Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2006Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders
Huang, M.L.; Löher, T.; Manessis, D.; Böttcher, L.; Ostmann, A.; Reichl, H.
Journal Article
2005Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders
Huang, M.L.; Löher, T.; Ostmann, A.; Reichl, H.
Journal Article