Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2008Global responsibility for green electronics and ICT
Griese, H.; Reichl, H.; Stobbe, L.
Conference Paper
2008RoHS-like regulations worldwide
Müller, J.; Griese, H.; Nissen, N.F.; Reichl, H.
Conference Paper
2007Global harmonization of RoHS-like regulations
Müller, J.; Griese, H.; Reichl, H.
Conference Paper
2007Global impacts of the e-waste problem
Deubzer, O.; Griese, H.; Reich, H.
Conference Paper
2007Global sustainable development needs advanced electronics
Griese, H.; Mueller, J.; Nissen, N.F.; Reichl, H.; Stobbe, L.
Conference Paper
2007Status and impacts of RoHS-like regulations - the role of material bans in sustainable development
Deubzer, O.; Griese, H.; Zangl, S.; Andrae, A.; Reichl, H.
Conference Paper
2006Eco-Design Strategies for Electronics Supply Chains Based on Product Material Declarations
Stobbe, L.; Schischke, K.; Hayashi, H.; Suga, T.; Griese, H.
Conference Paper
2006Electronic systems from the perspective of sustainability and reliability
Oberender, C.; Middendorf, A.; Bochow-Neß, O.; Griese, H.-J.; Reichl, H.
Conference Paper
2006Environmental-based regulations for electronics - From regional variety to internationally harmonized guidelines
Griese, H.; Müller, J.; Stobbe, L.
Conference Paper
2006Investigation on value increase in inverse distribution process
Hayashi, H.; Suga, T.; Stobbe, L.; Schischke, K.; Griese, H.
Conference Paper
2006Lebensdauerprognostik für Drahtbond-Verbindungen mittels der Life-Cycle-Unit
Middendorf, A.; Reichl, H.; Griese, H.
Conference Paper
2005Approaches towards sustainable use and substitution of metals in electronics
Deubzer, O.; Griese, H.; Reichl, H.
Conference Paper
2005Condition monitoring of automotive electronic systems with life cycle units
Middendorf, A.; Griese, H.; Hulsken, G.; Neß, O.; Reichl, H.; Schrank, K.
Conference Paper, Journal Article
2005Eco-design and beyond - key requirements for a global sustainable development
Griese, H.; Stobbe, L.; Reichl, H.; Stevels, A.
Conference Paper
2005Environmental aspects in automotive electronics
Pötter, H.; Griese, H.; Jürgens, G.; Müller, J.; Ness, O.; Reichl, H.
Conference Paper, Journal Article
2005Forum: Umstellung Bleifrei
Müller, J.; Griese, H.
Conference Paper
2005Global sustainable development and technological innovations
Griese, H.; Stobbe, L.; Müller, J.; Deubzer, O.; Middendorf, A.
Conference Paper
2005Global sustainable development and technological innovations - Experiences from lead-free transition
Griese, H.; Stobbe, L.; Mueller, J.; Deubzer, O.; Middendorf, A.
Conference Paper
2005Green MST design from a designer's perspective: How to base decisions on environmental issues
Schischke, K.; Middendorf, A.; Reichl, H.; Griese, H.; Kasper, M.; Ong, K.
Conference Paper
2005Lifetime estimation for wire bond interconnections using life-cycle-information modules with implemented models
Middendorf, A.; Griese, H.; Reichl, H.
Conference Paper
2005Marking of Electronic Components and Board Assemblies as RoHS Compatible
Stobbe, I.; Deubzer, O.; Griese, H.; Reichl, H.
Conference Paper
2005Materials Trends in Electronics - Life Cycle Implications
Schischke, K.; Griese, H.; Mueller, J.; Reichl, H.; Zuber, K.H.
Conference Paper, Journal Article
2005State of the Art in Material Declarations: Compliance Management and Usability for Eco-Design
Schischke, K.; Griese, H.; Mueller, J.; Stobbe, I.
Conference Paper
2005Towards sustainable solutions
Griese, H.
Conference Paper
2005Transition to lead free soldering - a great chance for a better understanding of materials and processes and green electronics
Müller, J.; Griese, H.; Schischke, K.; Stobbe, L.
Conference Paper
2004Driving forces for future electronics
: Reichl, H.; Griese, H.; Pötter, H.
Conference Proceedings
2004Environmental compatibility of electronics - a key towards local and global sustainable development
Griese, H.; Stobbe, L.; Middendorf, A.; Reichl, H.
Conference Paper
2004Environmental management in semiconductor and printed circuit board industry in India - Part I: Survey results and case studies
Pandey, U.C.; Sethi, V.C.; Schischke, R.; Griese, H.; Reichl, H.
Conference Paper
2004Environmental management in semiconductor and printed circuit board industry in India - Part II: Benchmarking and international best practice sharing
Schischke, K.; Pandey, U.C.; Sethi, V.C.; Griese, H.; Reichl, H.
Conference Paper
2004Foreword to the special section of the Asian Green Electronics Conference (AGEC)
Liu, J.; Griese, H.J.; Chan, Y.-C.
Journal Article
2004Green Electronics Trends - Meeting the Requirements of the European Market
Schischke, K.; Griese, H.; Reichl, H.
Conference Paper
2004Implementing Cleaner Production in Semiconductor and Printed Circuit Board Industry in India
Sethi, V.C.; Pandey, U.C.; Schischke, K.; Griese, H.; Reichl, H.
Conference Paper
2004IZM/EE-Toolbox - effiziente Screening-Bewertungsmethoden für ein Design umweltverträglicher elektronischer Produkte und Prozesse
Griese, H.; Stobbe, I.; Deubzer, O.; Hagelüken, M.; Middendorf, A.; Müller, J.; Pötter, H.; Schischke, K.; Zuber, K.-H.
Book Article
2004Life cycle thinking for green electronics
Mueller, J.; Griese, H.; Schischke, K.; Stobbe, I.; Norris, G.A.
Conference Paper
2004Quality Challenges of Reused Components
Stobbe, I.; Pötter, H.; Griese, H.; Fotheringham, G.; Reichl, H.
Conference Paper
2004Reuse and lifetime extension strategies in the context of technology innovations, global markets, and environmental legislation
Griese, H.; Pötter, H.; Schischke, K.; Ness, O.; Reichl, H.
Conference Paper
2004Sustainable Development of Microelectronic Technology Processes
Griese, H.; Schischke, K.; Reichl, H.; Stobbe, L.
Conference Paper
2004Sustainable Use and Restrictions of Materials in the Electronics Industry
Deubzer, O.; Griese, H.; Reichl, H.; Madsen, J.; Wel, H. van der
Conference Paper
2004Technological Innovation started by Environmental Concerns
Müller, J.; Hagelüken, M.; Griese, H.; Reichl, H.
Conference Paper
2004Verfahren zum selektiven Gewinnen von Gold aus goldhaltigen Materialien
Schmidt, R.; Mueller, J.; Griese, H.; Hannemann, M.; Zuber, K.
Patent
2004Welcome to the Jungle - Survival of the Fittest Environmental Screening Indicators?
Hagelüken, M.; Schischke, K.; Müller, J.; Griese, H.
Conference Paper
2003Bleifreie elektronische Baugruppen
Müller, J.; Griese, H.
Conference Paper
2003Cost-effectiveness and environmental aspects of flip chip bumping for system integration
Schischke, K.; Griese, H.; Müller, J.; Reichl, H.
Journal Article
2003Embedded Life-Cycle Information Module
Middendorf, A.; Griese, H.; Grimm, W.M.; Reichl, H.
Conference Paper
2003Embedded life-cycle information module for monitoring and identification of product use conditions
Middendorf, A.; Griese, H.; Grimm, W.M.; Reichl, H.
Conference Paper
2003Environmental Risks of Mass Produced, Small and Cheap Products Regarding End-of-Life Scenarios
Müller, J.; Griese, H.; Hagelüken, M.; Reichl, H.
Conference Paper
2003Integrating ecodesign into the development of technology processes
Griese, H.; Schischke, K.; Reichl, H.; Suga, T.; Stobbe, L.
Conference Paper
2003Integration of environmental assessment tools in product development
Middendorf, A.; Petermann, C.; Reichl, H.; Griese, H.; Schrödl, J.; Reiner, A.
Conference Paper
2003MikroNetz
Middendorf, A.; Griese, H.; Reichl, H.
Conference Paper
2003MikroNetz - development of switched power supplies using Microsystem technology
Middendorf, A.; Griese, H.; Reichl, H.
Conference Paper
2003Recyclinggerechtes Design im Aufwind
Müller, J.; Griese, H.
Journal Article
2003Strategies to integrate life cycle engineering into technological developments - the 3G Greenbook Initiative
Griese, H.; Müller, J.; Stobbe, L.; Reichl, H.; Rick, K.
Conference Paper
2003X-free mobile electronics - Strategy for sustainable development
Mueller, J.; Griese, H.; Hagelüken, M.; Middendorf, A.; Reichl, H.
Conference Paper
2002Development of environmentally sound gold plating and recycling processes
Zuber, K.-H.; Griese, H.; Müller, J.; Schmidt, R.
Conference Paper
2002Electronics Goes Green 2000+. A Challenge for the Next Millenium. Proceedings. Vol. 2: Special Lectures
Griese, H.; Pötter, H.
Conference Proceedings
2002Fabric-based communication
Kallmayer, C.; Griese, H.
Journal Article
2002Using Life Cycle Information to Improve the Reliability of Electronic Assemblies
Middendorf, A.; Griese, H.; Neß, O.; Reichl, H.
Conference Paper
2002Using Life-Cycle Information for Reliability Assessment of Electronic Assemblies
Middendorf, A.; Griese, H.; Reichl, H.; Grimm, W.
Conference Paper
2002Vorrichtung zur Transformation einer Primaerspannung in eine Sekundaerspannung mit mindestens einem Schaltnetzteil
Geneiss, V.; Middendorf, A.; Griese, H.
Patent
2001Applied EcoDesign - Product characterization by sustainability indices
Griese, H.; Deubzer, O.; Müller, J.; Stobbe, L.
Conference Paper
2001Bleifreie Elektronik. Weltweite Anstrengungen zur Substitution. Teil I
Zuber, K.-H.; Griese, H.; Müller, J.
Journal Article
2001Bleifreie Elektronik. Weltweite Anstrengungen zur Substitution. Teil II
Zuber, K.-H.; Griese, H.; Müller, J.
Journal Article
2001Challenging the Future - Ways Towards Sustainable Green Electronics
Müller, J.; Deubzer, O.; Griese, H.; Pötter, H.; Reichl, H.
Book Article
2001Eco-analysis of wafer level bumping
Schischke, K.; Griese, H.; Müller, J.
Conference Paper
2001Environmental aspects of microelectronics
Muller, J.; Griese, H.; Zuber, K.H.; Reichl, H.; Schischke, K.
Conference Paper
2001Environmental friendly plating and deplating of gold in PCB manufacturing
Zuber, K.-H.; Griese, H.; Müller, J.; Schmidt, R.
Conference Paper
2001Global Responsibility of Electronics
Griese, H.; Müller, J.; Reichl, H.
Conference Paper
2001Global responsibility of electronics - Products and sustainability
Griese, H.; Müller, J.; Reichl, H.
Conference Paper
2001Green polytronics
Griese, H.; Müller, J.; Hagelüken, M.; Reichl, H.; Zuber, K.-H.
Conference Paper
2001How Electronics Technology Trends Translate into Environmental Trends
Nissen, N.F.; Griese, H.
Conference Paper
2001Lead-free soldering - Future aspects of toxicity, energy and resource consumption
Deubzer, O.; Griese, H.; Suga, T.
Conference Paper
2001Lead-free soldering - Toxicity, energy and resource consumption
Deubzer, O.; Hamano, H.; Suga, T.; Griese, H.
Conference Paper
2001Life cycle inventory analysis and identification of environmentally significant aspects in semiconductor
Schischke, K.; Stutz, M.; Ruelle, J.-P.; Griese, H.; Reichl, H.
Conference Paper
2001Meeting data requirements by using the IZM/EE-toolbox for a screening assessment of the environmental impacts of electronic products
Stobbe, I.; Middendorf, A.; Schischke, K.; Petermann, C.; Griese, H.; Müller, J.; Reichl, H.
Conference Paper
2001On the way to green mobile products
Müller, J.; Griese, H.; Reichl, H.
Conference Paper
2001Werkzeuge für Grüne Elektronik
Middendorf, A.; Schischke, K.; Stobbe, I.; Griese, H.; Reichl, H.
Journal Article
2000Analysis of micromaterials
Schwencke, B.; Müller, J.; Griese, H.
Conference Paper
2000Analytics of printed circuit boards for environmental assessment
Schwencke, B.; Müller, J.; Griese, H.; Altendorf, P.
Conference Paper
2000Ecological and Economical Effects of Lead Free Soldering
Deubzer, O.; Suga, T.; Griese, H.
Conference Paper
2000EE-Toolbox - A modular assessment system for the environmental optimization of electronics
Middendorf, A.; Nissen, N.F.; Griese, H.; Müller, J.; Pötter, H.; Reichl, H.; Stobbe, I.
Conference Paper
2000Environmental assessment of lead free interconnection systems
Griese, H.; Müller, J.; Reichl, H.; Somi, G.; Stevels, A.; Zuber, K.-H.
Conference Paper
2000Environmental Assessment Using the IZM/EE Toolbox
Nissen, N.F.; Griese, H.; Müller, J.; Middendorf, A.; Stobbe, I.; Reichl, H.; Funk, T.
Conference Paper
2000Implementation of Environmental Issues in SMEs
Müller, J.; Griese, H.; Middendorf, A.; Nissen, N.F.; Teller, M.
Conference Paper
1999Environmental aspects of lead-free interconnections
Griese, H.
Conference Paper
1999Environmental aspects of PCB microintegration
Müller, J.; Griese, H.; Nissen, N.F.; Potter, H.; Reichl, H.
Conference Paper
1999Environmental performance of mobile products
Ram, B.; Stevels, A.; Griese, H.; Middendorf, A.; Müller, J.; Nissen, N.F.; Reichl, H.
Conference Paper
1999Environmental screening of packaging and interconnection technologies
Nissen, F.; Griese, H.; Middendorf, A.; Müller, J.; Potter, H.; Reichl, H.
Conference Paper
1999Environmentally Acceptable Gold Coating
Müller, J.; Schmidt, R.; Griese, H.; Hannemann, M.; Lindemann, J.; Wiesmann, U.; Zuber, K.-H.
Conference Paper
1999Stoffliche Aspekte bei recyclinggerechten Leiterplatten
Müller, J.; Griese, H.; Niessen, N.F.
Conference Paper
1999Towards the Re-Use of Electronic Products
Pötter, H.; Griese, H; Middendorf, A.; Fotheringham, G.; Reichl, H.
Conference Paper
1999Towards the re-use of electronic products-quality assurance for the re-use of electronics
Potter, H.; Griese, H.; Middendorf, A.; Fotheringham, G.; Reichl, H.
Conference Paper
1998Challenge Printed Circuit Board
Müller, J.; Griese, H.; Nissen, N.F.; Pötter, H.
Conference Paper
1998Design for environment in automotive electronic design
Pötter, H.; Griese, H.; Middendorf, A.; Müller, J.; Nissen, N.F.
Conference Paper
1998An environmental comparison of packaging and interconnection technologies
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Potter, H.; Reichl, H.
Conference Paper
1998Quality Insurance for the Reuse of Electronics
Pötter, H.; Griese, H.; Middendorf, A.; Fotheringham, G.
Conference Paper
1998Umweltverträglich vergolden
Müller, J.; Schmidt, R.; Griese, H.; Hannemann, M.; Zuber, K.-H.
Journal Article
1997Comparison of simplified environmental assessments versus full life cycle assessment (LCA) for electronics designer
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H.; Reichl, H.
Conference Paper
1997Comparison of simplified environmental assessments versus full life cycle assessments (LCA) for electronics designer
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H.; Reichl, H.
Conference Paper
1997Environmental assessments of electronics
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H.; Reichl, H.
Conference Paper
1997Environmental Assessments of Electronics: A New Model to Bridge the Gap Between Full Life Cycle Evaluations and Product Design
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H.; Reichl, H.
Conference Paper
1997Environmental impact of materials in electronics
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H.
Conference Paper
1997Kreislaufwirtschaft in der Elektronikindustrie. Konzepte, Strategien, Umweltökonomie
Griese, H.; Müller, J.; Sietmann, R.
Book
1997The Project UmProdIKT
Pötter, H.; Griese, H.; Middendorf, A.; Müller, J.; Nissen, N.F.
Conference Paper
1997Recycling aspects of micro materials
Müller, J.; Griese, H.
Conference Paper
1997Towards a Better Closed Loop Economy for Electronic Products
Müller, J.; Griese, H.; Middendorf, A.; Reichl, H.
Conference Paper
1997Umweltbelastungen durch die SMT. Ein Vergleich von Reflowlöten und Leitkleben
Deubzer, O.; Griese, H.; Middendorf, A.; Müller, J.
Conference Paper
1996Umweltbezogene Anforderungen an das zukünftige Leiterplattendesign
Griese, H.; Müller, J.; Nissen, N.F.; Sietmann, R.
Conference Paper
1995Entsorgen - Recyceln - Vermeiden: Was heißt Kreislaufwirtschaft in der Elektronikindustrie?
Griese, H.; Müller, J.
Book Article
1995Ein zweites Leben für Bauteile
Müller, J.; Griese, H.
Journal Article
1993NETPACK - Part I
Reichl, H.; Griese, H.; Schubert, A.
Journal Article
1993NETPACK - Part II
Reichl, H.; Griese, H.; Schubert, A.
Journal Article