Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Electrically conductive adhesives for photovoltaic modules
Geipel, Torsten
: Rissing, Lutz (Referent); Maier, Hans Jürgen (Referent)
Dissertation
2018Optimization of electrically conductive adhesive bonds in photovoltaic modules
Geipel, T.; Meinert, M.; Kraft, A.; Eitner, U.
Journal Article
2017Analysis of peel and shear forces after temperature cycle tests for electrical conductive adhesives
Hoffmann, S.; Geipel, T.; Meinert, M.; Kraft, A.
Conference Paper
2017Intermetallic compounds in solar cell interconnections: Microstructure and growth kinetics
Geipel, T.; Moeller, M.; Walter, J.; Kraft, A.; Eitner, U.
Journal Article
2017Low-temperature soldering for the interconnection of silicon heterojunction solar cells
De Rose, A.; Erath, D.; Geipel, T.; Kraft, A.; Eitner, U.
Conference Paper
2017Qualification of conductive adhesives for photovoltaic application - Accelerated ageing tests
Bauermann, L.P.; Fokuhl, E.; Stecklum, S.; Philipp, D.; Geipel, T.; Kraft, A.; Eitner, U.; Fischer, T.; Breitenbücher, D.
Journal Article, Conference Paper
2016A comprehensive study of intermetallic compounds in solar cell interconnections and their growth kinetics
Geipel, T.; Moeller, M.; Kraft, A.; Eitner, U.
Journal Article, Conference Paper
2016Comprehensive Study of Intermetallic Compounds in Solar Cell Interconnections Including Lead-Free, Low Melting Point Solders
Geipel, T.; Möller, M.; Kraft, A.; Eitner, U.
Conference Paper
2016Low-temperature interconnection of PVD-aluminium metallization
Geipel, T.; Kumm, J.; Moeller, M.; Kroely, L.; Kraft, A.; Eitner, U.; Wolf, A.; Zhang, Z.; Wolfahrt, P.
Journal Article, Conference Paper
2015Analysis and performance of dispensed and screen printed front side contacts at cell and module level
Rodriguez, C.; Pospischil, M.; Padilla, A.; Kuchler, M.; Klawitter, M.; Geipel, T.; Padilla, M.; Fellmeth, T.; Brand, A.; Efinger, R.; Linse, M.; Gentischer, H.; König, M.; Hörteis, M.; Wende, L.; Doll, O.; Clement, F.; Biro, D.
Conference Paper
2015Modelling and verification of mechanical stress induced by soldering of wires for multi busbar interconnection
Rendler, L.C.; Walter, J.; Geipel, T.; Volk, M.; Ebert, C.; Eitner, U.
Conference Paper
2015Reduction of thermomechanical stress using electrically conductive adhesives
Geipel, T.; Rendler, L.; Stompe, M.; Eitner, U.; Rissing, L.
Journal Article, Conference Paper
2014Reliable interconnection of the front side grid fingers using silver-reduced conductive adhesives
Geipel, T.; Huq, M.Z.; Eitner, U.
Conference Paper, Journal Article
2013Cure kinetics of electrically conductive adhesives
Geipel, T.; Eitner, U.
Conference Paper
2013Cure kinetics of electrically conductive adhesives for solar cell interconnection
Geipel, T.; Eitner, U.
Journal Article
2013Electrically Conductive Adhesives-An Emerging Interconnection Technology for High-Efficiency Solar Modules
Geipel, T.; Eitner, U.
Journal Article
2012Characterization of electrically conductive adhesives
Eitner, U.; Geipel, T.; Holtschke, S.N.; Tranitz, M.
Journal Article, Conference Paper