Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2014Synthesis of nanostructured chitin-hematite composites under extreme biomimetic conditions
Wysokowski, M.; Motylenko, M.; Walter, J.; Lota, G.; Wojciechowski, J.; Stocker, H.; Galli, R.; Stelling, A.L.; Himcinschi, C.; Niederschlag, E.; Langer, E.; Bazhenov, V.V.; Szatkowski, T.; Zdarta, J.; Pertenko, I.; Kljajic, Z.; Leisegang, T.; Molodtsov, S.L.; Meyer, D.C.; Jesionowski, T.; Ehrlich, H.
Journal Article
2009Growth and characterization of thin films prepared from perfluoro-isopropyl-substituted perfluorophthalocyanines
Keil, C.; Tsaryova, O.; Lapok, L.; Himcinschi, C.; Wöhrle, D.; Hild, O.R.; Zahn, D.R.T.; Gorun, S.M.; Schlettwein, D.
Journal Article
2008Strained silicon on wafer level by waferbonding: Materials processing, strain measurements and strain relaxation
Reiche, M.; Moutanabbir, O.; Himcinschi, C.; Christiansen, S.; Erfurth, W.; Gösele, U.; Mantl, S.; Buca, D.; Zhao, Q.; Loo, R.; Nguyen, D.; Muster, F.; Petzold, M.
Conference Paper
2007Strain relaxation in nanopatterned strained silicon round pillars
Himcinschi, C.; Singh, R.; Radu, I.; Milenin, A.P.; Erfurth, W.; Reiche, M.; Gösele, U.; Christiansen, S.H.; Muster, F.; Petzold, M.
Journal Article
2007Uniaxially strained silicon by wafer bonding and layer transfer
Himcinschi, C.; Radu, I.; Muster, F.; Singh, R.; Reiche, M.; Petzold, M.; Gösele, U.; Christiansen, S.H.
Conference Paper, Journal Article
2005Scaling down thickness of ULK materials for 65 nm node and below and its effect on electrical performance
Frühauf, S.; Himcinschi, C.; Rennau, M.; Schulze, K.; Schulz, S.E.; Friedrich, M.; Gessner, T.; Zahn, D.R.T.; Le, Q.T.; Caluwaerts, R.
Conference Paper, Journal Article
2004Contributions to the static dielectric constant of low-k xerogel films derived from ellipsometry and IR spectroscopy
Himcinschi, C.; Friedrich, M.; Frühauf, S.; Schulz, S.E.; Gessner, T.; Zahn, D.R.T.
Conference Paper, Journal Article
2001Silicon oxide in Si-Si bonded wafers
Himcinschi, C.; Milekhin, A.; Friedrich, M.; Hiller, K.; Wiemer, M; Gessner, T.; Schule, S.; Zahn, D.R.T.
Journal Article