Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016Foreword to the special section on "Stress-Induced Phenomena in Microelectronics"
Ho, Paul S.; Zschech, Ehrenfried
Abstract
2016A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions
Kraatz, Matthias; Gall, Martin; Zschech, Ehrenfried; Schmeißer, Dieter; Ho, Paul S.
Journal Article
2016Replication of a distinct psoriatic arthritis risk variant at IL23R
Budu-Aggrey, A.; Bowes, J.; Lohr, S.; Uebe, S.; Zervou, M.I.; Helliwell, P.; Ryan, A.W.; Kane, D.; Korendowych, E.; Giardina, E.; Packham, J.; McManus, R.; FitzGerald, O.; McHugh, N.; Behrens, F.; Burkhardt, H.; Huffmeier, U.; Ho, P.; Martin, J.; Castaneda, S.; Goulielmos, G.; Reis, A.; Barton, A.
Abstract
2016Replication of a distinct psoriatic arthritis risk variant at the IL23R locus
Budu-Aggrey, A.; Bowes, J.; Loehr, S.; Uebe, S.; Zervou, M.I.; Helliwell, P.; Ryan, A.W.; Kane, D.; Korendowych, E.; Giardina, E.; Packham, J.; McManus, R.; Fitzgerald, O.; McHugh, N.; Behrens, F.; Burkhardt, H.; Huffmeier, U.; Ho, P.; Martin, J.; Castaneda, S.; Goulielmos, G.; Reis, A.; Barton, A.
Journal Article
2016Validation of a distinct psoriatic arthritis risk variant at IL23R
Budu-Aggrey, A.; Bowes, J.; Loehr, S.; Uebe, S.; Zervou, M.I.; Helliwell, P.; Ryan, A.W.; Kane, D.; Korendowych, E.; Giardina, E.; Packham, J.; McManus, R.; FitzGerald, O.; McHugh, N.; Behrens, F.; Burkhardt, H.; Huffmeier, U.; Ho, P.; Martin, J.; Castaneda, S.; Goulielmos, G.; Reis, A.; Barton, A.
Abstract
2015Corrigendum: Dense genotyping of immune-related susceptibility loci reveals new insights into the genetics of psoriatic arthritis
Bowes, J.; Budu-Aggrey, A.; Huffmeier, U.; Uebe, S.; Steel, K.; Hebert, H.L.; Wallace, C.; Massey, J.; Bruce, I.N.; Bluett, J.; Feletar, M.; Morgan, A.W.; Marzo-Ortega, H.; Donohoe, G.; Morris, D.W.; Helliwell, P.; Ryan, A.R.; Kane, D.; Warren, R.B.; Korendowych, E.; Alenius, G.-M.; Giardina, E.; Packham, J.; McManus, R.; FitzGerald, O.; McHugh, N.; Brown, M.A.; Ho, P.; Behrens, F.; Burkhardt, H.; Reis, A.; Barton, A.
Journal Article
2015Dense genotyping of immune-related susceptibility loci reveals new insights into the genetics of psoriatic arthritis
Bowes, J.; Budu-Aggrey, A.; Huffmeier, U.; Uebe, S.; Steel, K.; Hebert, H.L.; Wallace, C.; Massey, J.; Bruce, I.N.; Bluett, J.; Feletar, M.; Morgan, A.W.; Marzo-Ortega, H.; Donohoe, G.; Morris, D.W.; Helliwell, P.; Ryan, A.W.; Kane, D.; Warren, R.B.; Korendowych, E.; Alenius, G.-M.; Giardina, E.; Packham, J.; McManus, R.; Fitzgerald, O.; McHugh, N.; Brown, M.A.; Ho, P.; Behrens, F.; Burkhardt, H.; Reis, A.; Barton, A.
Journal Article
2015PTPN22 is associated with susceptibility to psoriatic arthritis but not psoriasis: Evidence for a further PsA-specific risk locus
Bowes, J.; Loehr, S.; Budu-Aggrey, A.; Uebe, S.; Bruce, I.N.; Feletar, M.; Marzo-Ortega, H.; Helliwell, P.; Ryan, A.W.; Kane, D.; Korendowych, E.; Alenius, G.-M.; Giardina, E.; Packham, J.; McManus, R.; FitzGerald, O.; Brown, M.A.; Behrens, F.; Burkhardt, H.; McHugh, N.; Huffmeier, U.; Ho, P.; Reis, A.; Barton, A.
Journal Article
2015Validation of a distinct psoriatic arthritis risk variant at IL23R
Budu-Aggrey, A.; Bowes, J.; Lohr, S.; Zervou, M.I.; Helliwell, P.S.; Ryan, A.W.; Kane, D.; Korendowych, E.; Giardina, E.; Packham, J.; McManus, R.; FitzGerald, O.; McHugh, N.J.; Behrens, F.; Burkhardt, H.; Huffmeier, U.; Martin, J.; Goulielmos, G.; Ho, P.; Reis, A.; Barton, A.
Abstract
2013Variants in RUNX3 contribute to susceptibility to psoriatic arthritis, exhibiting further common ground with ankylosing spondylitis
Apel, M.; Uebe, S.; Bowes, J.; Giardina, E.; Korendowych, E.; Juneblad, K.; Pasutto, F.; Ekici, A.B.; McManus, R.; Ho, P.; Bruce, I.N.; Ryan, A.W.; Behrens, F.; Böhm, B.; Traupe, H.; Lohmann, J.; Gieger, C.; Wichmann, H.-E.; Padyukov, L.; FitzGerald, O.; Alenius, G.-M.; McHugh, N.J.; Novelli, G.; Burkhardt, H.; Barton, A.; Reis, A.; Hüffmeier, U.
Journal Article
2012Advanced interconnects for ULSI technology
: Baklanov, M.R.; Ho, P.S.; Zschech, E.
Book
2012Analysis of grain structure by precession electron diffraction and effects on electromigration reliability of Cu interconnects
Cao, L.; Ganesh, K.J.; Zhang, L.; Aubel, O.; Hennesthal, C.; Zschech, E.; Ferreira, P.J.; Ho, P.S.
Conference Paper
2012Forward to the special section on "Materials, Processing, and Reliability of 3-D Interconnects". Editorial
Ho, P.S.; Smith, L.; Tong, H.M.; Zschech, E.
Journal Article
2012Physical characterization of PECVD and PEALD Ru(-C) films and comparison with PVD ruthenium film properties
Wojcik, H.; Junige, M.; Bartha, W.; Albert, M.; Neumann, V.; Merkel, U.; Peeva, A.; Gluch, J.; Menzel, S.; Munnik, F.; Liske, R.; Utess, D.; Richter, I.; Klein, C.; Engelmann, H.J.; Ho, P.; Hossbach, C.; Wenzel, C.
Journal Article
2012Scaling and microstructure effects on electromigration reliability for Cu interconnects
Hu, C.-K.; Hübner, R.; Zhang, L.; Hauschildt, M.; Ho, P.S.
Book Article
2011Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping
Zhang, L.J.; Ho, P.S.; Aubel, O.; Hennesthal, C.; Zschech, E.
Journal Article
2010Assessment of mechanical properties of nanoscale structures for microprocessor manufacturing
Niese, S.; Hecker, M.; Liske, R.; Ritz, Y.; Zschech, E.; Wojcik, H.; Bartha, J.; Wu, Z.; Ho, P.S.
Conference Paper
2010Cap layer and grain size effects on electromigration reliability in Cu/low-k interconnects
Zhang, L.; Kraatz, M.; Aubel, O.; Hennesthal, C.; Im, J.; Zschech, E.; Ho, P.S.
Conference Paper
2010Effects of cap layer and grain structure on electromigration reliability of Cu/low-k interconnects for 45 nm technology node
Zhang, L.; Zhou, J.P.; Im, J.; Ho, P.S.; Aubel, O.; Hennesthal, C.; Zschech, E.
Conference Paper
2010EM and SM induced degradation dynamics in copper interconnects studied using electron microscopy and X-ray microscopy
Zschech, E.; Hübner, R.; Aubel, O.; Ho, P.S.
Conference Paper
2010Grain size and cap layer effects on electromigration reliability of Cu interconnects: Experiments and simulation
Zhang, L.; Kraatz, M.; Aubel, O.; Hennesthal, C.; Zschech, E.; Ho, P.S.
Conference Paper
2010Scaling effects on microstructure and reliability for Cu interconnects
Ho, P.S.; Zschech, E.; Schmeißer, D.; Meyer, M.A.; Hübner, R.; Hauschildt, M.; Zhang, L.; Gall, M.; Kraatz, M.
Journal Article
2010Stress-induced phenomena in metallization. Eleventh International Workshop on Stress-Induced Phenomena in Metallization 2010. Preface
Zschech, E.; Ho, P.; Ogawa, S.
Journal Article, Conference Paper
2009Geometry and microstructure effect on EM-induced copper interconnect degradation
Zschech, Ehrenfried; Ho, Paul S.; Schmeißer, Dieter; Meyer, Moritz Andreas; Vairagar, Anand V.; Schneider, Gerd; Hauschildt, Meike; Kraatz, Matthias; Sukharev, Valeriy
Journal Article