Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2014Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
Ndip, I.; Zoschke, K.; Löbbicke, K.; Wolf, M.J.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Journal Article
2013Comparison of methods for impedance modeling of power distribution networks
Tschoban, C.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.
Conference Paper
2013Development of a 40 Watts 5 kV converter using Piezoelectric Transformer for Rheoelectrical damper application
Yang, Y.; Radecker, M.; Guttowski, S.; Lang, K.-D.; Fontana da Silva, B.; Bellinaso, L.V.; Engleitner, R.; Vazquez Carazo, A.
Conference Paper
2013Drahtlose Sensorsysteme für die zustandsorientierte Instandhaltung und Logistik
Thomasius, R.; Guttowski, S.; Brockmann, C.; Benecke, S.; Kravcenko, E.; Niedermayer, M.; Nachsel, R.
Journal Article
2013Electrical modeling of the power delivery to an LED array packaged in a textile
Curran, B.; Öz, A.; Linz, Torsten; Ndip, Ivan; Guttowski, Stephan; Lang, Klaus-Dieter
Conference Paper
2013Electromagnetic interactions between interconnected patch-ring (IPR) structures and planes in electronic packages and PCBs
Ndip, I.; Bierwirth, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2013Modeling and minimizing the inductance of bond wire interconnects
Ndip, I.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Conference Paper
2012Analysis and comparison of methods for extracting the inductance and capacitance of TSVs
Ndip, I.; Lobbicke, K.; Zoschke, K.; Guttowski, S.; Wolf, J.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Characterization of interconnects and RF components on glass interposers
Ndip, I.; Töpper, M.; Löbbicke, K.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Journal Article
2012Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Modelling the shape, length and radiation characteristics of bond wire antennas
Ndip, I.; Oz, A.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2012Novel conformal antenna concept for security applications
Tschoban, C.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.
Conference Paper
2012Robust 3D radio sensor systems with embedded active and passive components for industrial applications
Niedermayer, Michael; Scholtz, Hendrik; Bonim, Thomas; Guttowski, Stephan; Lang, Klaus-Dieter
Conference Paper
2012Systematic design and optimization of bond wire antennas using the M3-approach
Ndip, I.; Guttowski, S.; Reichl, H.; Lang, K.D.
Conference Paper
2011Electronics condition monitoring for improving sustainability of power electronics
Middendorf, A.; Nissen, N.; Guttowski, S.; Lang, K.-D.
Conference Paper
2011High-frequency modeling of TSVs for 3-D chip integration and silicon interposers considering skin-effect, dielectric quasi-TEM and slow-wave modes
Ndip, I.; Curran, B.; Lobbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2011The impact of moisture absorption on the electrical characteristics of organic dielectric materials
Curran, B.; Ndip, I.; Bauer, J.; Guttowski, S.; Lang, K.D.; Reichl, H.
Conference Paper
2011Integration and evaluation of electrically small 868 MHz PCB antennas for wireless USB stick
Ohnimus, F.; Hoherz, C.; Hampicke, M.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.; Lumbeck, D.; Kreitmair, M.
Conference Paper
2011Integration of planar antennas considering electromagnetic interactions at board level
Ohnimus, F.; Fotheringham, G.; Ndip, I.; Engin, A.E.; Guttowski, S.; Reichl, H.; Lang, K.D.
Journal Article
2011Modeling and optimization of bond wires as transmission lines and integrated antennas at RF/microwave frequencies
Ndip, I.; Tschoban, C.; Schmitz, S.; Ostmann, A.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2011Überwachungssystem für eine Vielzahl von Objekten
Guttowski, Stephan; Zurwehn, Volker; Hefer, J.; Wussow, K.
Patent
2010Design and Characterization of a Low Profile Miniaturized UHF PIFA for Compact Wireless Sensor Nodes
Ohnimus, F.; Erxleben, R.; Tschoban, C.; Ndip, I.; Niedermayer, M.; Scholtz, H.; Bonim, T.; Guttowski, S.; Lang, K.-D.
Conference Paper
2010Design and Characterization of a Small Encapsulated UHF RFID Tag for Wood Log Monitoring
Ohnimus, F.; Haberland, J.; Tschoban, C.; Ndip, I.; Heumann, K.; Kallmayer, C.; Guttowski, S.; Lang, K.-D.
Conference Paper
2010Design and comparison of 24 GHz patch antennas on glass substrates for compact wireless sensor nodes
Ohnimus, F.; Maaß, U.; Fotheringham, G.; Curran, B.; Ndip, I.; Fritsch, T.; Wolf, J.; Guttowski, S.; Lang, K.-D.
Journal Article
2010Equivalent circuit modeling of signal vias considering their return current paths
Ndip, I.; Ohnimus, F.; Löbbicke, K.; Tschoban, C.; Bierwirth, M.; Guttowski, S.; Reichl, H.
Conference Paper
2010High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures
Erxleben, R.; Ndip, I.; Brusberg, L.; Schroeder, H.; Toepper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2010Managing the return-currents of signal vias in organic and silicon substrates
Ndip, I.; Löbicke, K.; Bierwirth, M.; Tschoban, C.; Curran, B.; Erxleben, R.; Ohnimus, F.; Maaß, U.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010A methodology for combined modeling of skin, proximity, edge, and surface roughness effects
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Journal Article
2010Miniaturized implantable wireless sensor system for realtime measurement of well-being of fishes
Brockmann, C.; Großer, V.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2010Modeling and analysis of coplanar bonding wires for high-speed applications
Tschoban, C.; Ndip, I.; Schmidt, S.; Guttowski, S.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H.
Conference Paper
2010Modeling the impact of return-path discontinuity on interconnects for Gb/s applications
Ndip, I.; Löbbicke, K.; Tschoban, C.; Töpper, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2010Modeling, quantification, and reduction of the impact of uncontrolled return currents of vias transiting multilayered packages and boards
Ndip, I.; Ohnimus, F.; Löbbicke, K.; Bierwirth, M.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Journal Article
2010Eine neue planare Funktionsstruktur zur Entkopplung hochfrequenter Störungen auf Schaltungsträgern
Ndip, I.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010RFID - Theoretische Konzepte und Anwendungsbeispiele
Fotheringham, G.; Ohnimus, F.; Maaß, U.; Ndip, I.; Guttowski, S.; Reichl, H.
Journal Article
2010Sensorsystem zum Implantieren in einen Körper
Großer, V.; Guttowski, S.; Niedermayer, M.
Patent
2010Simulation, measurement and analysis of electromagnetic band gap structures for noise suppression in electronic systems
Ndip, I.; Bierwirth, M.; Tschoban, C.; Maab, U.; Erxleben, R.; Guttowski, S.; Reichl, H.
Conference Paper
2010A system-oriented approach for modeling energy harvesting devices in wireless sensor-modules
Kravcenko, E.; Niedermayer, M.; Guttowski, S.; Nissen, N.F.; Benecke, S.; Middendorf, A.; Reichl, H.
Conference Paper
2010Eine systematische Entwurfsmethode zur Sicherstellung der elektromagnetischen Zuverlässigkeit in Mikrosystemen
Ndip, I.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010A SystemC based framework for the evaluation of proactive power-management approaches in distributed energy harvesting systems
Thomasius, R.; Guttowski, S.
Conference Paper
2010TSV modeling considering signal integrity issues
Ndip, I.; Curran, B.; Löbbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2009A comparative study of microstrip, stripline and coplanar lines on different substrate technologies for high-performance applications
Erxleben, R.; Ndip, I.; Brusberg, L.; Schröder, H.; Töpper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2009Comparison of electromagnetic field distribution in vicinity of patch and slot antennas
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2009Design and integration of a planar EBG for UWB applications
Ndip, I.; Bierwirth, M.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2009Electrical design and characterization of elevated antennas at PCB-level
Ohnimus, F.; Podlasly, A.; Bauer, J.; Ostmann, A.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Electrical modeling and analysis of the impact of slits on microstrip lines in thin film polymer layers
Ndip, I.; Töpper, M.; Becker, K.-F.; Hirte, M.; Eidner, I.; Fischer, T.; Curran, B.; Bauer, J.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2009The impacts of dimensions and return current path geometry on coupling in single ended through silicon vias
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology
Dieckerhoff, S.; Wernicke, T.; Kallmayer, C.; Guttowski, S.; Reichl, H.
Journal Article
2009Modeling and Analysis of a New Packaging Structure for Noise Isolation in Mixed-Signal Systems
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Modeling and analysis of electromagnetic field distribution in vicinity of patch antennas at millimeter-wave frequencies
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2009Modeling and comparison of patch antenna configurations for 77 GHz radar applications
Ndip, I.; Hirte, M.; Guttowski, S.; Reichl, H.
Conference Paper
2009Modeling and quantification of conventional and Coax-TSVs for RF applications
Ndip, I.; Curran, B.; Guttowski, S.; Reichl, H.
Conference Paper
2009A novel Interconnected Patch-Ring (IPR) structure for noise isolation
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009On the integration of a 2.4 GHz ISM band antenna in proximity to transmission lines
Ndip, I.; Hirte, M.; Guttowski, S.; Reichl, H.
Conference Paper
2009On the quantification and improvement of the models for surface roughness
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009On the quantification of the state-of-the-art models for skin-effect in conductors, including those with non-rectangular cross-sections
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Parameterization of bent coils on curved flexible surface substrates for RFID applications
Fotheringham, G.; Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009RFID - Theoretische Konzepte und Anwendungsbeispiele
Fotheringham, G.; Ohnimus, F.; Maaß, U.; Ndip, I.; Guttowski, S.; Reichl, H.
Book Article
2009SENESCOPE: A design tool for cost optimization of wireless sensor nodes
Niedermayer, M.; Richter, C.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2009Study on shielding effectiveness of mushroom-type electromagnetic bandgap structures in close proximity to patch antennas
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2008Automatisierter Entwurf von vertikal integrierten System-In-Package-Lösungen
Richter, C.; Guttowski, S.; Reichl, H.
Journal Article
2008The Dawn of self-sufficient micro systems
Niedermayer, M.; Hefer, J.; Guttowski, S.
Journal Article
2008Design and Analysis of a Bent Antenna-coil for a HF RFID Transponder
Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2008An efficient and broadband slot antenna for 60 GHz Wireless applications
Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2008Mikrosysteme zur Sicherung der Fleischqualität
Thomasius, R.; Kim, J.-U.; Guttowski, S.; Reichl, H.
Journal Article
2008Minimizing electromagnetic interference in power-ground cavities
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2008Modeling and analysis of return-current paths for microstrip-to-microstrip via transitions
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2008On the interactions between mushroom-type EBGs and striplines
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2008Studying the interactions between mushroom-type EBGs, transmission lines and vias
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2008Vorrichtung zur Unterdrueckung der Ausbreitung einer elektromagnetischen Stoerung in einem elektrischen System und ein elektrisches System mit derselben
Ndip, I.; Guttowski, S.; Reichl, H.
Patent
2007Accurate characterization of package and board components for efficient system level signal integrity analysis
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2007Design for miniaturization of wireless sensor nodes based on 3D-packaging technologies
Niedermayer, M.; Thomasius, R.; Polityko, D.-D.; Schrank, K.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2007Development of an M3-approach for optimal electromagnetic reliability in system packages
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2007An efficient methodology for design and implementation of embedded bandpass filters for RF/wireless applications
Baba, M.; Guttowski, S.; Reichl, H.
Conference Paper
2007Experimental characterization methods for power MOSFET assemblies
Wernicke, T.; Dieckerhoff, S.; Kirfe, T.; Feix, G.; Guttowski, S.; Reichl, H.
Conference Paper
2007Kostenaspekte beim Entwurf von Funksensorknoten
Niedermayer, M.; Hefer, J.; Guttowski, S.; Thomasius, R.; Reichl, H.
Conference Paper
2007Leistungselektronisches Modul
Guttowski, S.
Patent
2007Linking geometrical and electrical parameters of flex substrate vertical interconnects for 2.5D system-in-package design
Maaß, U.; Polityko, D.-D.; Richter, C.; Ndip, I.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2007Measurement techniques for the thermal characterization of power modules
Wernicke, T.; Dieckerhoff, S.; Guttowski, S.; Reichl, H.
Conference Paper
2007Methodical design of EMI filters for power electronics
Hoene, E.; Lissner, A.; Guttowski, S.; Reichl, H.
Conference Paper
2007Modulares mikroelektronisches Bauteil
Niedermayer, M.; Ostmann, A.; Guttowski, S.; Grundmann, S.; Thomasius, R.; Polityko, D.
Patent
2007Optimal Electrical Design of System Packages and Integrated Components using the M3-Approach
Ndip, I.; Salhi, F.; Maaß, U.; Fotheringham, G.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2007Predicting the influence of placement of passive components on EMI behaviour
Lissner, E.; Hoene, S.; Guttowski, S.; Reichl, H.
Conference Paper
2007Prediction of EMI behaviour in terms of passive component placement
Hoene, E.; Lissner, A.; Guttowski, S.
Conference Paper
2006Behaelter und Vorrichtung zum Detektieren von in einem Innenraum des Behaelters befindlichen Gegenstaenden
Guttowski, S.; Niedermayer, M.
Patent
2006Efficient HF modeling and model parameterization of induction machines for time and frequency domain simulations
Schinkel, M.; Weber, S.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006Entwurf kleinster energieautarker Funksensoren
Thomasius, R.; Niedermayer, M.; Polityko, D.-D.; Schrank, K.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006Hochfrequenzsender sowie Verfahren zu dessen Betrieb
Niedermayer, M.; Hahn, R.; Guttowski, S.; Thomasius, R.; Morgenstern, H.; Schrank, K.
Patent
2006Integration technology parameters for physical design of vertical system-in-package
Polityko, D.; Guttowski, S.; Reichl, H.
Conference Paper
2006Mikroantenne fuer Nahfeldkommunikation
Niedermayer, M.; Ndip, I.; Hahn, R.; Guttowski, S.
Patent
2006Mikroelektronische Baugruppe und Verfahren zum Herstellen einer mikroelektronischen Baugruppe
Polityko, D.; Wenzel, S.; Jung, E.; Hefer, J.; Niedermayer, M.; Guttowski, S.
Patent
2006Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies
Niedermayer, M.; Guttowski, S.; Thomasius, R.; Polityko, D.; Schrank, K.; Reichl, H.
Conference Paper
2006Miniaturized Wireless Sensors for Automotive Applications
Thomasius, R.; Grundmann, S.; Niedermayer, M.; Achterholt, R.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006Modellierung geschirmter Leistungskabel im Frequenzbereich der EMV
Weber, S.-P.; Linde, A.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006A novel methodology for defining the boundaries of geometrical discontinuities in electronic packages
Ndip, I.; Reichl, H.; Guttowski, S.
Conference Paper
2006Parasitic effects in EMI filters
Hoene, E.; Lissner, A.; Weber, S.-P.; Guttowski, S.; Reichl, H.
Conference Paper
2006Performance comparison of advanced power electronic packages for automotive applications
Dieckerhoff, S.; Guttowski, S.; Reichl, H.
Conference Paper
2006Predicting parasitics and inductive coupling in EMI-filters
Weber, S.-P.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006Reliable miniaturized wireless sensors for automotive applications
Thomasius, R.; Grundmann, S.; Niedermayer, M.; Achterholt, R.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006RF/Microwave Modeling of SiP Modules - A novel approach
Ndip, I.; Reichl, H.; Guttowski, S.
Conference Paper
2006Stapelbare Funktionsschicht fuer ein modulares mikroelektronisches System
Niedermayer, M.; Ostmann, A.; Morgenstern, H.; Guttowski, S.
Patent
2006Troubleshooting and fixing of inverter driven induction motor bearing currents in existing plants of large size
Guttowski, S.; Weber, S.; Schinkel, M.; John, W.; Reichl, H.
Conference Paper
2006Vorhersage von magnetischen Kopplungen in Filterschaltungen
Lissner, A.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
20052,5-Dimensional System-In-Package Integration - Technology Oriented Parameter Model For Physical Design
Polityko, D.D.; Guttowski, S.; Reichl, H.
Conference Paper
2005Component design considerations for active AC EMI-filters
Schinkel, M.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2005Design and evaluation of feedforward active ripple filters
Zhu, M.; Perrault, D.J.; Caliskan, V.; Neugebauer, T.C.; Guttowski, S.; Kassakian, J.G.
Journal Article
2005Packaging challenges in miniaturization
Kallmayer, C.; Niedermayer, M.; Guttowski, S.; Reichl, H.
Book Article
2005Physical design and technology parameters for vertical system-in-package integration
Polityko, D.-D.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2005Radio frequency characteristics of high power common-mode chokes
Weber, S.-P.; Schinkel, M.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2005Simulating Electromagnetic Interactions in High Power Density Converters
Hoene, E.; Guttowski, S.; Lissner, A.; Weber, S.; John, W.; Reichl, H.
Conference Paper
2004Design aspects of self-sufficient distributed MicroSystems
Niedermayer, M.; Polityko, D.-D.; Fotheringham, G.; Guttowski, S.; John, W.
Journal Article
2004EMV-Design von Umrichtern in der Praxis
Hoene, E.; Guttowski, S.
Conference Paper
2004Modeling induction machines for EMC-Analysis
Weber, S.-P.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2004On coupling with EMI capacitors
Weber, S.-P.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2003EMC issues in cars with electric drives
Guttowski, S.; Weber, S.; Hoene, E.; John, W.; Reichl, H.
Conference Paper
2003EMC issues of electric drives in automotive applications
Guttowski, S.; Weber, S.; Hoene, E.; John, W.; Reichl, H.
Conference Paper
2003EMI Coupling from Automotive Traction Systems
Weber, S.-P.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2003RF-properties of automotive traction batteries
Hoene, E.; Saikly, R.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper