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| 2018 | Thermal transient measurement and modelling of a power cycled flip-chip LED module
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rosc, J.; Hammer, R.; Goullon, L.; Hutter, M.; Schrank, F.; Hörth, S.; Kraker, E. | Journal Article |
| 2017 | Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation
Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E. | Journal Article |
| 2016 | Advanced 3D failure characterization in multi-layered PCBs
Grünwald, E.; Hammer, R.; Rosc, J.; Maier, G.A.; Bärnthaler, M.; Cordill, M.J.; Brand, S.; Nuster, R.; Krivec, T.; Brunner, R. | Journal Article |
| 2016 | Investigation of the temperature-dependent heat path of an LED module by thermal simulation and design of experiments
Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E. | Conference Paper |
| 2015 | Where does the Thermospheric Ionospheric GEospheric Research (TIGER) program go?
Schmidtke, Gerhard; Avakyan, S.V.; Berdermann, J.; Bothmer, V.; Cessateur, G.; Ciraolo, L.; Didkovsky, L.; Dudok de Wit, T.; Eparvier, F.G.; Gottwald, A.; Haberreiter, M.; Hammer, R.; Jacobi, C.; Jakowski, N.; Kretzschmar, M.; Lilensten, J.; Pfeifer, Marcel; Radicella, S.M.; Schäfer, Robert; Schmidt, W.; Solomon, S.C.; Thuillier, G.; Tobiska, W.K.; Wieman, S.; Woods, T.N. | Journal Article |
| 2002 | Nondestructive testing of damage layers in semiconductor materials by surface acoustic waves
Schneider, D.; Stiehl, E.; Hammer, R.; Franke, A.; Riegert, R.; Schülke, T. | Conference Paper |
| 2001 | Impact of diamond geometry on removal mechanisms during machining of GaAs
Uhlmann, E.; Engel, H.; Hammer, R.; Paesler, C. | Conference Paper |
| 1999 | Non-destructive testing of damage layers in GaAs wafers by surface acoustic waves
Schneider, D.; Hammer, R.; Jurisch, M. | Journal Article |
| 1999 | Single grain scratch tests on GaAs for the determination of relevant engaging parameters for a ductile material removal
Uhlmann, E.; Engel, H.; Hammer, R.; Paesler, C. | Conference Paper |