Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021Strategy to characterize electromigration short length effects in Cu/low-k interconnects
Zhang, James; Kraatz, Matthias; Hauschildt, Meike; Choi, Samuel; Clausner, André; Zschech, Ehrenfried; Gall, Martin
Conference Paper
2017Low ppm failure analysis for advanced Cu and Cu alloy on-chip wiring
Kraatz, Matthias; Hauschildt, Meike; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2016TEM investigation of time-dependent dielectric breakdown mechanisms in Cu/Low-k interconnects
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Rosenkranz, Rüdiger; Aubel, Oliver; Hauschildt, Meike; Zschech, Ehrenfried
Journal Article
2015In situ time-dependent dielectric breakdown in the transmission electron microscope: A possibility to understand the failure mechanism in microelectronic devices
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Gisela; Aubel, Oliver; Beyer, Armand; Hauschildt, Meike; Zschech, Ehrenfried
Journal Article
2015In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Aubel, Oliver; Vogel, Norman; Hauschildt, Meike; Beyer, Armand; Engelmann, Hans Jürgen; Zschech, Ehrenfried
Journal Article
2014Advanced metallization concepts and impact on reliability
Hauschildt, Meike; Hintze, Bernd; Gall, Martin; Koschinsky, Frank; Preuße, Axel; Bolom, Tibor; Nopper, Markus; Beyer, Armand; Aubel, Oliver; Talut, Georg; Zschech, Ehrenfried
Journal Article
2014Electromigration void nucleation and growth analysis using large-scale early failure statistics
Hauschildt, Meike; Gall, Martin; Hennesthal, Christian; Talut, Georg; Aubel, Oliver; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms
Yeap, Kong Boon; Gall, Martin; Liao, Zhongquan; Sander, Christoph; Mühle, Uwe; Justison, Patrick; Aubel, Oliver; Hauschildt, Meike; Beyer, Armand; Vogel, Norman; Zschech, Ehrenfried
Journal Article
2009Geometry and microstructure effect on EM-induced copper interconnect degradation
Zschech, Ehrenfried; Ho, Paul S.; Schmeißer, Dieter; Meyer, Moritz Andreas; Vairagar, Anand V.; Schneider, Gerd; Hauschildt, Meike; Kraatz, Matthias; Sukharev, Valeriy
Journal Article