, S.; Kraker, E.
Journal Article
2017Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation
Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Defregger, S.; Kraker, E.
Journal Article
2017Study on the temperature-dependent thermal resistance matrix of a multi-chip LED-matrix
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rose, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Kraker, E.
Conference Paper
2017Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation
Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E.
Journal Article
2016Combination of experimental and simulation methods for analysis of sintered Ag joints for high temperature applications
Weber, Constanze; Walter, Hans; Dijk, Marius van; Hutter, Matthias; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2016Comparison of different technologies for the die attach of power semiconductor devices conduting active power cycling
Hutter, Matthias; Weber, Constanze; Ehrhardt, Christian; Lang, Klaus-Dieter
Conference Paper
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016Investigation of the temperature-dependent heat path of an LED module by thermal simulation and design of experiments
Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E.
Conference Paper
2016Solder process for fluxless solder paste applications
Hanss, A.; Hutter, M.; Trodler, J.; Elger, G.
Conference Paper
2015Active power cycling results using copper tin TLPB joints as new die-attach technology
Ehrhardt, Christian; Hutter, Matthias; Weber, Constanze; Lang, Klaus-Dieter
Conference Paper
2015Dependency of the porosity and the layer thickness on the reliability of Ag sintered joints during active power cycling
Weber, Constanze; Hutter, Matthias; Schmitz, Stefan; Lang, Klaus-Dieter
Conference Paper
2015Explorative analysis of 2D color maps
Steiger, Martin; Bernard, Jürgen; Thum, Simon; Mittelstädt, Sebastian; Hutter, Marco; Keim, Daniel A.; Kohlhammer, Jörn
Conference Paper
2015Failure analysis of Ag sintered joints after power cycling under harsh temperature conditions from + 30 deg C up to + 180 deg C
Weber, C.; Hutter, M.; Ehrhardt, C.; Lang, K.-D.
Conference Paper
2015Grenzen und Möglichkeiten der Weichlotverbindungen - Betrachtungen von Qualität und Zuverlässigkeit
Hutter, M.; Ehrhardt, C.
Conference Paper
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects
Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Conference Paper
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Conference Paper
2015Large Area LED Package
Goullon, L.; Jordan, R.; Braun, T.; Bauer, J.; Becker, F.; Hutter, M.; Schneider-Ramelow, M.; Lang, K.D.
Conference Paper
2015Verbindungstechnologien für erhöhte Einsatztemperaturen mikroelektronischer Anwendungen
Ehrhardt, Christian; Hutter, M.; Weber, C.; Goullon, L.; Oppermann, H.
Book Article
2015The visual exploration of aggregate similarity for multi-dimensional clustering
Twellmeyer, James; Hutter, Marco; Behrisch, Michael; Kohlhammer, Jörn; Schreck, Tobias
Conference Paper
2014Exploring simulation in sensor network models
Steiger, Martin; Hutter, Marco; Schader, Philipp; Kohlhammer, Jörn; Kuijper, Arjan
Conference Paper
2014High temperature electronics for LED-lighting architectures (European SEEL Project: Solution for energy efficient lighting)
Habenicht, S.; Funke, H.J.; Gruber, D.; Oelgeschläger, D.; Schumacher, O.; Gehn, R.; Walczyk, S.; Mavinkurve, A.; Reiners, T.; Fiederling, R.; Vogl, M.; Schug, J.; Willwohl, H.; Blandin, J.; Hutter, M.; Ehrhardt, C.; Oppermann, H.
Journal Article
2014A lead free joining technology for high temperature interconnects using Transient Liquid Phase Soldering (TLPS)
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2014Measuring context relevance for adaptive semantics visualizations
Nazemi, Kawa; Kuijper, Arjan; Hutter, Marco; Kohlhammer, Jörn; Fellner, Dieter W.
Conference Paper
2014Mesh partitioning for parallel garment simulation
Hutter, Marco; Knuth, Martin; Kuijper, Arjan
Conference Paper
2014Microstructural and mechanical analyses of Ag sintered joints
Weber, Constanze; Hutter, Matthias; Oppermann, Hermann; Lang, Klaus-Dieter
Conference Paper
2014On double sided cooling
Feix, G.; Hutter, M.; Hoene, E.; Lang, K.-D.
Conference Paper
2014Standard-Reflowlöten für Anwendungen bis 300°C - ein Widerspruch?
Fix, A.; Herberholz, T.; Guyenot, M.; Nowottnick, M.; Novikov, A.; Schulze, J.; Trodler, J.; Hutter, M.; Ehrhardt, C.; Dudek, R.; Wilke, K.; Strogies, J.; Seiler, B.; Kreyßig, K.; Diehm, R.; Liedke, V.; Zerna, T.; Klemm, A.
Conference Paper
2014Thermo-mechanical simulation of sintered Ag die attach for high temperature applications
Moreira de Sousa, Micaela; Dijk, Marius van; Walter, Hans; Weber, Constanze; Hutter, Matthias; Oppermann, Hermann; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2014Towards a user-defined visual-interactive definition of similarity functions for mixed data
Bernard, Jürgen; Hutter, Marco; Sessler, David; Schreck, Tobias; Behrisch, Michael; Kohlhammer, Jörn
Conference Paper
2013The european SEEL (solutions for energy efficient lighting) project High temperature electronics for LED-lighting architectures
Habenicht, S.; Funke, H.J.; Gruber, D.; Oelgeschlager, D.; Schumacher, O.; Gehn, R.; Walczyk, S.; Mavinkurve, A.; Reiners, T.; Fiederling, R.; Vogl, M.; Schug, J.; Willwohl, H.; Blandin, J.; Hutter, M.; Ehrhardt, C.; Oppermann, H.
Conference Paper
2013Transient Liquid Phase Soldering-An emerging joining technique for power electronic devices
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2012Au/Sn Solder
Oppermann, H.; Hutter, M.
Book Article
2012Challenges in LED packaging and green lighting
Jordan, R.; Hutter, M.; Oppermann, H.
Conference Paper
2012Combining linked matrix visualizations with multi-dimensional clustering to detect cybercrime
Davey, James; Hutter, Marco; May, Thorsten; Kohlhammer, Jörn
Poster
2012Technologies and Trends to Improve Power Electronic Packaging
Schneider-Ramelow, Martin; Hutter, Matthias; Oppermann, Hermann; Göhre, Jens-Martin; Schmitz, Stefan; Hoene, Eckart; Lang, Klaus-Dieter
Conference Paper
2012Transient liquid phase soldering for lead-free joining of power electronic modules in high temperature applications
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2011Entwicklungsrichtungen für das Leistungshalbleiter Packaging
Hoene, Eckart; Schneider-Ramelow, Martin; Feix, Gudrun; Ostmann, Andreas; Becker, Karl-Friedrich; Hutter, Matthias
Journal Article
2011Fortschritte beim Aufbau von Leistungshalbleitern
Hutter, Matthias; Göhre, Jens-Martin; Hoene, Eckart; Schneider-Ramelow, Martin; Oppermann, Hermann
Journal Article
2011Immersion silver as universal surface finish for COB technology
Göhre, J.; Schneider-Ramelow, M.; Becker, K.-F.; Hutter, M.
Conference Paper
2011Paste zum Verbinden von Bauteilen elektronischer Leistungsmodule, System und Verfahren zum Auftragen der Paste
Oppermann, H.; Hutter, M.; Ehrhardt, C.
Patent
2011Reliability investigation of large GaAs pixel detectors flip-chip-bonded on Si readout chips
Klein, M.; Hutter, M.; Engelmann, G.; Fritzsch, T.; Oppermann, H.; Dietrich, L.; Wolf, M.J.; Brämer, B.; Dudek, R.; Reichl, H.
Journal Article
2010Fe-basierte lötbare Oberflächen mit reduziertem Phasenwachstum für erhöhte Betriebstemperaturen
Schmidt, Ralf; Rauschenbach, S.; Hutter, M.; Teichmann, P.
Conference Paper
2010Immersion Ag als Au-drahtbondbares und COB-geeignetes Universal-Finish für die multi-funktionale Leiterplatte
Schneider-Ramelow, M.; Göhre, J.-M.; Becker, K.-F.; Hutter, M.
Journal Article, Conference Paper
2010Solidification and wetting behaviour of SnAgCu soldier alloyed by reactive metal organic flux
Zerrer, P.; Fix, A.; Hutter, M.; Reichl, H.
Journal Article
2009Assessment of thermal and process properties of lead-free solder pastes for high reliable electronic devices
Bertels, L.; Poech, M.; Hutter, M.; Thomas, T.
Conference Paper
2009Effects of additional elements (Fe, Co, Al) on SnAgCu solder joints
Hutter, M.; Schmidt, R.; Zerrer, P.; Rauschenbach, S.; Wittke, K.; Scheel, W.; Reichl, H.
Conference Paper
2009Stability of AuSn eutectic solder cap on Au socket during reflow
Yu, D.; Oppermann, H.; Kleff, J.; Hutter, M.
Journal Article
2009Untersuchung zu den themischen und prozesstechnischen Eigenschaften von Flussmitteln für bleifreie Lotlegierungen auf hochzuverlässigen Baugruppen
Bertels, L.; Poech, M.-H.; Hutter, M.; Thomas, T.
Conference Paper
2009Verbindungstechnik höchster Zuverlässigkeit für optoelektronische Komponenten
Hutter, M.
Dissertation
2009Zusammenhänge zwischen den thermischen und prozesstechnischen Eigenschaften von Flussmitteln und der Porenbildung in Lötstellen
Hutter, M.; Thomas, T.; Bertels, L.; Poech, M.
Journal Article
2008Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chips
Klein, M.; Hutter, M.; Oppermann, H.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R.; Reichl, H.
Conference Paper
2008Entwicklung intuitiver Navigationsmöglichkeiten für eine Virtual Prototyping Umgebung
Lorek, Jens
: Hutter, Marco (Betreuer)
Bachelor Thesis
2008Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow
Yu, D.Q.; Oppermann, H.; Kleff, J.; Hutter, M.
Journal Article
2008Lead free solder joints: reliability and metallurgical reactions
Hutter, M.; Schmidt, R.; Pape, U.; Oppermann, H.; Reichl, H.
Conference Paper
2008Lotmaterial, enthaltend ein Metallstearat sowie Verwendung von Metallstearaten in Lotmaterialien
Diehm, R.; Ludeck, W.; Prihodovsky, A.; Schmitt, W.; Trageser, H.; Fix, A.; Hutter, M.; Pape, U.; Zerrer, P.; Meier, H.; Müller, B.; Wittreich, U.; Wormuth, D.
Patent
2008NanoFlux - Doping of Solder Pastes
Zerrer, P.; Fix, A.; Hutter, M.; Pape, U.
Conference Paper
2008Verfahren zur Herstellung einer Lotmetallisierung
Hutter, M.; Engelmann, G.; Töpper, M.; Oppermann, H.
Patent
2007Lotmetallisierung
Hutter, M.; Oppermann, H.; Rafael, J.; Thomas, T.
Patent
2007Low-temperature process of fine-pitch Au-Sn bump bonding in ambient air
Wang, Y.H.; Nishida, K.; Hutter, M.; Kimura, T.; Suga, T.
Journal Article
2007Optimized continuous collision detection for deformable triangle meshes
Hutter, Marco; Fuhrmann, Arnulph
Conference Paper
2007Reliability Investigation of Large GaAs Pixel Detectors Flip Chip Bonded on Si Readout Chips
Klein, M.; Oppermann, H.; Hutter, M.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R; Reichl, H.
Conference Paper
2006Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
Töpper, M.; Klein, M.; Buschick, K.; Glaw, V.; Orth, K.; Ehrmann, O.; Hutter, M.; Oppermann, H.; Becker, K.-F.; Braun, T.; Ebling, F.; Reichl, H.; Kim, S.; Tathireddy, P.; Chakravarty, S.; Solzbacher, F.
Conference Paper
2006Precise flip chip assembly using electroplated AuSn20 and SnAg3.5 solder
Hutter, M.; Oppermann, H.; Engelmann, G.; Dietrich, L.; Reichl, H.
Conference Paper
2006RoHS after July 2006
Hutter, M.; Pape, U.; Müller, J.; Wunderle, B.
Presentation
2006Verfahren und Herstellung einer Lotlegierung oder einer Lotvorlegierung
Scheel, W.; Wittke, K.; Hutter, M.
Patent
2006Zuverlässigkeit von Lötverbindungen
Hutter, M.; Pape, U.; Wunderle, B.
Presentation
2005Au/Sn-Flip-Chip-Bonding für 77 GHz-Radar-Frontend-Anwendungen
Klein, M.; Hutter, M.; Oppermann, H.
Journal Article
2005Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps
Oppermann, H.; Hutter, M.; Klein, M.; Engelmann, G.; Töpper, M.; Wolf, J.
Conference Paper
2005Investigation of Different Flip Chip Assembly Processes Using Au/Sn Microbumps
Hutter, M.; Thomas, T.; Jordan, R.; Engelmann, G.; Oppermann, H.; Reichl, H.; Wang, Y.; Howlader, M.; Higurashi, E.; Suga, T.
Conference Paper
2005Kollisionserkennung für mehrlagige Bekleidung
Hutter, M.
: Fuhrmann, A. (Prüfer)
Thesis
2005Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops
Oppermann, H.; Hutter, M.; Engelmann, G.; Reichl, H.
Conference Paper
2005Passive Alignment Flip Chip Assembly Using Surface Tension of Liquid Solder and Micromechanical Stops
Oppermann, H.; Hutter, M.; Engelmann, G.; Reichl, H.
Conference Paper
2005Surface activation process of lead-free solder bumps for low temperature bonding
Wang, Y.; Nishida, K.; Hutter, M.; Howlader, M.R.; Higurashi, E.; Kimura, T.; Suga, T.
Conference Paper
2005W-band flip-chip VCO in thin-film environment
Töpper, M.; Schmückle, F.J.; Lenk, F.; Hutter, M.; Klein, M.; Oppermann, H.; Engelmann, G.; Riepe, K.; Heinrich, W.
Conference Paper
2004Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps
Hutter, M.; Hohnke, F.; Oppermann, H.; Klein, M.; Engelmann, G.
Conference Paper
2004Flip chip assembly and reliability using gold/tin solder bumps
Oppermann, H.; Hutter, M.; Klein, M.; Reichl, H.
Conference Paper
2004Flip Chip Assembly Using AuSn Solder Bumps for GaAs Applications
Oppermann, H.; Hutter, M.; Jordan, R.; Klein, M.; Engelmann, G.; Wolf, J.; Reichl, H.
Conference Paper
2004High precision passive alignment flip chip assembly using self alignment and micromechanical stops
Hutter, M.; Oppermann, H.; Engelmann, G.; Reichl, H.
Conference Paper
2004Investigation of solder bumps, flip chip assembly, reliability and passive alignment using Au/Sn
Hutter, M.; Klein, M.; Engelmann, G.; Oppermann, H.
Book Article
2004Verfahren zum Erzeugen einer Lotverbindung durch kapillaren Lotfluss
Oppermann, H.; Hutter, M.
Patent
2002Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications
Hutter, M.; Oppermann, H.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Development of an assembly process and reliability investigations for flip chip LEDs using AuSn soldering
Elger, G.; Hutter, M.; Oppermann, H.H.; Aschenbrenner, R.; Reichl, H.; Jäger, E.
Journal Article, Conference Paper
2000The impact of LOC structures on 670-nm (Al)GaInP high-power lasers
Lichtenstein, N.; Winterhoff, R.; Scholz, F.; Schweizer, H.; Weiss, S.; Hutter, M.; Reichl, H.
Journal Article
2000Spectroscopic measurement of mounting-induced strain in optoelectronic devices
Bärwolff, A.; Tomm, J.W.; Müller, R.; Weiss, S.; Hutter, M.; Oppermann, H.; Reichl, H.
Journal Article