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| 2012 | FIB/SEM analysis for smart systems integration
Waechtler, T.; Auerswald, E.; Hoebelt, I.; Nowack, M.; Noack, E.; Gollhardt, A.; Vogel, D.; Michel, B.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2011 | Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique
Vogel, D.; Rzepka, S.; Michel, B.; Gollhardt, A. | Conference Paper |
| 2010 | Local stress measurement methods for packaging purposes- a comparison
Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2010 | Localized high-resolution stress measurements on MEMS structures
Vogel, D.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2010 | Verfahren zur Bestimmung von Deformationen im Mikro- und Nanobereich
Keller, J.; Vogel, D.; Maus, I.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2009 | Characterisation and modelling of the nanoindentation experiment in Au layers
Wittler, O.; Mrossko, R.; Huber, S.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2009 | Failure modeling of ACA-glued flip-chip on flex assemblies
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Gollhardt, A.; Michel, B.; Reichl, H. | Conference Paper, Journal Article |
| 2008 | Approaches of local stress measurement on microsystem devices
Vogel, D.; Auerswald, E.; Gollhardt, A.; Luczak, F.; Sabate, N.; Michel, B. | Conference Paper |
| 2008 | Deformation and stress measurement on electronic components with high spatial resolution
Vogel, D.; Gollhardt, A.; Keller, J.; Michel, B. | Conference Paper, Journal Article |
| 2008 | Micro- and nanoscale deformation measurements at interface crack tips
Keller, J.; Mayer, S.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2008 | Nanoscale deformation measurements - concepts for failure and reliability assessment at the nanoscale
Michel, B.; Gollhardt, A.; Keller, J. | Conference Paper |
| 2008 | Nanoscale resolution deformation measurements at crack tips of nanostructured materials and interface cracks
Keller, J.; Vogel, D.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2008 | Residual Stress Measurements on Semiconductor Layers Utilizing Stress Relief Techniques
Vogel, D.; Lehr, M.U.; Grillberger, M.; Jaschke, V.; Geisler, H.; Gollhardt, A.; Luczak, F.; Michel, B. | Conference Paper |
| 2007 | Experimental characterization of thin Copper foils
Auerswald, E.; Walter, H.; Wittler, O.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2007 | Experimental Determination of Fracture Parameters Within Small Regions by AFM Techniques
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2007 | FIB-based technique for stress characterization on thin films for reliability purposes
Sabaté, N.; Vogel, D.; Keller, J.; Gollhardt, A.; Marcos, J.; Gracia, I.; Cané, C.; Michel, B. | Journal Article |
| 2007 | Focused Ion Beam (FIB) as an Analytical Tool in Micro- and Nanotechnology
Gollhardt, A.; Michel, B. | Conference Paper |
| 2007 | Localized high-resolution stress measurement for microsystems
Vogel, D.; Gollhardt, A.; Sabate, N. | Conference Paper |
| 2007 | Localized stress measurements - a new approach covering needs for advanced micro and nanoscale system development
Vogel, D.; Gollhardt, A.; Sabate, N.; Keller, J.; Michel, B.; Reichl, H. | Conference Paper |
| 2007 | Measurement of stresses in MEMS structures by stress release
Vogel, D.; Sabate, N.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2007 | Messung von Bruchkenngrößen in sehr kleinen Werkstoffbereichen mit dem AFM
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper, Journal Article |
| 2007 | Nanodeformation Measurements for Reliability Studies of Nanosystems
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2007 | Residual stress measurement on a MEMS structure with high-spatial resolution
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Cane, C.; Gracia, I.; Morante, J.R.; Michel, B. | Journal Article |
| 2007 | A test system for ensuring material reliability in micro- and nanoelectronics
Wittler, O.; Auerswald, E.; Dermitzaki, E.; Gollhardt, A.; May, D.; Schmitz, S.; Wunderle, B.; Michel, B. | Conference Paper, Journal Article |
| 2006 | AFM based fracture analysis in micro- and nanomaterials
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2006 | Characterization of thermal interface materials
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2006 | Characterization of thermal interface materials to support thermal simulation
Schacht, R.; May, D.; Gollhardt, A.; Wittler, O.; Wunderle, B.; Michel, B.; Reichl, H. | Conference Paper |
| 2006 | Digital image correlation of nanoscale deformation fields for local stress measurement in thin films
Sabate, N.; Vogel, D.; Gollhardt, A.; Marcos, J.; Gracia, I.; Cane, C.; Michel, B. | Journal Article |
| 2006 | Experimentelle Charakterisierung von Thermischen Interface Materialien für die thermische Simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H. | Conference Paper |
| 2006 | FIB based measurement of local residual stresses on microsystems
Vogel, D.; Sabate, N.; Gollhardt, A.; Keller, J.; Auersperg, J.; Michel, B. | Conference Paper |
| 2006 | FibDAC - residual stress determination by combination of focused ion beam technique and digital image correlation
Keller, J.; Gollhardt, A.; Vogel, D.; Auerswald, E.; Sabate, N.; Auersperg, J.; Michel, B. | Conference Paper |
| 2006 | Measurement of residual stress by slot milling with focused ion-beam equipment
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Cane, C.; Gracia, I.; Morante, J.R.; Michel, B. | Journal Article |
| 2006 | Measurement of residual stresses in micromachined structures in a microregion
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Michel, B.; Cane, C.; Gracia, I.; Morante, J.R. | Journal Article |
| 2006 | Nanoscale Deformation Measurements for Reliability Assessment of Material Interfaces
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2006 | Verfahren zur Erfassung von lokalen Eigenspannungen in Festkoerperobjekten mit einer Ionenstrahltechnik
Auersperg, J.; Lieske, D.; Keller, J.; Vogel, D.; Michel, B.; Gollhardt, A.; Dost, M. | Patent |
| 2005 | Characterization of nanoscale modified polymers for automotive applications
Vogel, D.; Gollhardt, A.; Keller, J.; Holst, M.; Muzic, M.; Michel, B. | Abstract |
| 2005 | Characterization of thermal interface materials for thermal simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H. | Conference Paper |
| 2005 | Deformation field measurement on micro and nanotechnology components utilizing SFM and FIB equipment
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2005 | FIB based Measurements for Material Characterization on MEMS Structures
Vogel, D.; Lieske, D.; Gollhardt, A.; Keller, J.; Sabaté, N.; Morante, J.R.; Michel, B. | Conference Paper |
| 2005 | Die Möglichkeiten der FIB-Technik bei der Schadensanalyse bleifreier Lote
Faust, W.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2005 | Nanoscale deformation measurements for reliability analysis of sensors
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2005 | Zuverlässigkeit von Komponenten der Mikrosystemtechnik durch Einbeziehung von Nanoanalytik und Nanomechanik
Michel, B.; Wunderle, B.; Gollhardt, A.; Bombach, C.; Keller, J. | Conference Paper |
| 2004 | Characterization of microcracks by application of digital image correlation to SPM images
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2004 | Nanodac - an SPM-based nanodeformation measurement technique for reliability assessment of micro- and nanosystems
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2003 | Evaluating microdefect structures by AFM-based deformation measurement
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2002 | Displacement and strain field measurements for nanotechnology applications
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2002 | Fracture mechanical characterization of polymers on nano scale by means of grey scale correlation
Keller, J.; Vogel, D.; Gollhardt, A.; Bauer, M.; Michel, B. | Conference Paper |
| 2002 | Lead-free solder interconnects - characterization, testing and reliability
Schubert, A.; Dudek, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B.; Schuch, B. | Conference Paper |
| 2002 | Micro- and nanomaterials characterization by image correlation methods
Vogel, D.; Gollhardt, A.; Michel, B. | Journal Article |
| 2002 | Micro/nanoDAC deformation measurement to analyze packaging components response to thermo-mechanical load
Vogel, D.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2002 | Reliability assessment of flip-chip assemblies with lead-free solder joints
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.; Reichl, H. | Conference Paper |
| 2002 | Thermo-mechanical reliability of lead-free solder interconnects
Schubert, A.; Dudek, R.; Döring, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2001 | Lead-free flip-chip solder interconnects - materials mechanics and reliability issues
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B. | Journal Article, Conference Paper |
| 2001 | Life time prediction on polymer encapsulated components
Sonner, M.; Gollhardt, A.; Vogel, D.; Sprafke, P.; Michel, B.; Reichl, H. | Journal Article, Conference Paper |
| 2001 | Material mechanics and reliability issues of lead-free solder interconnects
Schubert, A.; Walter, H.; Jung, E.; Gollhardt, A. | Conference Paper |
| 2001 | mTest - A new approach to measure material properties from microscopic specimens
Vogel, D.; Gollhardt, A.; Walter, H.; Dudek, R.; Kühnert, R.; Michel, B. | Conference Paper |
| 2001 | Ongoing research in the NanoMechanicsLab Berlin-Adlershof
Vogel, D.; Gollhardt, A.; Michel, B. | Journal Article, Conference Paper |
| 2000 | Measurement of material properties by a modified microDAC approach
Vogel, D.; Luczak, F.; Wittler, O.; Gollhardt, A.; Walter, H.; Michel, B. | Conference Paper |
| 2000 | MicroDAC strain measurement for FEA support
Vogel, D.; Gollhardt, A.; Schubert, A.; Kühnert, R.; Michel, B. | Conference Paper |
| 2000 | Strain measurement in solder interconnects of advanced electronic packages
Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2000 | Time and Temperature Dependent Mechanical Characterization of Polymers for Microsystems Applications
Wittler, O.; Walter, H.; Gollhardt, A.; Vogel, D.; Sprafke, P.; Michel, B. | Conference Paper |
| 1999 | Microscopic deformation field measurement supporting FEA based reliability analysis in electronic packaging
Vogel, D.; Gollhardt, A.; Kühnert, R.; Auersperg, J.; Michel, B. | Conference Paper |
| 1998 | Investigation of a rigid carrier CSP with the microDAC method
Simon, J.; Vogel, D.; Faust, W.; Gollhardt, A.; Michel, B. | Conference Paper |