Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Micromachined phase-shifted array-type Mirau interferometer for swept-source OCT imaging
Gorecki, C.; Lullin, J.; Perrin, S.; Bargiel, S.; Albero, J.; Gaiffe, O.; Rutkovvski, J.; Cote, J.M.; Krauter, J.; Osten, W.; Wang, W.-S.; Weimer, M.; Froemel, J.
Journal Article
2017Planar ultra thin glass seals with optical fiber interface for monitoring tamper attacks on security eminent components
Thiel, M.; Flachenecker, G.; Schade, W.; Gorecki, C.; Thoma, A.; Rathje, R.
Journal Article
2017Siegel und Verfahren zur Versiegelung
Schade, Wolfgang; Flachenecker, Günter; Thiel, Markus; Rathje, Rainer; Gorecki, Christian
Patent
2016Array-type miniature interferometer as the core optical microsystem of an optical coherence tomography device for tissue inspection
Passilly, N.; Perrin, S.; Lullin, J.; Albero, J.; Bargiel, S.; Froehly, L.; Gorecki, C.; Krauter, J.; Osten, W.; Wang, W.-S.; Wiemer, M.
Conference Paper
2016Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding
Wang, W.-S.; Wiemer, M.; Froemel, J.; Enderlein, T.; Gessner, T.; Lullin, J.; Bargiel, S.; Passilly, N.; Albero, J.; Gorecki, C.
Conference Paper
2015Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems
Baranski, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Jia, C.P.; Frömel, J.; Wiemer, M.
Journal Article
2015Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer
Wang, W.S.; Lullin, J.; Froemel, J.; Wiemer, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Gessner, T.
Conference Paper
2015Technological platform for vertical multi-wafer integration of miniature imaging instruments
Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.; Wiemer, M.; Frömel, J.; Wünsch, D.; Wang, W.S.
Conference Paper
2014Multi-wafer bonding, stacking and interconnecting of integrated 3-D MEMS micro scanners
Wiemer, M.; Wuensch, D.; Frömel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.
Journal Article
2014Wafer-level fabrication of microcube-typed beam-splitters by saw-dicing of glass substrate
Baranski, M.; Bargiel, S.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M.
Journal Article
20133D micro-optical lens scanner made by multi-wafer bonding technology
Bargiel, S.; Gorecki, C.; Baranski, M.; Passilly, N.; Wiemer, M.; Jia, C.; Frömel, J.
Conference Paper
2013Multi-wafer Bonding, Stacking and Interconnecting of Integrated 3-D MEMS Micro Scanners
Wiemer, M.; Wuensch, D.; Froemel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passily, N.; Gorecki, C.
Conference Paper
2013Wafer-level fabricated micro beam splitter based on 45-degree saw dicing of glass substrate
Bargiel, S.; Baranski, M.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M.
Conference Paper
2012A hierarchic bonding procedure for the assembly of micro confocal microscope
Jia, C.; Frömel, J.; Wiemer, M.; Gessner, T.; Bargiel, S.; Passilly, N.; Baraski, M.; Gorecki, C.
Conference Paper
2012Micromachined array-type mirau interferometer for MEMS metrology
Gorecki, C.; Bargiel, S.; Albero, J.; Passilly, N.; Kujawinska, M.; Zeitner, U.D.
Conference Paper
2012Vertical integration technologies for optical transmissive 3-D microscanner based on glass microlenses
Bargiel, S.; Jia, C.; Baranski, M.; Frömel, J.; Passilly, N.; Gorecki, C.; Wiemer, M.
Journal Article, Conference Paper
2011Micromachined array-type Mirau interferometer for MEMS metrology
Gorecki, C.; Bargiel, S.; Albero, J.; Passilly, N.; Rousselot, C.; Zeitner, U.; Gastinger, K.
Conference Paper
2011Micromachined array-type Mirau interferometer for parallel inspection of MEMS
Albero, J.; Bargiel, S.; Passilly, N.; Dannberg, P.; Stumpf, M.; Zeitner, U.D.; Rousselot, C.; Gastinger, K.; Gorecki, C.
Journal Article
2011Parallel approach to MEMS and micro-optics interferometric testing
Kujawiska, M.; Beer, S.; Gastinger, K.; Gorecki, C.; Haugholt, K.H.; Józwik, M.; Lambelet, P.; Paris, R.; Styk, A.; Zeitner, U.
Conference Paper
2010Design, technology, and signal processing for DOE-based microinterferometer array applied in new generation M(O)EMS test equipment
Kujawinska, M.; Józwik, M.; Styk, A.; Zeitner, U.; Røyset, A.; Beer, S.; Moosburger, R.; Gorecki, C.; Gastinger, K.
Conference Paper
2009Design of a micro-optical low coherent interferometer array for the characterisation of MEMS and MOEMS
Gastinger, K.; Haugholt, K.H.; Røyset, A.; Albero, J.; Zeitner, U.; Gorecki, C.
Conference Paper
2008Measuring and detecting fast-flux service networks
Holz, T.; Gorecki, C.; Rieck, K.; Freiling, F.
Conference Paper
2008Smatiehs - Smart inspection system for high speed and multifunctional testing of Mems an Moems
Gastinger, K.; Kujawinska, M.; Lovhaugen, O.; Beer, S.; Gorecki, C.; Zeitner, U.D.
Conference Paper