Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016Non-conductive film (NCF) underfill: Materials, performance, and evolution to next generation devices
Anzures, E.; Morganelli, P.; Barr, R.; Calvert, J.; Dhoble, A.; Fleming, D.; Kim, J.K.; Lei, H.; Grafe, J.; Haberland, J.
Conference Paper
2014Printed electroluminescent structures for smart cards
Wróblewski, G.; Sloma, M.; Kallmayer, C.; Marques, J.; Haberland, J.; Janczak, D.; Jakubowska, M.
Conference Paper
2012Heterogenous integration - packaging on and in organic substrates
Becker, Karl-Friedrich; Braun, T.; Bauer, J.; Böttcher, L.; Ostmann, A.; Pahl, B.; Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2012Lignin in der Elektronik
Rückschloss, Jana; Schmidt, Ralf; Müller, Jutta; Kallmayer, Christine; Haberland, Julian
Conference Paper
2010Design and Characterization of a Small Encapsulated UHF RFID Tag for Wood Log Monitoring
Ohnimus, F.; Haberland, J.; Tschoban, C.; Ndip, I.; Heumann, K.; Kallmayer, C.; Guttowski, S.; Lang, K.-D.
Conference Paper
2010New packaging and interconnect technologies for ultra thin chips
Kallmayer, C.; Aschenbrenner, R.; Haberland, J.; Reichl, H.
Conference Paper
2010Ultrathin 3D ACA flipchip-in-flex technology
Haberland, J.; Becker, M.; Lutke-Notarp, D.; Kallmayer, Ch.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Super Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology - Reliability Investigations and Applications
Haberland, J.; Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Einbettung aktiver und passiver Komponenten in die Leiterplatte
Löher, T.; Pahl, B.; Haberland, J.; Vieroth, R.; Kallmeyer, C.; Neumann, A.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article
2004Ultra thin flip chip interconnects
Haberland, J.; Kallmayer, C.
Journal Article
2003Reliability of integrated passive components
Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001Fundamental studies of isotropic conductive adhesives focused on the current loadability of ICA for flip chip applications
Haberland, J.; Kallmeyer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper