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| 2000 | Low cost bumping by stencil printing
Kloeser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2000 | Wafer-level chip size package (WL-CSP)
Töpper, M.; Fehlberg, S.; Scherpinski, K.; Karduck, C.; Glaw, V.; Heinricht, K.; Coskina, P.; Ehrmann, O.; Reichl, H. | Journal Article |
| 1999 | Entwicklung eines CSP auf Waferebene
Simon, J.; Auersperg, J.; Becker, K.-F.; Busse, E.; Heinricht, K.; Kallmayer, C.; Schütt, J.; Töpper, M.; Reichl, H. | Book Article |
| 1998 | Alternative solders for flip chip applications in the automotive environment
Jung, E.; Heinricht, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Chip size package - the option of choice for miniaturized medical devices
Töpper, M.; Schaldach, M.; Fehlberg, S.; Karduck, C.; Meinherz, C.; Heinricht, K.; Bader, V.; Hoster, L.; Coskina, P.; Kloeser, J.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1998 | Experience with a fully automatic flip-chip assembly line integrating SMT
Klöser, J.; Kutzner, K.; Jung, E.; Heinricht, K.; Lauter, L.; Töpper, M. | Conference Paper |
| 1998 | Implementation of flip chip technology into volume manufacturing demonstration of processes
Jung, E.; Heinricht, K.; Kutzner, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.; Brommelhaus, A. | Conference Paper |
| 1998 | Integration of flip chip assembly in the SMT process: manufacturing and productivity issues
Jung, E.; Klöser, J.; Heinricht, K.; Lauter, L.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Low cost bumping by stencil printing. Process qualification for 200 mu m pitch
Klöser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Quality and yield of ultra fine pitch stencil printing for flip chip assembly
Heinricht, K.; Klöser, J.; Lauter, L.; Ostmann, A.; Reichl, H.; Wolter, A. | Conference Paper |
| 1998 | Reliability investigations of Sn/Pb and lead free solders for flip chip technology
Klöser, J.; Jung, E.; Heinricht, K.; Kutzner, K.; Ostmann, A.; Reichl, H. | Conference Paper |
| 1997 | Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology
Kloeser, J.; Heinricht, K.; Motulla, G.; Kutzner, K.; Jung, E.; Ostmann, A.; Zakel, E.; Reichl, H. | Conference Paper |