Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Packaging and Package Design for AI at the Edge
Heinig, Andy
Electronic Publication
2019Driving with Chiplets
Heinig, Andy
Electronic Publication
2019Fraunhofer's Initial and Ongoing Contributions to 3D IC Integration
Ramm, Peter; Klumpp, Armin; Landesberger, Christof; Weber, Josef; Heinig, Andy; Schneider, Peter; Elst, Guenter; Engelhardt, Manfred
Presentation
2019HBM and ASIC silicon interposer
Puschmann, René; Heinig, Andy
Conference Paper
2019Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System
Steinhardt, Alexander; Papaioannou, Dimitrios; Heinig, Andy; Schneider, Peter
Book Article
2019Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Becker, Karl-Friedrich; Böttcher, Mathias; Schiffer, Michael; Pötter, Harald; Brockmann, Carsten; Freimund, Damian; Tschoban, Christian; Windrich, Frank; Braun, Tanja; Hopsch, Fabian; Heinig, Andy; Voigt, Sven; Baum, Mario; Hofmann, Lutz; Lang, Klaus-Dieter
Conference Paper
2019Very-Thin System-in-Package Technology for Structural Analysis
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Conference Paper
2018Antenna integration technologies for 5G car-application
Hopsch, F.; Heinig, A.
Conference Paper
2018Design of on-chip RFID transponder antennas
Heinig, Andreas
Conference Paper
2018Design of On-Chip RFID Transponder Antennas
Heinig, Andreas
Presentation
2018Electrical Characterization of a High Speed HBM Interface for a Low Cost Interposer
Dittrich, M.; Heinig, A.; Hopsch, F.
Conference Paper
2018Heterogeneous interposer based integration of chips onto interposer to achieve high speed interfaces for ADC application
Chaudhary, M.W.; Heinig, A.
Conference Paper
2018High speed interfaces for chip to chip communication on interposer based integration
Chaudhary, M.W.; Heinig, A.
Conference Paper
2018Packaging and board design for 5G and millimeter wave applications
Heinig, Andy
Presentation
2018Simulation, testing and implementation of temperature-reduction solutions on a high-power thermal demonstrator
Heinig, Andy; Papaioannou, Dimitrios
Presentation
2018Why use an assembly design kit and assembly design flow?
Heinig, Andy
Electronic Publication
2017ASIC zur Ansteuerung und Signalerfassung eines CMUT
Pietzsch, Marcus; Weder, Andreas; Heinig, Andreas; Amelung, Jörg; Koch, Sandro; Kircher, Marco
Conference Paper
2017CMOS-design of a cascadable front-end ASIC for capacitive micromachined ultrasonic transducer (CMUT) arrays
Weder, Andreas; Koch, Sandro; Pietzsch, Marcus; Heinig, Andreas; Kircher, Marco; Lange, Nicolas; Amelung, Jörg
Conference Paper
2017CMOS-design of a cascadable front-end ASIC for capacitive micromachined ultrasonic transducer (CMUT) arrays
Weder, Andreas; Koch, Sandro; Pietzsch, Marcus; Heinig, Andreas; Kircher, Marco; Lange, Nicolas; Amelung, Jörg
Presentation
2017CMOS-design of a cascadable front-end ASIC for CMUT arrays
Koch, Sandro G.; Weder, Andreas; Pietzsch, Marcus; Heinig, Andreas; Kircher, Marco; Grafe, Mario; Lange, Nicolas; Amelung, Jörg
Presentation
2017Comparison between thermal simulations and experimental measurements on an advanced microelectronics test-system
Papaioannou, Dimitrios; Heinig, Andy
Conference Paper
2017Heterogeneous Interposer Based Integration of Chips with Copper Pillars and C4 Balls to Achieve High Speed Interfaces for ADC Application
Dittrich, Michael; Heinig, Andy; Hopsch, Fabian; Trieb, Robert
Conference Paper
2017High speed interfaces for chip communication on interposer based integration
Chaudhary, Muhammad Waqas; Heinig, Andy
Presentation
2017Interposer-based smartcard system with active wireless communication
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Conference Paper
2017Simulation-based design methodology for heterogeneous systems at package-level utilizing XML and XSLT
Fischbach, Robert; Heinig, Andy; Lienig, Jens
Conference Paper
2016Adaptives Prothesensystem - Entwicklung eines Prothesensystems zur Optimierung und adaptiven Anpassung der ossären Verankerung von Gelenkendoprothesen
Rotsch, Christian; Grätz, Hagen; Kluess, Daniel; Gille, Katarina; Heinig, Andreas; Schulze, Christian; Bader, Rainer; Hunger, Sandra; Töppel, Thomas; Drossel, Welf-Guntram
Conference Paper
2016Adjustable bone fixation of an artificial hip stem by using an intergrated sensor actuator system
Rotsch, Christian; Gille, Katarina; Hunger, Sandra; Heinig, Andreas; Grätz, Hagen; Schulze, Christian; Bader, Rainer; Drossel, Welf-Guntram; Ettrichrätz, Martin; Töppel, Thomas
Abstract
2016Advanced System Integration für hochintegrierte Sensoren im Umfeld von Industrie-4.0-Anwendungen
Heinig, Andy; Dietrich, Michael; Hopsch, Fabian
Conference Paper
2016Back-end-of-line integration technology of capacitive micromachined ultrasonic transducers (CMUT)
Amelung, Jörg; Klemm, Markus; Elsäßer, Linus; Kircher, Marco; Weder, Andreas; Pietzsch, Marcus; Heinig, Andreas; Müller, Michael; Grüger, Heinrich
Conference Paper
2016Back-End-of-Line integration technology of capacitive micromachined ultrasonic transducers (CMUT)
Koch, Sandro; Amelung, Jörg; Elsäßer, Linus; Kircher, Marco; Weder, Andreas; Pietzsch, Marcus; Heinig, Andreas; Müller, Michael
Presentation
2016Co-design of CML IO and interposer channel for low area and power signaling
Chaudhary, Muhammad Waqas; Heinig, Andy
Conference Paper
2016Cor/log BAN BT a wearable battery powered mHealth data logger and telemetry unit for multiple vital sign monitoring
Hilbel, T.; Feilner, S.; Struck, M.; Hofmann, C.; Heinig, A.; Katus, H.A.
Conference Paper
2016Design challenges in interposer-based 3-D memory logic interface
Heinig, A.; Chaudhary, M.W.; Fischbach, R.; Dittrich, M.
Journal Article
2016Entwurfsplattform für SiP in medizintechnischen Anwendungen
Heinig, Andy; Fischbach, Robert
Report
2016High speed interfaces between chips mounted with different integration technologies on an interposer
Chaudhary, Muhammad Waqas; Heinig, Andy
Conference Paper
2016High speed serial interfaces in 2.5D integrated systems
Chaudhary, Waqas Muhammad; Heinig, Andy
Conference Paper
2016Der intelligente Mobilitätsassistent - Unterstützung der autonomen Mobilität älterer Menschen
Weder, Andreas; Pietzsch, Marcus; Heinig, Andreas
Presentation
2016Interposer based integration to achieve high speed interfaces for ADC application
Chaudhary, Muhammad Waqas; Heinig, Andy; Dittrich, Michael
Conference Paper
2016Mobilitätsassistent "MOVEAS" - Unterstützung der Mobilität älterer Menschen
Weder, Andreas; Pietzsch, Marcus; Heinig, Andreas
Presentation
2016Model abstraction of 3D-integrated/interposer-based high performance systems for faster (thermal) simulation
Heinig, Andy; Papaioannou, Dimitrios; Fischbach, Robert
Conference Paper
2016Overview of 3D CAD design tools
Heinig, Andy; Fischbach, Robert
Book Article
2016Silicon interposer interconnect structures analysis - 3D full wave simulations and measurements
Scogna, A.C.; Kostka, D.; Troescher, M.; Steinhardt, A.; Trieb, R.; Heinig, A.; Henkel, A.
Conference Paper
2015Characteristics and process stability of complete electrical interconnection structures for a low cost interposer technology
Dittrich, Michael; Steinhardt, Alexander; Heinig, Andy; Wojnowski, M.; Pressel, K.; Wolf, Jürgen
Conference Paper
2015Current and future 3D activities at Fraunhofer
Heinig, A.; Chaudhary, M.W.; Schneider, P.; Ramm, P.; Weber, J.
Conference Paper
2015Enabling automatic system design optimization through assembly design kits
Heinig, Andy; Fischbach, Robert
Conference Paper
2015Investigation of chip-to-chip interconnection structures for high data rates on a low cost silicon interposer
Dittrich, Michael; Heinig, Andy
Conference Paper
2015Polymer energy harvester for powering wireless communication systems
Costache, Florenta; Schirrmann, Christian; Seifert, Ruben; Bornhorst, Kirstin; Pawlik, Boscij; Despang, Hans-Günter; Heinig, Andreas
Journal Article, Conference Paper
2015Self-Organizing Mobile Multi-Sensor Surveillance Platform for Emergency Management Situations
Noack, Alexander; Weder, Andreas; Heinig, Andreas
Presentation
2015Technology options and their influence on routing for interposer-based memory processor integration
Heinig, Andy
Electronic Publication
2015Thermal and mechanical simulations for the improvement of the lifespan of highly-integrated systems
Heinig, Andy; Papaioannou, Dimitrios
Conference Paper
2015Thermal considerations for systems with high speed memories
Heinig, A.; Papaioannou, D.; Fischbach, R.
Conference Paper
2015Untersuchungen an Hard- und Firmware für ein fehlertolerantes Sensornetzwerk, welches in faserverstärkte Verbundwerkstoffe integrierbar ist
Bartl, Clemens
: Heinig, Andreas (Betr.); Fischer, Wolf-Joachim (Betr.)
Thesis
2014Automatic footprint compaction and bond wire placement for bare die chips stacks
Dittrich, Michael; Heinig, Andy; Schneider, Peter
Conference Paper
2014Design für Vertikale 3D Systemintegration in mm-Wellen Anwendungen
Heinig, Andy; Fischbach, Robert
Report
2014Design rule check and layout versus schematic for 3D integration and advanced packaging
Fischbach, R.; Heinig, A.; Schneider, P.
Conference Paper
2014Effizienter Design Rule Check von 3D Systemaufbauten mit einer hierarchischen XML-basierten Modellierungssprache
Fischbach, Robert; Dittrich, Michael; Heinig, Andy
Conference Paper
2014Euclidean move surface decomposition of non-planar surfaces for the electronic system design
Steinhardt, Alexander; Heinig, Andy
Conference Paper
2014Interposer based wide IO processor integration
Heinig, Andy; Fischbach, Robert; Dittrich, Michael
Conference Paper