Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Non-destructive investigations of pore morphology of micropore carbon materials
Stec, Jakub; Tarasiuk, Jacek; Nagy, Stanislaw; Smulski, Rafal; Gluch, Jürgen; Filipek, Robert
Journal Article
201830 nm X-ray focusing correlates oscillatory stress, texture and structural defect gradients across multilayered TiN-SiOx thin film
Keckes, Jozef; Daniel, Rostislav; Todt, Juraj; Zalesak, Jakub; Sartory, Bernhard; Braun, Stefan; Gluch, Jürgen; Rosenthal, Martin; Burghammer, Manfred; Mitterer, C.; Niese, S.; Kubec, Adam
Journal Article
2018Characterization of spatial distribution of electrolyte in molten carbonate fuel cell cathodes
Wejrzanowski, Tomasz; Gluch, Jürgen; Ibrahim, Samih Haj; Cwieka, Karol; Milewski, Jaroslaw; Zschech, Ehrenfried
Journal Article
2018Combination of soft X-ray microscopy with in-situ mechanical testing to image crack propagation in microchips
Kutukova, Kristina; Liao, Zhongquan; Werner, Stephan; Guttmann, Peter; Standke, Yvonne; Gluch, Jürgen; Schneider, Gerd; Zschech, Ehrenfried
Journal Article, Conference Paper
2018In-situ X-ray microscopy of crack-propagation to study fracture mechanics of on-chip interconnect structures
Kutukova, Kristina; Liao, Zhongquan; Werner, Stephan; Guttmann, Peter; Standke, Yvonne; Gluch, Jürgen; Schneider, Gerd; Zschech, Ehrenfried
Journal Article
2018Laboratory computed x-ray tomography - a nondestructive technique for 3D microstructure analyis of materials
Zschech, Ehrenfried; Löffler, Markus; Krüger, Peter; Gluch, Jürgen; Kutukova, Kristina; Zglobicka, Izabela; Silomon, Jendrik; Rosenkranz, Rüdiger; Standke, Yvonne; Topal, E.
Journal Article
2018A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits
Kutukova, Kristina; Niese, Sven; Sander, Christoph; Standke, Yvonne; Gluch, Jürgen; Gall, Martin; Zschech, Ehrenfried
Journal Article
2018Multilayer Laue Lenses (MLL) with 45 mm focal length as optics for in-situ nanoindentation experiments
Kubec, Adam; Niese, Sven; Gluch, Jürgen; Rosenthal, Martin; Todt, Juraj; Keckes, Jozef; Gawlitza, Peter
Journal Article, Conference Paper
2018Sub 25 nm focusing with a long working distance using multilayer Laue lenses
Kubec, Adam; Niese, Sven; Rosenthal, M.; Gluch, Jürgen; Burghammer, M.; Gawlitza, Peter; Keckes, J.; Leson, Andreas
Journal Article, Conference Paper
2017In-Situ Stretching Patterned Graphene Nanoribbons in the Transmission Electron Microscope
Liao, Zhongquan; Sandonas, Leonardo Medrano; Zhang, Tao; Gall, Martin; Dianat, Arezoo; Gutierrez, Rafael; Mühle, Uwe; Gluch, Jürgen; Jordan, Rainer; Cuniberti, Gianaurelio; Zschech, Ehrenfried
Journal Article
2017Point focusing with flat and wedged crossed multilayer Laue lenses
Kubec, Adam; Melzer, Kathleen; Gluch, Jürgen; Niese, Sven; Braun, Stefan; Patommel, Jens; Burghammer, Manfred; Leson, Andreas
Journal Article
2017Preparation and TEM characterization of interfaces in co-sintered metal-ceramic composites
Mühle, Uwe; Günther, Anne; Standke, Yvonne; Moritz, Tassilo; Gluch, Jürgen; Zschech, Ehrenfried
Poster
2017Target preparation and characterization of interfaces in co-sintered metal ceramic composites using imaging and analytical Transmission Electron Microscopy
Mühle, Uwe; Günther, Anne; Standke, Yvonne; Moritz, Tassilo; Herrmann, Mathias; Gluch, Jürgen; Zschech, Ehrenfried
Book Article
2017Visualization of the internal structure of Didymosphenia geminata frustules using nano X-ray tomography
Zglobicka, Izabela; Li, Qiong; Gluch, Jürgen; Płocińska, Magdalena; Noga, Teresa; Dobosz, Romuald; Szoszkiewicz, Robert; Witkowski, Andrzej; Zschech, Ehrenfried; Kurzydłowski, Krzysztof J.
Journal Article
2016A dedicated illumination for full-field X-ray microscopy with multilayer Laue lenses
Niese, Sven; Braun, Stefan; Dietsch, Reiner; Gluch, Jürgen; Holz, Thomas; Huber, Norman; Kubec, Adam; Zschech, Ehrenfried
Conference Paper
2016FIB sample preparation for X-ray microscopy and ROI target cross-sectioning
Zschech, Ehrenfried; Gluch, Jürgen; Rosenkranz, Rüdiger; Standke, Yvonne; Niese, Sven
Abstract
2016Multi-scale radiographic applications in microelectronic industry
Gluch, Jürgen; Löffler, Markus; Meyendorf, Norbert G.; Oppermann, Martin; Röllig, Mike; Sättler, P.; Wolter, Klaus-Jürgen; Zschech, Ehrenfried
Conference Paper
2016Pollen structure visualization using high-resolution laboratory-based hard X-ray tomography
Li, Qiong; Gluch, Jürgen; Krüger, Peter; Gall, Martin; Neinhuis, Christoph; Zschech, Ehrenfried
Journal Article
2016Study of mechanical behavior of AFM silicon tips under mechanical load
Kopycinska-Müller, Malgorzata; Gluch, Jürgen; Köhler, Bernd
Journal Article
2016TEM investigation of time-dependent dielectric breakdown mechanisms in Cu/Low-k interconnects
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Rosenkranz, Rüdiger; Aubel, Oliver; Hauschildt, Meike; Zschech, Ehrenfried
Journal Article
2015Anwendungen der Röntgenmikroskopie in der Mikroelektronik und Energietechnik
Zschech, Ehrenfried; Gluch, Jürgen; Niese, Sven; Lewandowska, Anna; Wolf, Jürgen M.; Röntzsch, Lars; Löffler, Markus
Conference Paper
2015In situ time-dependent dielectric breakdown in the transmission electron microscope: A possibility to understand the failure mechanism in microelectronic devices
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Gisela; Aubel, Oliver; Beyer, Armand; Hauschildt, Meike; Zschech, Ehrenfried
Journal Article
2015In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Aubel, Oliver; Vogel, Norman; Hauschildt, Meike; Beyer, Armand; Engelmann, Hans Jürgen; Zschech, Ehrenfried
Journal Article, Conference Paper
2015Verfahren zur Erstellung von Elementverteilungsbildern mit einem Transmissionselektronenmikroskop
Mühle, Uwe; Gluch, Jürgen; Zschech, Ehrenfried
Patent
2014A new in situ microscopy approach to study the degradation and failure mechanisms of time-dependent dielectric breakdown: Set-up and opportunities
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Aubel, Oliver; Mühle, Uwe; Gluch, Jürgen; Niese, Sven; Standke, Yvonne; Rosenkranz, Rüdiger; Löffler, Markus; Vogel, Norman; Beyer, Armand; Engelmann, Hans Jürgen; Guttmann, Peter; Schneider, Gerhard; Zschech, Ehrenfried
Journal Article