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| 2013 | Gas sorption isotherms in swelling glassy polymers - detailed atomistic simulations
Hölck, O.; Böhning, M.; Heuchel, M.; Siegert, M.R.; Hofmann, D. | Journal Article |
| 2012 | Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B. | Journal Article |
| 2012 | In-situ - Characterization of moisture induced swelling behaviour of microelectronic relevant polymers
Walter, H.; Bauer, J.; Braun, T.; Hölck, O.; Wunderle, B.; Wittler, O. | Conference Paper |
| 2012 | Influence of conversion level on simulation results of crosslinked polymers
Tesarski, S.J.; Wymysowski, A.; Hölck, O. | Conference Paper |
| 2012 | Microelectronics packaging materials: Correlating structure and property using molecular dynamics simulations
Hölck, Ole; Wunderle, Bernhard | Book Article |
| 2012 | Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B. | Conference Paper |
| 2011 | Analysis of moisture and time dependent material parameters
Walter, Hans; Hölck, Ole | Conference Paper, Journal Article |
| 2011 | Application of hybrid methods to analyse interface properties of packaging materials on miniaturized specimens
Walter, Hans; Wunderle, Bernhard; Keller, Jürgen; Hölck, Ole; Wittler, Olaf; Michel, Bernd | Conference Paper |
| 2011 | Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach - Preliminary results
Tesarski, S.J.; Wymysowski, A.; Hölck, O. | Conference Paper |
| 2011 | Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B. | Journal Article, Conference Paper |
| 2011 | Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B. | Conference Paper |
| 2011 | Experimental contact angle determination and characterisation of interfacial energies by molecular modelling of chip to epoxy interfaces
Hölck, Ole; Bauer, Jörg; Wittler, Olaf; Lang, Klaus Dieter; Michel, Bernd; Wunderle, Bernhard | Conference Paper |
| 2011 | Fracture-mechanical interface characterisation for thermo-mechanical co-design
Wunderle, Bernhard; Schulz, Marcus; Keller, Jürgen; Schlottig, Gerd; Maus, Ingrid; May, Daniel; Hölck, Ole; Pape, Heinz; Michel, Bernd | Journal Article, Conference Paper |
| 2011 | Fracture-mechanical interface characterisation for thermo-mechanical co-design An effcient and comprehensive method for critical mixed-mode data extraction
Wunderle, B.; Schulz, M.; Keller, J.; Schlottig, G.; Maus, I.; May, D.; Hölck, O.; Pape, H.; Michel, B. | Conference Paper |
| 2011 | Multiscale perspectives of interface delamination in microelectronic packaging applications
Iwamoto, Nancy; Hölck, Ole; Noijen, Sander | Journal Article |
| 2010 | Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Wunderle, B.; Dermitzaki, E.; Hölck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Rätzke, K.; Faupel, F.; Michel, B.; Reichl, H. | Journal Article, Conference Paper |
| 2010 | Molecular modeling of a 3D-crosslinked epoxy resin and its interface to native SiO2 - property prediction in microelectronic packaging
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B.; Reichl, H. | Conference Paper |
| 2010 | Molecular modelling of microelectronic packaging materials - basic thermo-mechanical property estimation of a 3D-crosslinked epoxy / SiO2 interface
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B. | Conference Paper |
| 2010 | A multiscale modeling approach for microelectronic packaging applications
Iwamoto, N.; Hölck, O.; Noijen, S.; Wunderle, B.; Todd, S. | Conference Paper |
| 2010 | Numerical approach to multiscale evaluation and analysis of Tg of crosslinked polymers
Tesarski, S.J.; Hölck, O.; Wymyslowski, A. | Conference Paper |
| 2009 | Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Wunderle, B.; Dermitzaki, E.; Hölck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Rätzke, K.; Faupel, F.; Michel, B.; Reichl, H. | Conference Paper |
| 2008 | Knowledge-based approach to gas sorption in glassy polymers by combining experimental and molecular simulation techniques
Heuchel, M.; Hölck, O.; Böhning, M.; Siegert, M.R.; Hofmann, D. | Conference Paper |
| 2008 | Simulation of Experimentally Observed Dilation Phenomena During Integral Gas Sorption in Glassy Polymers
Hölck, O.; Heuchel, M.; Böhning, M.; Hofmann, D. | Journal Article |