Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021A reference flow for chip-package co-design for 5G-mm-wave using Assembly Design Kit (ADK)
Hopsch, Fabian; Heinig, Andy
Presentation
202013-Gb/s Transmitter for Bunch of Wires Chip-to-Chip Interface Standard
Chaudhary, Muhammad Waqas; Heinig, Andy; Choubey, Bhaskar
Conference Paper
2020Co-Design für System-in-Package-on Board: Management von Komplexität und Entwurfslandschaft zur Erarbeitung kompakter 3D Systemlösungen, Teilvorhaben: Designmethoden und Designflows für das System-in-Package-on-Board Co-Design. Abschlussbericht
Heinig, Andy
Report
2020Electronics For Quantum Communications
Heinig, Andy
Blog Post
2020Interconnect Aware Power Optimization of Low Swing Driver for Multi-Chip Interfaces
Chaudhary, Muhammad Waqas; Heinig, Andy; Choubey, Bhaskar
Conference Paper
2020Introducing a Reference Flow for Chip-Package Co-Design for 5G / MM-Wave Designs on GF ADK for 22FDX
Heinig, Andy; Hopsch, Fabian
Presentation
2020Packaging and Package Design for AI at the Edge
Heinig, Andy
Blog Post
2019Driving with Chiplets
Heinig, Andy
Blog Post
2019Fraunhofer's Initial and Ongoing Contributions to 3D IC Integration
Ramm, Peter; Klumpp, Armin; Landesberger, Christof; Weber, Josef; Heinig, Andy; Schneider, Peter; Elst, Guenter; Engelhardt, Manfred
Conference Paper
2019Fraunhofer's Initial and Ongoing Contributions to 3D IC Integration
Ramm, Peter; Klumpp, Armin; Landesberger, Christof; Weber, Josef; Heinig, Andy; Schneider, Peter; Elst, Guenter; Engelhardt, Manfred
Presentation
2019HBM and ASIC silicon interposer
Puschmann, René; Heinig, Andy
Conference Paper
2019Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System
Steinhardt, Alexander; Papaioannou, Dimitrios; Heinig, Andy; Schneider, Peter
Book Article
2019Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Becker, Karl-Friedrich; Böttcher, Mathias; Schiffer, Michael; Pötter, Harald; Brockmann, Carsten; Freimund, Damian; Tschoban, Christian; Windrich, Frank; Braun, Tanja; Hopsch, Fabian; Heinig, Andy; Voigt, Sven; Baum, Mario; Hofmann, Lutz; Lang, Klaus-Dieter
Conference Paper
2019Very-Thin System-in-Package Technology for Structural Analysis
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Conference Paper
2018Packaging and board design for 5G and millimeter wave applications
Heinig, Andy
Presentation
2018Simulation, testing and implementation of temperature-reduction solutions on a high-power thermal demonstrator
Heinig, Andy; Papaioannou, Dimitrios
Presentation
2018Why use an assembly design kit and assembly design flow?
Heinig, Andy
Blog Post
2017Comparison between thermal simulations and experimental measurements on an advanced microelectronics test-system
Papaioannou, Dimitrios; Heinig, Andy
Conference Paper
2017Heterogeneous Interposer Based Integration of Chips with Copper Pillars and C4 Balls to Achieve High Speed Interfaces for ADC Application
Dittrich, Michael; Heinig, Andy; Hopsch, Fabian; Trieb, Robert
Conference Paper
2017High speed interfaces for chip communication on interposer based integration
Chaudhary, Muhammad Waqas; Heinig, Andy
Presentation
2017Interposer-based smartcard system with active wireless communication
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Conference Paper
2017Simulation-based design methodology for heterogeneous systems at package-level utilizing XML and XSLT
Fischbach, Robert; Heinig, Andy; Lienig, Jens
Conference Paper
2016Advanced System Integration für hochintegrierte Sensoren im Umfeld von Industrie-4.0-Anwendungen
Heinig, Andy; Dietrich, Michael; Hopsch, Fabian
Conference Paper
2016Co-design of CML IO and interposer channel for low area and power signaling
Chaudhary, Muhammad Waqas; Heinig, Andy
Conference Paper
2016Entwurfsplattform für SiP in medizintechnischen Anwendungen
Heinig, Andy; Fischbach, Robert
Report
2016High speed interfaces between chips mounted with different integration technologies on an interposer
Chaudhary, Muhammad Waqas; Heinig, Andy
Conference Paper
2016High speed serial interfaces in 2.5D integrated systems
Chaudhary, Waqas Muhammad; Heinig, Andy
Conference Paper
2016Interposer based integration to achieve high speed interfaces for ADC application
Chaudhary, Muhammad Waqas; Heinig, Andy; Dittrich, Michael
Conference Paper
2016Model abstraction of 3D-integrated/interposer-based high performance systems for faster (thermal) simulation
Heinig, Andy; Papaioannou, Dimitrios; Fischbach, Robert
Conference Paper
2016Overview of 3D CAD design tools
Heinig, Andy; Fischbach, Robert
Book Article
2015Characteristics and process stability of complete electrical interconnection structures for a low cost interposer technology
Dittrich, Michael; Steinhardt, Alexander; Heinig, Andy; Wojnowski, M.; Pressel, K.; Wolf, Jürgen
Conference Paper
2015Enabling automatic system design optimization through assembly design kits
Heinig, Andy; Fischbach, Robert
Conference Paper
2015Investigation of chip-to-chip interconnection structures for high data rates on a low cost silicon interposer
Dittrich, Michael; Heinig, Andy
Conference Paper
2015Technology options and their influence on routing for interposer-based memory processor integration
Heinig, Andy
Blog Post
2015Thermal and mechanical simulations for the improvement of the lifespan of highly-integrated systems
Heinig, Andy; Papaioannou, Dimitrios
Conference Paper
2014Automatic footprint compaction and bond wire placement for bare die chips stacks
Dittrich, Michael; Heinig, Andy; Schneider, Peter
Conference Paper
2014Design für Vertikale 3D Systemintegration in mm-Wellen Anwendungen
Heinig, Andy; Fischbach, Robert
Report
2014Effizienter Design Rule Check von 3D Systemaufbauten mit einer hierarchischen XML-basierten Modellierungssprache
Fischbach, Robert; Dittrich, Michael; Heinig, Andy
Conference Paper
2014Euclidean move surface decomposition of non-planar surfaces for the electronic system design
Steinhardt, Alexander; Heinig, Andy
Conference Paper
2014Interposer based wide IO processor integration
Heinig, Andy; Fischbach, Robert; Dittrich, Michael
Conference Paper
2014System integration - the bridge between more than moore and more moore
Heinig, Andy; Dietrich, Manfred; Herkersdorf, Andreas; Miller, F.; Wild, T.; Hahn, Kai; Grünewald, Armin; Brück, Rainer; Kröhnert, Steffen; Reisinger, Jochen
Conference Paper
2014Technology, simulation and design for 3D integrated heterogeneous sensor systems
Schneider, Peter; Heinig, Andy; Bayer, Christian; Ramm, Peter; Dal Molin, Renzo; Fleischer, Maximilian
Conference Paper
2014Thermal analysis and optimization of 2.5D and 3D integrated systems with wide I/O memory
Heinig, Andy; Fischbach, Robert; Dittrich, Michael
Conference Paper
2014Thermische Analyse und Optimierung von Wide I/O-Speicher integrierenden 2.5- und 3-D Systemaufbauten
Heinig, Andy; Fischbach, Robert
Conference Paper
2014Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration
Wojnowski, M.; Pressel, K.; Beer, G.; Heinig, Andy; Dittrich, Michael; Wolf, Jürgen
Conference Paper
2013Challenges and methods for the design of 3D-integrated smart systems
Knöchel, Uwe; Heinig, Andy
Conference Paper
2013Consideration of local structures in hierarchical partitioning of integrated circuit netlists modelled by hypergraphs
Steinhardt, Alexander
: Tittmann, Peter (Erstprüfer); Heinig, Andy (Zweitprüfer)
Master Thesis
2013Electro-thermal co-design of chip-package-board systems
Sohrmann, Christoph; Heinig, Andy; Dittrich, Michael; Jancke, Roland; Schneider, Peter
Conference Paper
2013Layout dependent synthesis for manufacturing costs optimized 3D integrated systems
Heinig, Andy
Conference Paper
2013Testkonzept für ein interposerbasiertes 3D-System
Heinig, Andy; Hopsch, Fabian
Conference Paper
2013XML-based hierarchical description of 3D systems and SIP
Wolf, Susann; Heinig, Andy; Knöchel, Uwe
Journal Article
20123D-integration: Challenges and proposals
Dietrich, Manfred; Heinig, Andy; Knöchel, Uwe
Conference Paper
2012Current challenges in interposer and 3D-design
Wilde, Andreas; Heinig, Andy
Presentation
2012Examination of process parameter variations
Acar, Emrah; Mau, Hendrik; Heinig, Andy; Li, Bing; Schlichtmann, Ulf
Book Article
2012A flow for parasitics extraction in 3D-systems
Heinig, Andy; Dittrich, Michael; Reitz, Sven; Stolle, Jörn
Conference Paper
2012NEEDS - Nanoelektronik-Entwurf für 3D-Systeme
Hylla, Kai; Metzdorf, Malte; Grünewald, Armin; Hahn, Kai; Heinig, Andy; Knöchel, Uwe; Wolf, Susann; Miller, Felix; Wild, Thomas; Quiring, Artur; Olbrich, Markus; Sattler, Sebastian; Treytnar, Dieter
Conference Paper
2012Syntheseoptimierung bei 3D-Schaltungen
Luo, Zhongying
: Heinig, Andy (Betreuer); Lienig, Jens (Betreuer)
Thesis
2012Thermal management in the design space exploration of 3D stacks and corresponding package
Heinig, Andy; Knöchel, Uwe; Schneider, Peter; Wilde, Andreas
Conference Paper
2012Werkzeuge und Methoden für den interposerbasierten 3D-Entwurf
Heinig, Andy
Conference Paper
2012XML-basierte Sprache für die hierarchische und parametrisierbare Beschreibung von 3D-Systemen
Wolf, Susann; Heinig, Andy; Knöchel, Uwe
Book Article
2011Electronic design automation for implementation of 3D integrated systems
Knöchel, Uwe; Heinig, Andy; Stolle, Jörn; Reitz, Sven; Wilde, Andreas
Book Article
2011Thermal modeling of 3D stacks for floorplanning
Reitz, Sven; Heinig, Andy; Martin, Roland; Stolle, Jörn; Wilde, Andreas
Conference Paper
2011XML-basierte hierarchische Beschreibungssprache für 3D-Systeme
Heinig, Andy; Wolf, Susann; Knöchel, Uwe
Conference Paper