Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System
Steinhardt, Alexander; Papaioannou, Dimitrios; Heinig, Andy; Schneider, Peter
Book Article
2019Very-Thin System-in-Package Technology for Structural Analysis
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Conference Paper
2018Design of on-chip RFID transponder antennas
Heinig, Andreas
Conference Paper
2018Design of On-Chip RFID Transponder Antennas
Heinig, Andreas
Presentation
2018Electrical Characterization of a High Speed HBM Interface for a Low Cost Interposer
Dittrich, M.; Heinig, A.; Hopsch, F.
Conference Paper
2018Heterogeneous interposer based integration of chips onto interposer to achieve high speed interfaces for ADC application
Chaudhary, M.W.; Heinig, A.
Conference Paper
2018High speed interfaces for chip to chip communication on interposer based integration
Chaudhary, M.W.; Heinig, A.
Conference Paper
2018Packaging and board design for 5G and millimeter wave applications
Heinig, Andy
Presentation
2018Simulation, testing and implementation of temperature-reduction solutions on a high-power thermal demonstrator
Heinig, Andy; Papaioannou, Dimitrios
Presentation
2018Why use an assembly design kit and assembly design flow?
Heinig, Andy
Electronic Publication
2017ASIC zur Ansteuerung und Signalerfassung eines CMUT
Pietzsch, Marcus; Weder, Andreas; Heinig, Andreas; Amelung, Jörg; Koch, Sandro; Kircher, Marco
Conference Paper
2017CMOS-design of a cascadable front-end ASIC for capacitive micromachined ultrasonic transducer (CMUT) arrays
Weder, Andreas; Koch, Sandro; Pietzsch, Marcus; Heinig, Andreas; Kircher, Marco; Lange, Nicolas; Amelung, Jörg
Conference Paper
2017CMOS-design of a cascadable front-end ASIC for capacitive micromachined ultrasonic transducer (CMUT) arrays
Weder, Andreas; Koch, Sandro; Pietzsch, Marcus; Heinig, Andreas; Kircher, Marco; Lange, Nicolas; Amelung, Jörg
Presentation
2017CMOS-design of a cascadable front-end ASIC for CMUT arrays
Koch, Sandro G.; Weder, Andreas; Pietzsch, Marcus; Heinig, Andreas; Kircher, Marco; Grafe, Mario; Lange, Nicolas; Amelung, Jörg
Presentation
2017Comparison between thermal simulations and experimental measurements on an advanced microelectronics test-system
Papaioannou, Dimitrios; Heinig, Andy
Conference Paper
2017Heterogeneous Interposer Based Integration of Chips with Copper Pillars and C4 Balls to Achieve High Speed Interfaces for ADC Application
Dittrich, Michael; Heinig, Andy; Hopsch, Fabian; Trieb, Robert
Conference Paper
2017High speed interfaces for chip communication on interposer based integration
Chaudhary, Muhammad Waqas; Heinig, Andy
Presentation
2017Interposer-based smartcard system with active wireless communication
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Conference Paper
2017Simulation-based design methodology for heterogeneous systems at package-level utilizing XML and XSLT
Fischbach, Robert; Heinig, Andy; Lienig, Jens
Conference Paper
2016Adaptives Prothesensystem - Entwicklung eines Prothesensystems zur Optimierung und adaptiven Anpassung der ossären Verankerung von Gelenkendoprothesen
Rotsch, Christian; Grätz, Hagen; Kluess, Daniel; Gille, Katarina; Heinig, Andreas; Schulze, Christian; Bader, Rainer; Hunger, Sandra; Töppel, Thomas; Drossel, Welf-Guntram
Conference Paper
2016Adjustable bone fixation of an artificial hip stem by using an intergrated sensor actuator system
Rotsch, Christian; Gille, Katarina; Hunger, Sandra; Heinig, Andreas; Grätz, Hagen; Schulze, Christian; Bader, Rainer; Drossel, Welf-Guntram; Ettrichrätz, Martin; Töppel, Thomas
Abstract
2016Advanced System Integration für hochintegrierte Sensoren im Umfeld von Industrie-4.0-Anwendungen
Heinig, Andy; Dietrich, Michael; Hopsch, Fabian
Conference Paper
2016Back-end-of-line integration technology of capacitive micromachined ultrasonic transducers (CMUT)
Amelung, Jörg; Klemm, Markus; Elsäßer, Linus; Kircher, Marco; Weder, Andreas; Pietzsch, Marcus; Heinig, Andreas; Müller, Michael; Grüger, Heinrich
Conference Paper
2016Back-End-of-Line integration technology of capacitive micromachined ultrasonic transducers (CMUT)
Koch, Sandro; Amelung, Jörg; Elsäßer, Linus; Kircher, Marco; Weder, Andreas; Pietzsch, Marcus; Heinig, Andreas; Müller, Michael
Presentation
2016Co-design of CML IO and interposer channel for low area and power signaling
Chaudhary, Muhammad Waqas; Heinig, Andy
Conference Paper
2016Cor/log BAN BT a wearable battery powered mHealth data logger and telemetry unit for multiple vital sign monitoring
Hilbel, T.; Feilner, S.; Struck, M.; Hofmann, C.; Heinig, A.; Katus, H.A.
Conference Paper
2016Design challenges in interposer-based 3-D memory logic interface
Heinig, A.; Chaudhary, M.W.; Fischbach, R.; Dittrich, M.
Journal Article
2016Entwurfsplattform für SiP in medizintechnischen Anwendungen
Heinig, Andy; Fischbach, Robert
Report
2016High speed interfaces between chips mounted with different integration technologies on an interposer
Chaudhary, Muhammad Waqas; Heinig, Andy
Conference Paper
2016High speed serial interfaces in 2.5D integrated systems
Chaudhary, Waqas Muhammad; Heinig, Andy
Conference Paper
2016Der intelligente Mobilitätsassistent - Unterstützung der autonomen Mobilität älterer Menschen
Weder, Andreas; Pietzsch, Marcus; Heinig, Andreas
Presentation
2016Interposer based integration to achieve high speed interfaces for ADC application
Chaudhary, Muhammad Waqas; Heinig, Andy; Dittrich, Michael
Conference Paper
2016Mobilitätsassistent "MOVEAS" - Unterstützung der Mobilität älterer Menschen
Weder, Andreas; Pietzsch, Marcus; Heinig, Andreas
Presentation
2016Model abstraction of 3D-integrated/interposer-based high performance systems for faster (thermal) simulation
Heinig, Andy; Papaioannou, Dimitrios; Fischbach, Robert
Conference Paper
2016Overview of 3D CAD design tools
Heinig, Andy; Fischbach, Robert
Book Article
2016Silicon interposer interconnect structures analysis - 3D full wave simulations and measurements
Scogna, A.C.; Kostka, D.; Troescher, M.; Steinhardt, A.; Trieb, R.; Heinig, A.; Henkel, A.
Conference Paper
2015Characteristics and process stability of complete electrical interconnection structures for a low cost interposer technology
Dittrich, Michael; Steinhardt, Alexander; Heinig, Andy; Wojnowski, M.; Pressel, K.; Wolf, Jürgen
Conference Paper
2015Current and future 3D activities at Fraunhofer
Heinig, A.; Chaudhary, M.W.; Schneider, P.; Ramm, P.; Weber, J.
Conference Paper
2015Enabling automatic system design optimization through assembly design kits
Heinig, Andy; Fischbach, Robert
Conference Paper
2015Investigation of chip-to-chip interconnection structures for high data rates on a low cost silicon interposer
Dittrich, Michael; Heinig, Andy
Conference Paper
2015Polymer energy harvester for powering wireless communication systems
Costache, Florenta; Schirrmann, Christian; Seifert, Ruben; Bornhorst, Kirstin; Pawlik, Boscij; Despang, Hans-Günter; Heinig, Andreas
Journal Article, Conference Paper
2015Self-Organizing Mobile Multi-Sensor Surveillance Platform for Emergency Management Situations
Noack, Alexander; Weder, Andreas; Heinig, Andreas
Presentation
2015Technology options and their influence on routing for interposer-based memory processor integration
Heinig, Andy
Electronic Publication
2015Thermal and mechanical simulations for the improvement of the lifespan of highly-integrated systems
Heinig, Andy; Papaioannou, Dimitrios
Conference Paper
2015Thermal considerations for systems with high speed memories
Heinig, A.; Papaioannou, D.; Fischbach, R.
Conference Paper
2015Untersuchungen an Hard- und Firmware für ein fehlertolerantes Sensornetzwerk, welches in faserverstärkte Verbundwerkstoffe integrierbar ist
Bartl, Clemens
: Heinig, Andreas (Betr.); Fischer, Wolf-Joachim (Betr.)
Thesis
2014Automatic footprint compaction and bond wire placement for bare die chips stacks
Dittrich, Michael; Heinig, Andy; Schneider, Peter
Conference Paper
2014Design für Vertikale 3D Systemintegration in mm-Wellen Anwendungen
Heinig, Andy; Fischbach, Robert
Report
2014Design rule check and layout versus schematic for 3D integration and advanced packaging
Fischbach, R.; Heinig, A.; Schneider, P.
Conference Paper
2014Effizienter Design Rule Check von 3D Systemaufbauten mit einer hierarchischen XML-basierten Modellierungssprache
Fischbach, Robert; Dittrich, Michael; Heinig, Andy
Conference Paper
2014Euclidean move surface decomposition of non-planar surfaces for the electronic system design
Steinhardt, Alexander; Heinig, Andy
Conference Paper
2014Interposer based wide IO processor integration
Heinig, Andy; Fischbach, Robert; Dittrich, Michael
Conference Paper
2014System integration - the bridge between more than moore and more moore
Heinig, Andy; Dietrich, Manfred; Herkersdorf, Andreas; Miller, F.; Wild, T.; Hahn, Kai; Grünewald, Armin; Brück, Rainer; Kröhnert, Steffen; Reisinger, Jochen
Conference Paper
2014Technology, simulation and design for 3D integrated heterogeneous sensor systems
Schneider, Peter; Heinig, Andy; Bayer, Christian; Ramm, Peter; Dal Molin, Renzo; Fleischer, Maximilian
Conference Paper
2014Thermal analysis and optimization of 2.5D and 3D integrated systems with wide I/O memory
Heinig, Andy; Fischbach, Robert; Dittrich, Michael
Conference Paper
2014Thermische Analyse und Optimierung von Wide I/O-Speicher integrierenden 2.5- und 3-D Systemaufbauten
Heinig, Andy; Fischbach, Robert
Conference Paper
2014Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration
Wojnowski, M.; Pressel, K.; Beer, G.; Heinig, Andy; Dittrich, Michael; Wolf, Jürgen
Conference Paper
2013Challenges and methods for the design of 3D-integrated smart systems
Knöchel, Uwe; Heinig, Andy
Conference Paper
2013Consideration of local structures in hierarchical partitioning of integrated circuit netlists modelled by hypergraphs
Steinhardt, Alexander
: Tittmann, Peter (Erstprüfer); Heinig, Andy (Zweitprüfer)
Master Thesis
2013Electro-thermal co-design of chip-package-board systems
Sohrmann, Christoph; Heinig, Andy; Dittrich, Michael; Jancke, Roland; Schneider, Peter
Conference Paper
2013Herstellung textilverstärkter Verbundbauteile mit strukturintegrierten Sensornetzwerken
Heinig, Andreas; Weder, Andreas; Fischer, Wolf-Joachim
Conference Paper
2013High-volume production of glass fibre-reinforced polyurethane composite structures with integrated piezoceramic sensor elements and adapted electronics
Hufenbach, W.; Fischer, W.-J.; Michaelis, A.; Gebhardt, S.; Geller, S.; Tyczynski, T.; Heinig, A.; Weder, A.; Hohlfeld, K.
Conference Paper
2013Layout dependent synthesis for manufacturing costs optimized 3D integrated systems
Heinig, Andy
Conference Paper
2013A modular system for capacitive ecg-acquisition
Despang, H.G.; Weder, A.; Pietzsch, M.; Lindner, O.; Heinig, A.; Rentsch, W.; Paul, A.; Fischer, W.-J.
Journal Article
2013A novel technology for the high-volume production of intelligent composite structures with integrated piezoceramic sensors and electronic components
Weder, A.; Geller, S.; Heinig, A.; Tyczynski, T.; Hufenbach, W.; Fischer, W.-J.
Journal Article, Conference Paper
2013Testkonzept für ein interposerbasiertes 3D-System
Heinig, Andy; Hopsch, Fabian
Conference Paper
2013XML-based hierarchical description of 3D systems and SIP
Wolf, Susann; Heinig, Andy; Knöchel, Uwe
Journal Article
20123D-integration: Challenges and proposals
Dietrich, Manfred; Heinig, Andy; Knöchel, Uwe
Conference Paper
2012AAL-Anwendungen von Smart Vital
Despang, Hans Günter; Heinig, Andreas; Holland, Hans Jürgen; Fischer, Wolf-Joachim; Mehl, Susann; Henrich, Dietmar
Conference Paper
2012Anti stress app
Malberg, H.; Ziaziulchyk, L.; Braer, M.; Hoffmann, M.; Mittag, A.; Huhle, R.; Zaunseder, S.; Bonnemeier, H.; Heinig, A.; Fischer, W.-J.
Conference Paper, Journal Article
2012Current challenges in interposer and 3D-design
Wilde, Andreas; Heinig, Andy
Presentation
2012Erstinbetriebnahme, Optimierung und Messreihen an einem telemedizinischen System zur Erfassung von EKG- und Pulswellen
Schwarz, Eric
: Heinig, A. (Betreuer)
Bachelor Thesis
2012Examination of process parameter variations
Acar, Emrah; Mau, Hendrik; Heinig, Andy; Li, Bing; Schlichtmann, Ulf
Book Article
2012A flow for parasitics extraction in 3D-systems
Heinig, Andy; Dittrich, Michael; Reitz, Sven; Stolle, Jörn
Conference Paper
2012Integration of piezoceramic sensor elements and electronic components in glass fibre reinforced polyurethane composite structures
Weder, Andreas; Geller, S.; Heinig, Andreas; Tyczynski, T.; Hufenbach, W.; Fischer, Wolf-Joachim
Journal Article, Conference Paper
2012Multi-step approach for thermal optimization of 3D-IC and package
Heinig, A.; Sohrmann, C.
Conference Paper
2012NEEDS - Nanoelektronik-Entwurf für 3D-Systeme
Hylla, Kai; Metzdorf, Malte; Grünewald, Armin; Hahn, Kai; Heinig, Andy; Knöchel, Uwe; Wolf, Susann; Miller, Felix; Wild, Thomas; Quiring, Artur; Olbrich, Markus; Sattler, Sebastian; Treytnar, Dieter
Conference Paper
2012Syntheseoptimierung bei 3D-Schaltungen
Luo, Zhongying
: Heinig, Andy (Betreuer); Lienig, Jens (Betreuer)
Thesis
2012Thermal management in the design space exploration of 3D stacks and corresponding package
Heinig, Andy; Knöchel, Uwe; Schneider, Peter; Wilde, Andreas
Conference Paper
2012Werkzeuge und Methoden für den interposerbasierten 3D-Entwurf
Heinig, Andy
Conference Paper
2012XML-basierte Sprache für die hierarchische und parametrisierbare Beschreibung von 3D-Systemen
Wolf, Susann; Heinig, Andy; Knöchel, Uwe
Book Article
2011Design and evaluation of a portable device for the measurement of bio-impedance-cardiograph
Shi, Q.; Heinig, A.; Kanoun, O.
Conference Paper
2011Electronic design automation for implementation of 3D integrated systems
Knöchel, Uwe; Heinig, Andy; Stolle, Jörn; Reitz, Sven; Wilde, Andreas
Book Article
2011Inbetriebnahme und Untersuchung eines Funktionsdemonstrators zur Erfassung von Vitalparametern mit hochauflösenden Analog-Digitalwandlern
Kosak, M.
: Heinrich, D.; Heinig, A.
Bachelor Thesis
2011Integration of piezoceramic and electronic functional elements in glass fibre-reinforced polyurethane composite structures
Hufenbach, W.; Fischer, W.J.; Michaelis, A.; Gebhardt, S.; Geller, S.; Tyczynski, T.; Heinig, A.; Weder, A.; Hohlfeld, K.
Conference Paper
2011Sensornetzwerke integriert in textilverstärkten Verbundwerkstoffen
Heinig, A.; Fischer, W.-J.; Kunadt, A.; Pfeifer, G.
Conference Paper
2011Testkostenabschätzung für das Floorplanning von 3D-Aufbauten
Heinig, A.
Conference Paper
2011Thermal modeling of 3D stacks for floorplanning
Reitz, Sven; Heinig, Andy; Martin, Roland; Stolle, Jörn; Wilde, Andreas
Conference Paper
2011XML-basierte hierarchische Beschreibungssprache für 3D-Systeme
Heinig, Andy; Wolf, Susann; Knöchel, Uwe
Conference Paper
2010Auswirkung von Parameterschwankungen bei verschiedenen Fertigungsverfahren von Kupfer-Leitungsstrukturen
Heinig, A.
Conference Paper
2010Design and properties of a sensor network embedded in thin fiber-reinforced composites
Kunadt, A.; Heinig, A.; Starke, E.; Pfeifer, G.; Cherif, C.; Fischer, W.-J.
Conference Paper
2010Design methods for 3D IC integration
Schneider, P.; Reitz, S.; Stolle, J.; Martin, R.; Heinig, A.; Wilde, A.
Conference Paper
2010Entwicklung einer Metrik zur Abschätzung der Leitungsverzögerung unter Berücksichtigung von Crosstalk-Delay
Krenkel, S.
: Fischer, B.; Heinig, A.
Thesis
2010Integration of multi physics modeling of 3D stacks into modern 3D data structures
Schneider, P.; Heinig, A.; Fischbach, R.; Lienig, J.; Reitz, S.; Stolle, J.; Wilde, A.
Conference Paper
2010Optical wireless data transmission with a sensor network integrated in a textile-reinforced composite
Heinig, A.; Deicke, F.; Kunadt, A.; Starke, E.; Fischer, W.-J.
Conference Paper
2010Untersuchung von heuristischen Optimierungsverfahren zur hierarchischen Platzierung von Standardzellen in 3D-Aufbauten
Heinicke, F.
: Tittmann, P.; Heinig, A.
Thesis
20093D image sensor SiP with TSV silicon interposer
Limansyah, I.; Wolf, J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Klein, M.; Oppermann, H.; Nebrich, L.; Heinig, A.; Pechlaner, A.; Reichl, H.; Weber, W.
Conference Paper
20093D integration of image sensor SiP using TSV silicon interposer
Wolf, M.J.; Zoschke, K.; Klumpp, A.; Wieland, R.; Klein, M.; Nebrich, L.; Heinig, A.; Limansyah, I.; Weber, W.; Ehrmann, O.; Reichl, H.
Conference Paper
2009Langzeit-Monitoring zur Unterstützung eines langen Lebens in der eigenen Wohnung
Heinig, A.
Conference Paper
2009Start-up behavior of event-driven sensor networks for impact load monitoring
Roscher, K.-U.; Fischer, W.-J.; Heinig, A.; Pfeifer, G.; Starke, E.
Journal Article
2009Statistische Parasitics-Extraction und Crosstalk-Noise
Heinig, A.; Sohrmann, C.
Conference Paper
20083D packaging for image sensor application
Wolf, M.J.; Klumpp, A.; Wieland, R.; Zoschke, K.; Klein, M.; Nebrich, L.; Heinig, A.; Weber, W.; Limansyah, I.; Ramm, P.; Reichl, H.
Conference Paper
2008Datenspeicherschaltung mit integrierter Datenspeichereinheit fuer einen Sensor mit physikalisch-elektrischem Wandler
Heinig, A.; Graetz, H.
Patent
2008Start-up behavior of event-driven sensor networks for impact load monitoring
Roscher, K.-U.; Fischer, W.-J.; Heinig, A.; Pfeifer, G.; Starke, E.
Conference Paper
2008Textilbasiertes Sensorsystem zum Langzeitmonitoring von Pflegebedürftigen und Risikopatienten
Rotsch, C.; Neudeck, A.; Möhring, U.; Holland, H.-J.; Heinig, A.; Despang, H.G.
Conference Paper
2008Wireless long-term ECG integrated into clothing
Despang, Hans Günter; Netz, Steffen; Heinig, Andreas; Holland, Hans Jürgen; Fischer, Wolf-Joachim
Journal Article
2007Integrated sensor network with event-driven activation for recording impact events in textile-reinforced composites
Roscher, K.-U.; Fischer, W.-J.; Grätz, H.; Heinig, A.; Pfeifer, G.; Starke, E.
Conference Paper
2007Integriertes Sensornetzwerk zur Erfassung von Stoßvorgängen in Faserverbundwerkstoffen
Roscher, K.-U.; Fischer, W.-J.; Grätz, H.; Heinig, A.; Pfeifer, G.; Starke, E.
Conference Paper
2007ST1 - ein freiprogrammierbarer Schaltkreis für 125 kHz Transponderlösungen
Grätz, H.; Heinig, A.; Deicke, F.; Fischer, W.-J.
Conference Paper
2006Integration eines Systems zur Detektion und Übertragung biomedizinischer Daten in Textilien
Heinig, A.; Despang, H.-G.; Holland, H.-J.
Conference Paper
2006OLED-Treiber/Controller ASIC
Vogel, U.; Bunk, G.; Heinig, A.; Amelung, J.
Conference Paper
2005Second generation OLED devices and systems: Inline evaporation, highly efficient OLED devices and novel driver/controller ASICs
Amelung, J.; Toerker, M.; Luber, C.; Eritt, M.; Tomita, Y.; Cholewa, H.; Hermann, R.; Loeffler, F.; May, C.; Vogel, U.; Bunk, G.; Heinig, A.; Jeroch, W.; Holland, H.-J.; Leo, K.
Conference Paper
2005Second generation OLED devices and systems: Inline evaporation, highly efficient OLED devices, and novel driver/controller ASICs
Amelung, J.; Törker, M.; Luber, C.; Eritt, M.; Tomita, Y.; Cholewa, H.; Hermann, R.; Löffler, F.; May, C.; Vogel, U.; Bunk, G.; Heinig, A.; Jeroch, W.; Holland, H.-J.; Leo, K.
Conference Paper
2004Design of versatile passive-matrix OLED driver/controller ASIC's
Vogel, U.; Bunk, G.; Heinig, A.; Jeroch, W.; Amelung, J.
Conference Paper
2004Möglichkeiten und Vorteile einer sensornahen Signalverarbeitung
Fischer, W.-J.; Marschner, U.; Grätz, H.; Heinig, A.; Despang, H.-G.
Conference Paper
2004OC2 - Passiv - Matrix OLED Driver ASIC mit embedded Controller
Jeroch, W.; Heinig, A.; Holland, H.-J.; Vogel, U.; Bunk, G.; Amelung, J.
Conference Paper
2004Towards versatile passive-matrix OLED driver/controller ASIC's
Vogel, U.; Bunk, G.; Heinig, A.; Jeroch, W.; Holland, H.-J.; Amelung, J.
Conference Paper
2003Transponder und elektronische Label - Beispiele für Multi-Nature-Systeme
Fischer, W.-J.; Holland, H.-J.; Grätz, H.; Heinig, A.
Conference Paper
2002Software zur sicheren Fernsteuerung und Fernabfrage
Heinig, A.
Journal Article
2001Hardware for data security
Heinig, A.
Book Article
2000Einsatz kryptographischer Algorithmen in der Mikrosystemtechnik und Mikroelektronik bei Betrachtung getakteter und selbstsynchronisierender Schaltungstechnik
Heinig, A.
Dissertation
1999Verschlüsseln in Hardware
Heinig, A.
Journal Article
1996Aus für den großen Lauschangriff
Fischer, W.-J.; Heinig, A.
Journal Article
1996Entwicklung eines ASIC für die Multi-Sensor-Signalverarbeitung mit integriertem CAN-Bus-Interface
Rietz, S.; Köhler, C.; Schneider, B.; Heinig, A.; Bender, S.; Grätz, H.; Fischer, W.-J.
Conference Paper
1996Multi sensor signal processing ASIC with CAN bus interface
Rietz, S.; Köhler, C.; Bender, S.; Heinig, A.; Grätz, H.; Schneider, B.; Marschner, U.; Fischer, W.-J.
Conference Paper
1996Multi-sensor controller with CAN bus interface
Bender, S.; Fischer, W.-J.; Grätz, H.; Heinig, A.; Köhler, C.; Rietz, S.; Schneider, B.
Conference Paper
1996Synthesefähiges VHDL-Modell eines DES-Kryptologieprozessorkerns
Fischer, W.-J.; Holland, H.-J.; Heinig, A.
Book Article
1996Synthesefähiges VHDL-Modell eines DES-Kryptologieprozessorkerns
Heinig, A.; Fischer, W.-J.
Conference Paper
1995Entwicklung eines Kryptologieprozessor-Kerns für den DES-Algorithmus
Heinig, A.
Thesis