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2020 | BEoL Reliability, XPS and REELS Study on low-k Dielectrics to understand Breakdown Mechanisms Wehring, Bettina; Hoffmann, R.; Gerlich, Lukas; Czernohorsky, Malte; Uhlig, B.; Seidel, R.; Barchewitz, T.; Schlaphof, F.; Meinshausen, L.; Leyens, C. | Conference Paper |
2020 | Doping Effects in CMOS‐compatible CoSi Thin Films for Thermoelectric and Sensor Applications Nichenametla, Charan Krishna; Calvo, Jesús; Riedel, Stefan; Gerlich, Lukas; Hindenberg, Meike; Novikov, Sergej; Alexander Burkov; Kozelj, Primoz; Cardoso-Gil, Raul; Wagner-Reetz, Maik | Journal Article |
2019 | Analysis of CMOS Metallization Trenches using Angle-Resolved XPS Wehring, Bettina; Gerlich, Lukas; Wislicenus, Marcus | Poster |
2018 | Cobalt integration solutions - integration (R&D accelerator) Gerlich, Lukas; Wislicenus, Marcus; Koch, Johannes; Dhavamani, Abitha; Esmaeili, Sajjad; Uhlig, Benjamin | Presentation |
2017 | BEoL post CMP cleaning challenges for 22 nm FD-SOI and beyond Koch, Johannes; Rehschuh, Stephan; Gerlich, Lukas; Dhavamani, Abitha; Steinke, Philipp; Krause, Robert; Naue, Johannes; Bott, Sascha; Vasilev, Boris; Breuer, Dirk; Seidel, Robert; Preusse, Axel; Bartha, Johann Wolfgang; Uhlig, Benjamin | Conference Paper |
2017 | Seed-layer resistance and its impact on the electrochemical copper deposition Wislicenus, Marcus; Gerlich, Lukas; Koch, Johannes; Uhlig, Benjamin | Presentation |
2016 | CVD-CoXN for advanced semiconductor metallization Dhavamani, Abitha; Wislicenus, Marcus; Gerlich, Lukas; Uhlig, Benjamin | Presentation |
2016 | The influence of adsorption kinetics on copper superfilling for dual damascene Liske, Romy; Krause, Robert; Uhlig, Benjamin; Gerlich, Lukas; Bott, Sascha; Wislicenus, Marcus; Preusse, Axel | Journal Article |
2015 | Theory of co-adsorption and its application to copper superfilling Liske, Romy; Krause, Robert; Uhlig, Benjamin; Gerlich, Lukas; Bott, Sascha; Wislicenus, Marcus; Preusse, Axel | Presentation |
2014 | Cobalt advanced barrier metallization: A resist composition analysis Wislicenus, Marcus; Liske, Romy; Gerlich, Lukas; Vasilev, Boris; Preusse, Axel | Conference Paper |