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| 2008 | Global responsibility for green electronics and ICT
Griese, H.; Reichl, H.; Stobbe, L. | Conference Paper |
| 2008 | RoHS-like regulations worldwide
Müller, J.; Griese, H.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2007 | Global harmonization of RoHS-like regulations
Müller, J.; Griese, H.; Reichl, H. | Conference Paper |
| 2007 | Global impacts of the e-waste problem
Deubzer, O.; Griese, H.; Reich, H. | Conference Paper |
| 2007 | Global sustainable development needs advanced electronics
Griese, H.; Mueller, J.; Nissen, N.F.; Reichl, H.; Stobbe, L. | Conference Paper |
| 2007 | Status and impacts of RoHS-like regulations - the role of material bans in sustainable development
Deubzer, O.; Griese, H.; Zangl, S.; Andrae, A.; Reichl, H. | Conference Paper |
| 2006 | Eco-Design Strategies for Electronics Supply Chains Based on Product Material Declarations
Stobbe, L.; Schischke, K.; Hayashi, H.; Suga, T.; Griese, H. | Conference Paper |
| 2006 | Electronic systems from the perspective of sustainability and reliability
Oberender, C.; Middendorf, A.; Bochow-Neß, O.; Griese, H.-J.; Reichl, H. | Conference Paper |
| 2006 | Environmental-based regulations for electronics - From regional variety to internationally harmonized guidelines
Griese, H.; Müller, J.; Stobbe, L. | Conference Paper |
| 2006 | Investigation on value increase in inverse distribution process
Hayashi, H.; Suga, T.; Stobbe, L.; Schischke, K.; Griese, H. | Conference Paper |
| 2006 | Lebensdauerprognostik für Drahtbond-Verbindungen mittels der Life-Cycle-Unit
Middendorf, A.; Reichl, H.; Griese, H. | Conference Paper |
| 2005 | Approaches towards sustainable use and substitution of metals in electronics
Deubzer, O.; Griese, H.; Reichl, H. | Conference Paper |
| 2005 | Condition monitoring of automotive electronic systems with life cycle units
Middendorf, A.; Griese, H.; Hulsken, G.; Neß, O.; Reichl, H.; Schrank, K. | Conference Paper, Journal Article |
| 2005 | Eco-design and beyond - key requirements for a global sustainable development
Griese, H.; Stobbe, L.; Reichl, H.; Stevels, A. | Conference Paper |
| 2005 | Environmental aspects in automotive electronics
Pötter, H.; Griese, H.; Jürgens, G.; Müller, J.; Ness, O.; Reichl, H. | Conference Paper, Journal Article |
| 2005 | Forum: Umstellung Bleifrei
Müller, J.; Griese, H. | Conference Paper |
| 2005 | Global sustainable development and technological innovations
Griese, H.; Stobbe, L.; Müller, J.; Deubzer, O.; Middendorf, A. | Conference Paper |
| 2005 | Global sustainable development and technological innovations - Experiences from lead-free transition
Griese, H.; Stobbe, L.; Mueller, J.; Deubzer, O.; Middendorf, A. | Conference Paper |
| 2005 | Green MST design from a designer's perspective: How to base decisions on environmental issues
Schischke, K.; Middendorf, A.; Reichl, H.; Griese, H.; Kasper, M.; Ong, K. | Conference Paper |
| 2005 | Lifetime estimation for wire bond interconnections using life-cycle-information modules with implemented models
Middendorf, A.; Griese, H.; Reichl, H. | Conference Paper |
| 2005 | Marking of Electronic Components and Board Assemblies as RoHS Compatible
Stobbe, I.; Deubzer, O.; Griese, H.; Reichl, H. | Conference Paper |
| 2005 | Materials Trends in Electronics - Life Cycle Implications
Schischke, K.; Griese, H.; Mueller, J.; Reichl, H.; Zuber, K.H. | Conference Paper, Journal Article |
| 2005 | State of the Art in Material Declarations: Compliance Management and Usability for Eco-Design
Schischke, K.; Griese, H.; Mueller, J.; Stobbe, I. | Conference Paper |
| 2005 | Towards sustainable solutions
Griese, H. | Conference Paper |
| 2005 | Transition to lead free soldering - a great chance for a better understanding of materials and processes and green electronics
Müller, J.; Griese, H.; Schischke, K.; Stobbe, L. | Conference Paper |
| 2004 | Driving forces for future electronics
: Reichl, H.; Griese, H.; Pötter, H. | Conference Proceedings |
| 2004 | Environmental compatibility of electronics - a key towards local and global sustainable development
Griese, H.; Stobbe, L.; Middendorf, A.; Reichl, H. | Conference Paper |
| 2004 | Environmental management in semiconductor and printed circuit board industry in India - Part I: Survey results and case studies
Pandey, U.C.; Sethi, V.C.; Schischke, R.; Griese, H.; Reichl, H. | Conference Paper |
| 2004 | Environmental management in semiconductor and printed circuit board industry in India - Part II: Benchmarking and international best practice sharing
Schischke, K.; Pandey, U.C.; Sethi, V.C.; Griese, H.; Reichl, H. | Conference Paper |
| 2004 | Foreword to the special section of the Asian Green Electronics Conference (AGEC)
Liu, J.; Griese, H.J.; Chan, Y.-C. | Journal Article |
| 2004 | Green Electronics Trends - Meeting the Requirements of the European Market
Schischke, K.; Griese, H.; Reichl, H. | Conference Paper |
| 2004 | Implementing Cleaner Production in Semiconductor and Printed Circuit Board Industry in India
Sethi, V.C.; Pandey, U.C.; Schischke, K.; Griese, H.; Reichl, H. | Conference Paper |
| 2004 | IZM/EE-Toolbox - effiziente Screening-Bewertungsmethoden für ein Design umweltverträglicher elektronischer Produkte und Prozesse
Griese, H.; Stobbe, I.; Deubzer, O.; Hagelüken, M.; Middendorf, A.; Müller, J.; Pötter, H.; Schischke, K.; Zuber, K.-H. | Book Article |
| 2004 | Life cycle thinking for green electronics
Mueller, J.; Griese, H.; Schischke, K.; Stobbe, I.; Norris, G.A. | Conference Paper |
| 2004 | Quality Challenges of Reused Components
Stobbe, I.; Pötter, H.; Griese, H.; Fotheringham, G.; Reichl, H. | Conference Paper |
| 2004 | Reuse and lifetime extension strategies in the context of technology innovations, global markets, and environmental legislation
Griese, H.; Pötter, H.; Schischke, K.; Ness, O.; Reichl, H. | Conference Paper |
| 2004 | Sustainable Development of Microelectronic Technology Processes
Griese, H.; Schischke, K.; Reichl, H.; Stobbe, L. | Conference Paper |
| 2004 | Sustainable Use and Restrictions of Materials in the Electronics Industry
Deubzer, O.; Griese, H.; Reichl, H.; Madsen, J.; Wel, H. van der | Conference Paper |
| 2004 | Technological Innovation started by Environmental Concerns
Müller, J.; Hagelüken, M.; Griese, H.; Reichl, H. | Conference Paper |
| 2004 | Verfahren zum selektiven Gewinnen von Gold aus goldhaltigen Materialien
Schmidt, R.; Mueller, J.; Griese, H.; Hannemann, M.; Zuber, K. | Patent |
| 2004 | Welcome to the Jungle - Survival of the Fittest Environmental Screening Indicators?
Hagelüken, M.; Schischke, K.; Müller, J.; Griese, H. | Conference Paper |
| 2003 | Bleifreie elektronische Baugruppen
Müller, J.; Griese, H. | Conference Paper |
| 2003 | Cost-effectiveness and environmental aspects of flip chip bumping for system integration
Schischke, K.; Griese, H.; Müller, J.; Reichl, H. | Journal Article |
| 2003 | Embedded Life-Cycle Information Module
Middendorf, A.; Griese, H.; Grimm, W.M.; Reichl, H. | Conference Paper |
| 2003 | Embedded life-cycle information module for monitoring and identification of product use conditions
Middendorf, A.; Griese, H.; Grimm, W.M.; Reichl, H. | Conference Paper |
| 2003 | Environmental Risks of Mass Produced, Small and Cheap Products Regarding End-of-Life Scenarios
Müller, J.; Griese, H.; Hagelüken, M.; Reichl, H. | Conference Paper |
| 2003 | Integrating ecodesign into the development of technology processes
Griese, H.; Schischke, K.; Reichl, H.; Suga, T.; Stobbe, L. | Conference Paper |
| 2003 | Integration of environmental assessment tools in product development
Middendorf, A.; Petermann, C.; Reichl, H.; Griese, H.; Schrödl, J.; Reiner, A. | Conference Paper |
| 2003 | MikroNetz
Middendorf, A.; Griese, H.; Reichl, H. | Conference Paper |
| 2003 | MikroNetz - development of switched power supplies using Microsystem technology
Middendorf, A.; Griese, H.; Reichl, H. | Conference Paper |
| 2003 | Recyclinggerechtes Design im Aufwind
Müller, J.; Griese, H. | Journal Article |
| 2003 | Strategies to integrate life cycle engineering into technological developments - the 3G Greenbook Initiative
Griese, H.; Müller, J.; Stobbe, L.; Reichl, H.; Rick, K. | Conference Paper |
| 2003 | X-free mobile electronics - Strategy for sustainable development
Mueller, J.; Griese, H.; Hagelüken, M.; Middendorf, A.; Reichl, H. | Conference Paper |
| 2002 | Development of environmentally sound gold plating and recycling processes
Zuber, K.-H.; Griese, H.; Müller, J.; Schmidt, R. | Conference Paper |
| 2002 | Electronics Goes Green 2000+. A Challenge for the Next Millenium. Proceedings. Vol. 2: Special Lectures
Griese, H.; Pötter, H. | Conference Proceedings |
| 2002 | Fabric-based communication
Kallmayer, C.; Griese, H. | Journal Article |
| 2002 | Using Life Cycle Information to Improve the Reliability of Electronic Assemblies
Middendorf, A.; Griese, H.; Neß, O.; Reichl, H. | Conference Paper |
| 2002 | Using Life-Cycle Information for Reliability Assessment of Electronic Assemblies
Middendorf, A.; Griese, H.; Reichl, H.; Grimm, W. | Conference Paper |
| 2002 | Vorrichtung zur Transformation einer Primaerspannung in eine Sekundaerspannung mit mindestens einem Schaltnetzteil
Geneiss, V.; Middendorf, A.; Griese, H. | Patent |
| 2001 | Applied EcoDesign - Product characterization by sustainability indices
Griese, H.; Deubzer, O.; Müller, J.; Stobbe, L. | Conference Paper |
| 2001 | Bleifreie Elektronik. Weltweite Anstrengungen zur Substitution. Teil I
Zuber, K.-H.; Griese, H.; Müller, J. | Journal Article |
| 2001 | Bleifreie Elektronik. Weltweite Anstrengungen zur Substitution. Teil II
Zuber, K.-H.; Griese, H.; Müller, J. | Journal Article |
| 2001 | Challenging the Future - Ways Towards Sustainable Green Electronics
Müller, J.; Deubzer, O.; Griese, H.; Pötter, H.; Reichl, H. | Book Article |
| 2001 | Eco-analysis of wafer level bumping
Schischke, K.; Griese, H.; Müller, J. | Conference Paper |
| 2001 | Environmental aspects of microelectronics
Muller, J.; Griese, H.; Zuber, K.H.; Reichl, H.; Schischke, K. | Conference Paper |
| 2001 | Environmental friendly plating and deplating of gold in PCB manufacturing
Zuber, K.-H.; Griese, H.; Müller, J.; Schmidt, R. | Conference Paper |
| 2001 | Global Responsibility of Electronics
Griese, H.; Müller, J.; Reichl, H. | Conference Paper |
| 2001 | Global responsibility of electronics - Products and sustainability
Griese, H.; Müller, J.; Reichl, H. | Conference Paper |
| 2001 | Green polytronics
Griese, H.; Müller, J.; Hagelüken, M.; Reichl, H.; Zuber, K.-H. | Conference Paper |
| 2001 | How Electronics Technology Trends Translate into Environmental Trends
Nissen, N.F.; Griese, H. | Conference Paper |
| 2001 | Lead-free soldering - Future aspects of toxicity, energy and resource consumption
Deubzer, O.; Griese, H.; Suga, T. | Conference Paper |
| 2001 | Lead-free soldering - Toxicity, energy and resource consumption
Deubzer, O.; Hamano, H.; Suga, T.; Griese, H. | Conference Paper |
| 2001 | Life cycle inventory analysis and identification of environmentally significant aspects in semiconductor
Schischke, K.; Stutz, M.; Ruelle, J.-P.; Griese, H.; Reichl, H. | Conference Paper |
| 2001 | Meeting data requirements by using the IZM/EE-toolbox for a screening assessment of the environmental impacts of electronic products
Stobbe, I.; Middendorf, A.; Schischke, K.; Petermann, C.; Griese, H.; Müller, J.; Reichl, H. | Conference Paper |
| 2001 | On the way to green mobile products
Müller, J.; Griese, H.; Reichl, H. | Conference Paper |
| 2001 | Werkzeuge für Grüne Elektronik
Middendorf, A.; Schischke, K.; Stobbe, I.; Griese, H.; Reichl, H. | Journal Article |
| 2000 | Analysis of micromaterials
Schwencke, B.; Müller, J.; Griese, H. | Conference Paper |
| 2000 | Analytics of printed circuit boards for environmental assessment
Schwencke, B.; Müller, J.; Griese, H.; Altendorf, P. | Conference Paper |
| 2000 | Ecological and Economical Effects of Lead Free Soldering
Deubzer, O.; Suga, T.; Griese, H. | Conference Paper |
| 2000 | EE-Toolbox - A modular assessment system for the environmental optimization of electronics
Middendorf, A.; Nissen, N.F.; Griese, H.; Müller, J.; Pötter, H.; Reichl, H.; Stobbe, I. | Conference Paper |
| 2000 | Environmental assessment of lead free interconnection systems
Griese, H.; Müller, J.; Reichl, H.; Somi, G.; Stevels, A.; Zuber, K.-H. | Conference Paper |
| 2000 | Environmental Assessment Using the IZM/EE Toolbox
Nissen, N.F.; Griese, H.; Müller, J.; Middendorf, A.; Stobbe, I.; Reichl, H.; Funk, T. | Conference Paper |
| 2000 | Implementation of Environmental Issues in SMEs
Müller, J.; Griese, H.; Middendorf, A.; Nissen, N.F.; Teller, M. | Conference Paper |
| 1999 | Environmental aspects of lead-free interconnections
Griese, H. | Conference Paper |
| 1999 | Environmental aspects of PCB microintegration
Müller, J.; Griese, H.; Nissen, N.F.; Potter, H.; Reichl, H. | Conference Paper |
| 1999 | Environmental performance of mobile products
Ram, B.; Stevels, A.; Griese, H.; Middendorf, A.; Müller, J.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 1999 | Environmental screening of packaging and interconnection technologies
Nissen, F.; Griese, H.; Middendorf, A.; Müller, J.; Potter, H.; Reichl, H. | Conference Paper |
| 1999 | Environmentally Acceptable Gold Coating
Müller, J.; Schmidt, R.; Griese, H.; Hannemann, M.; Lindemann, J.; Wiesmann, U.; Zuber, K.-H. | Conference Paper |
| 1999 | Stoffliche Aspekte bei recyclinggerechten Leiterplatten
Müller, J.; Griese, H.; Niessen, N.F. | Conference Paper |
| 1999 | Towards the Re-Use of Electronic Products
Pötter, H.; Griese, H; Middendorf, A.; Fotheringham, G.; Reichl, H. | Conference Paper |
| 1999 | Towards the re-use of electronic products-quality assurance for the re-use of electronics
Potter, H.; Griese, H.; Middendorf, A.; Fotheringham, G.; Reichl, H. | Conference Paper |
| 1998 | Challenge Printed Circuit Board
Müller, J.; Griese, H.; Nissen, N.F.; Pötter, H. | Conference Paper |
| 1998 | Design for environment in automotive electronic design
Pötter, H.; Griese, H.; Middendorf, A.; Müller, J.; Nissen, N.F. | Conference Paper |
| 1998 | An environmental comparison of packaging and interconnection technologies
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Potter, H.; Reichl, H. | Conference Paper |
| 1998 | Quality Insurance for the Reuse of Electronics
Pötter, H.; Griese, H.; Middendorf, A.; Fotheringham, G. | Conference Paper |
| 1998 | Umweltverträglich vergolden
Müller, J.; Schmidt, R.; Griese, H.; Hannemann, M.; Zuber, K.-H. | Journal Article |
| 1997 | Comparison of simplified environmental assessments versus full life cycle assessment (LCA) for electronics designer
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H.; Reichl, H. | Conference Paper |
| 1997 | Comparison of simplified environmental assessments versus full life cycle assessments (LCA) for electronics designer
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H.; Reichl, H. | Conference Paper |
| 1997 | Environmental assessments of electronics
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H.; Reichl, H. | Conference Paper |
| 1997 | Environmental Assessments of Electronics: A New Model to Bridge the Gap Between Full Life Cycle Evaluations and Product Design
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H.; Reichl, H. | Conference Paper |
| 1997 | Environmental impact of materials in electronics
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H. | Conference Paper |
| 1997 | Kreislaufwirtschaft in der Elektronikindustrie. Konzepte, Strategien, Umweltökonomie
Griese, H.; Müller, J.; Sietmann, R. | Book |
| 1997 | The Project UmProdIKT
Pötter, H.; Griese, H.; Middendorf, A.; Müller, J.; Nissen, N.F. | Conference Paper |
| 1997 | Recycling aspects of micro materials
Müller, J.; Griese, H. | Conference Paper |
| 1997 | Towards a Better Closed Loop Economy for Electronic Products
Müller, J.; Griese, H.; Middendorf, A.; Reichl, H. | Conference Paper |
| 1997 | Umweltbelastungen durch die SMT. Ein Vergleich von Reflowlöten und Leitkleben
Deubzer, O.; Griese, H.; Middendorf, A.; Müller, J. | Conference Paper |
| 1996 | Umweltbezogene Anforderungen an das zukünftige Leiterplattendesign
Griese, H.; Müller, J.; Nissen, N.F.; Sietmann, R. | Conference Paper |
| 1995 | Entsorgen - Recyceln - Vermeiden: Was heißt Kreislaufwirtschaft in der Elektronikindustrie?
Griese, H.; Müller, J. | Book Article |
| 1995 | Ein zweites Leben für Bauteile
Müller, J.; Griese, H. | Journal Article |
| 1993 | NETPACK - Part I
Reichl, H.; Griese, H.; Schubert, A. | Journal Article |
| 1993 | NETPACK - Part II
Reichl, H.; Griese, H.; Schubert, A. | Journal Article |