Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016Non-conductive film (NCF) underfill: Materials, performance, and evolution to next generation devices
Anzures, E.; Morganelli, P.; Barr, R.; Calvert, J.; Dhoble, A.; Fleming, D.; Kim, J.K.; Lei, H.; Grafe, J.; Haberland, J.
Conference Paper
2014Challenges in 3D die stacking
Grafe, Jürgen; Wahrmund, W.; Dobritz, S.; Wolf, M.J.; Lang, K.-D.
Conference Paper
2014Recent results and developments in temporary wafer bonding and –debonding on 300mm leading edge tools
Schima, Mario; Wagenitz, K.; Wendling, R.; Grafe, J.; Wiesbauer, H.; Uhrmann, T.; Wolf, M.J.; Lang, K.-D.
Conference Paper
20133D integration of standard integrated circuits
Puschmann, R.; Böttcher, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.; Ziesmann, M.
Conference Paper
20133D TSV - Influence of electrolyte composites and anneal temperatures to copper protrusion and planarization
Rudolph, C.; Wachsmuth, H.; Bartusseck, I.; Parthenopoulos, M.; Goerner, L.; Boettcher, M.; Grafe, J.; Wolf, J.M.
Conference Paper
2013Microstructure investigation of Cu/SnAg solid-liquid interdiffusion interconnects by Electron Backscatter Diffraction
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Conference Paper
2013Via-last technology for the interconnection of flash and processor chip for mobile applications
Puschmann, R.; Böttcher, M.; John, P.; Bartussek, I.; Manier, C.; Zoschke, K.; Grafe, J.; Ziesmann, M.
Conference Paper
20123D integration - technology and test strategy
Dobritz, S.; Grafe, J.; Rudolph, C.; Böttcher, M.; Wolf, M.J.; Lang, K.-D.
Conference Paper
2012Development of transfer Electrostatic Carriers (T-ESC®) for thin 300mm wafer handling using seal glass bonding technology
Balaj, I.; Raschke, R.; Baum, M.; Uhlig, S.; Wiemer, M.; Gessner, T.; Grafe, J.
Conference Paper
2012Effects of bonding pressure on quality of SLID interconnects
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Conference Paper
2012Via last technology for direct stacking of processor and flash
Puschmann, R.; Bottcher, M.; Ziesmann, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.
Conference Paper
2011Processing of ultrathin 300 mm wafers with carrierless technology
Spiller, S.; Molina, F.; Wolf, J.M.; Grafe, J.; Schenke, A.; Toennies, D.; Hennemeyer, M.; Tabuchi, T.; Auer, H.
Conference Paper