Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Zuverlässigkeitsauslegung eines piezoelektrischen Energy Harvesters
Wittler, Olaf; Hölck, Ole; Benecke, Stephan; Dobs, Tom; Dijk, Marius van; Keller, Jürgen; Schulz, Marcus; Bader, Volker; Braun, Tanja; Lang, Klaus-Dieter
Conference Paper
2016Characterization of anodic bondable LTCC for wafer-level packaging
Hu, Xiaodong; Bäuscher, Manuel; MacKowiak, Piotr; Zhang, Yucheng; Hoelck, Ole; Walter, Hans; Ihle, Martin; Ziesche, Steffen; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klausdieter; Ngo, Haduong
Conference Paper
2015Influence of humidity on reliability of plastic packages
Braun, Tanja; Bauer, Jörg; Becker, Karl-Friedrich; Hölck, Ole; Walter, Hans; Dijk, M. van; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2015A novel and practical method for in-situ monitoring of interface delamination by local thermal diffusivity measurement
Wunderle, Bernhard; Schulz, M.; Braun, Tanja; May, D.; Bauer, Jörg; Hölck, Ole; Walter, Hans; Keller, J.
Conference Paper
2014Development of process and design criteria for stress management in through silicon vias
Hölck, Ole; Nuss, Max; Grams, Arian; Prewitz, Tobias; John, Peggy; Fiedler, Conny; Böttcher, Matthias; Walter, Hans; Wolf, M. Jürgen; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2014Grenzflächendiffusions- und Adhäsionsverhalten von Epoxidharzen für mikroelektronische Sensorapplikationen
Walter, Hans; Bauer, Jörg; Braun, Tanja; Hölck, Ole; Wunderle, Bernhard; Schulz, Markus; Keller, Jürgen; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2013Gas sorption isotherms in swelling glassy polymers - detailed atomistic simulations
Hölck, Ole; Böhning, Martin; Heuchel, Matthias; Siegert, Martin R.; Hofmann, Dieter
Journal Article
2013Mechanically relevant chemical shrinkage of epoxy molding compounds
Sousa, Micaela F.; Hölck, Ole; Braun, Tanja; Bauer, Jörg; Walter, Hans; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2013Moisture induced swelling in epoxy moulding compounds
Walter, Hans; Hölck, Ole; Dobrinski, Heiko; Stuermann, J.; Braun, Tanja; Bauer, Jörg; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2013Pull-Out Testing of SWCNTs Simulated by Molecular Dynamics
Hartmann, Steffen; Wunderle, Bernhard; Hölck, Ole
Journal Article
2013Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, Ole; Bauer, Jörg; Braun, Tanja; Walter, Hans; Wittler, Olaf; Wunderle, Bernhard; Lang, Klaus-Dieter
Journal Article
2012Charakterisierung des feuchteinduzierten Schwellverhaltens von mikroelektronisch relevanten Werkstoffsystemen
Walter, Hans; Bauer, Jörg; Braun, Tanja; Hölck, Ole; Wunderle, Bernhard; Keller, Jürgen; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2012Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, Ole; Bauer, Jörg; Wittler, Olaf; Michel, Bernd; Wunderle, Bernhard
Journal Article
2012In-situ - Characterization of moisture induced swelling behaviour of microelectronic relevant polymers
Walter, Hans; Bauer, Jörg; Braun, Tanja; Hölck, Ole; Wunderle, B.; Wittler, O.
Conference Paper
2012Microelectronics packaging materials: Correlating structure and property using molecular dynamics simulations
Hölck, Ole; Wunderle, Bernhard
Book Article
2012Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, Ole; Bauer, Jörg; Braun, Tanja; Walter, Hans; Wittler, Olaf; Wunderle, Bernhard
Conference Paper
2011Analysis of moisture and time dependent material parameters
Walter, Hans; Hölck, Ole
Conference Paper, Journal Article
2011Application of hybrid methods to analyse interface properties of packaging materials on miniaturized specimens
Walter, Hans; Wunderle, Bernhard; Keller, Jürgen; Hölck, Ole; Wittler, Olaf; Michel, Bernd
Conference Paper
2011Experimental contact angle determination and characterisation of interfacial energies by molecular modelling of chip to epoxy interfaces
Hölck, Ole; Bauer, Jörg; Wittler, Olaf; Lang, Klaus Dieter; Michel, Bernd; Wunderle, Bernhard
Conference Paper
2011Fracture-mechanical interface characterisation for thermo-mechanical co-design
Wunderle, Bernhard; Schulz, Marcus; Keller, Jürgen; Schlottig, Gerd; Maus, Ingrid; May, Daniel; Hölck, Ole; Pape, Heinz; Michel, Bernd
Journal Article, Conference Paper
2011Multiscale perspectives of interface delamination in microelectronic packaging applications
Iwamoto, Nancy; Hölck, Ole; Noijen, Sander
Journal Article