Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
20173D wafer level packaging by using Cu-through silicon vias for thin MEMS accelerometer packages
Hofmann, L.; Schubert, I.; Wuensch, D.; Ecke, R.; Vogel, K.; Gottfried, K.; Reuter, D.; Rennau, M.; Schulz, S.E.; Gessner, T.
Journal Article
2017Elektrochemische Abscheidung von Aluminium und Palladium aus ionischen Flüssigkeiten für das reaktive Waferbonden
Hertel, S.; Schröder, T.J.; Wünsch, D.; Wiemer, M.; Geßner, T.
Journal Article
2017Selective immobilization of 6HB and Tablet DNA origami Templates on microstructured surfaces by DLC and CF-polymer contrasting suitable for microfluidic integration
Hann, J.; Helke, C.; Fischer, F.; Lakatos, M.; Heerwig, A.; Nestler, J.; Meritg, M.; Gessner, T.
Journal Article, Conference Paper
20163D integration technologies for MEMS
Geßner, T.; Hofmann, L.; Wang, W.-S.; Baum, M.; Seifert, T.; Wiemer, M.; Schulz, S.
Conference Paper
2016Atomic layer deposition of ultrathin Cu2O and subsequent reduction to Cu studied by in situ x-ray photoelectron spectroscopy
Dhakal, D.; Assim, K.; Lang, H.; Bruener, P.; Grehl, T.; Georgi, C.; Waechtler, T.; Ecke, R.; Schulz, S.E.; Gessner, T.
Journal Article
2016Cavity-enhanced mm-wave spectrometer with integrated SiGe front-end for oxygen concentration measurement
Wecker, J.; Kurth, S.; Mangalgiri, G.; Otto, T.; Gessner, T.; Gaitzsch, M.; Bauch, A.; Nasr, I.; Weigel, R.; Kissinger, D.; Hackner, A.; Prechtel, U.
Conference Paper
2016Competitive impact of nanotube assembly and contact electrodes on the performance of CNT-based FETs
Toader, M.; Hermann, S.; Scharfenberg, L.; Hartmann, M.; Mertig, M.; Schulz, S.E.; Gessner, T.
Journal Article
2016Deposition of parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2016Direct integration of field effect transistors as electro mechanical transducer for stress on beam structures
Haas, S.; Hafez, N.; Loebel, K.-U.; Koegel, E.; Ramsbeck, M.; Reuter, D.; Horstmann, J.T.; Gessner, T.
Conference Paper
2016Effect of cleaning procedures on the electrical properties of carbon nanotube transistors - a statistical study
Tittmann-Otto, J.; Hermann, S.; Kalbacova, J.; Hartmann, M.; Toader, M.; Rodriguez, R.D.; Schulz, S.E.; Zahn, D.R.T.; Gessner, T.
Journal Article
2016Efficient design methodology for inductive energy transmission
Büker, M.-J.; Hedayat, C.; Hilleringmann, U.; Geßner, T.
Conference Paper
2016Electroplating of neodymium iron alloys
Kurth, F.; Froemel, J.; Tanaka, S.; Esashi, M.; Gessner, T.
Conference Paper
2016Empirical transport model of strained CNT transistors used for sensor applications
Wagner, C.; Schuster, J.; Gessner, T.
Journal Article
2016Enhancement of carbon nanotube FET performance via direct synthesis of poly (sodium 4-styrenesulfonate) in the transistor channel
Toader, M.; Schubel, R.; Hartmann, M.; Scharfenberg, L.; Jordan, R.; Mertig, M.; Schulz, S.E.; Gessner, T.; Hermann, S.
Journal Article
2016Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals
Hartmann, S.; Sturm, H.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Journal Article
2016Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies
Schroeder, T.; Froemel, J.; Tanaka, S.; Gessner, T.
Conference Paper
2016A highly miniaturized two-axis acceleration sensor for implantable hemody-namic controlling system
Wünsch, Dirk; Hiller, Karla; Forke, Roman; Baum, Mario; Wiemer, Maik; Geßner, Thomas; Görtz, Michael; Weidenmüller, Jens; Dogan, Özgü
Abstract
2016An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals
Hartmann, S.; Bonitz, J.; Heggen, M.; Hermann, S.; Hölck, O.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Conference Paper
2016Integration of an optical ring resonator biosensor into a self-contained microfluidic cartridge with active, single-shot micropumps
Geidel, S.; Peransi Llopis, S.; Rodrigo, M.; Diego-Castilla, G. de; Sousa, A.; Nestler, J.; Otto, T.; Gessner, T.; Parro, V.
Journal Article
2016Integration of humidity sensors into fibre-reinforced thermoplastic composites
Ebert, F.; Seider, T.; Illing-Günther, H.; Nendel, K.; Martin, J.; Otto, T.; Gessner, T.; Nestler, D.; Wagner, G.
Journal Article, Conference Paper
2016Investigation on an Inkjet Printed Passive Sensor for Wireless Ice Detection on Wind Rotor Blades
Hartwig, M.; Gaitzsch, M.; Großmann, T.D.; Heinrich, M.; Kroll, L.; Gessner, T.; Baumann, R.R.
Journal Article
2016Length separation of single-walled carbon nanotubes and its impact on structural and electrical properties of wafer-level fabricated carbon nanotube-field-effect transistors
Böttger, S.; Hermann, S.; Schulz, S.E.; Gessner, T.
Journal Article
2016Liquid reagent storage in self-pumping lab-on-a-chip systems for quick assay and biosensor integration
Nestler, J.; Haber, N.; Stiehl, C.; Otto, T.; Gessner, T.
Conference Paper
2016Low temperature thermo compression bonding with printed intermediate bonding layers
Wiemer, M.; Roscher, F.; Seifert, T.; Vogel, K.; Ogashiwa, T.; Gessner, T.
Conference Paper
2016Manganese half-sandwich complexes as metal-organic chemical vapor deposition precursors for manganese-based thin films
Assim, K.; Jeschke, J.; Jakob, A.; Dhakal, D.; Melzer, M.; Georgi, C.; Schulz, S.E.; Gessner, T.; Lang, H.
Journal Article
2016Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments
Gabler, Felix; Roscher, Frank; Döring, Ralf; Otto, Alexander; Ziesche, Steffen; Ihle, Martin; Celik, Yusuf; Dietz, Dorothee; Goehlich, Andreas; Kappert, Holger; Vogt, Holger; Naumann, Falk; Geßner, Thomas
Conference Paper
2016A MEMS test stage for in situ testing of interfaces between carbon nanotubes and metals
Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Conference Paper
2016Miniaturized vortex-induced vibration energy harvester for low velocity air flow application
Wen, Q.; Schulze, R.; Billep, D.; Otto, T.; Geßner, T.
Conference Paper
2016A new approach for 3D Integration based on printed multilayers and through polymer vias
Roscher, F.; Saeidi, N.; Enderlein, T.; Selbmann, F.; Wiemer, M.; Gessner, T.
Conference Paper
2016Novel through silicon wiring technology using dry etched sloping vertical terminals
Haas, S.; Voigt, S.; Arnold, M.; Schwenzer, F.; Braunschweig, M.; Küchler, M.; Kurth, S.; Gessner, T.
Conference Paper
2016Optimization of a zinc oxide dispersion for building Quantum Dot Light Emitting Diodes
Langenickel, J.; Weiß, A.; Martin, J.; Otto, T.; Gessner, T.
Conference Paper
2016Oxygen detection system consisting of a millimeter wave Fabry-Pérot resonator and an integrated SiGe front-end
Wecker, J.; Bauch, A.; Kurth, S.; Mangalgiri, G.; Gaitzsch, M.; Meinig, M.; Gessner, T.; Nasr, I.; Weigel, R.; Kissinger, D.; Hackner, A.; Prechtel, U.
Conference Paper
2016Parylene C Deposition and Characterization of its Barrier Properties for the Encapsulation of MEMS for Medical Applications
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2016Product data and Sensor-based intelligent drive Control for flexible manufacturing and intralogistic processes
Geneiß, V.; Hedayat, C.; Bertelsmeier, F.; Henke, C.; Vathauer, K.-E.; Geßner, T.
Conference Paper
2016Stress analysis in semiconductor devices by Kelvin probe force microscopy
Sheremet, E.; Fuchs, F.; Paul, S.; Haas, S.; Vogel, D.; Rodriguez, P.; Zienert, A.; Schuster, J.; Reuter, D.; Gessner, T.; Zahn, D.; Hietschold, M.
Abstract
2016Structure and thermoelectric properties of PbTe films deposited by thermal evaporation method
Nguyen, M.P.; Froemel, J.; Hatayama, S.; Sutou, Y.; Koike, J.; Tanaka, S.; Esashi, M.; Gessner, T.
Conference Paper
2016Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS
Hofmann, L.; Fischer, T.; Werner, T.; Selbmann, F.; Rennau, M.; Ecke, R.; Schulz, S.E.; Gessner, T.
Journal Article
2016Thermal design of integrated heating for lab-on-a-chip systems
Streit, P.; Nestler, J.; Shaporin, A.; Schulze, R.; Gessner, T.
Conference Paper
2016Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: Molecular dynamics simulations and in situ experiments using electron microscopy
Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Hölck, O.; Shaporin, A.; Mehner, J.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Journal Article
2016Tunable Fabry-Pérot interferometer with subwavelength grating reflectors for MWIR microspectrometers
Meinig, M.; Kurth, S.; Seifert, M.; Hiller, K.; Wecker, J.; Ebermann, M.; Neumann, N.; Gessner, T.
Conference Paper
2016Using quantum dot photoluminescence for load detection
Moebius, M.; Martin, J.; Hartwig, M.; Baumann, R.R.; Otto, T.; Gessner, T.
Journal Article
2016Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding
Wang, W.-S.; Wiemer, M.; Froemel, J.; Enderlein, T.; Gessner, T.; Lullin, J.; Bargiel, S.; Passilly, N.; Albero, J.; Gorecki, C.
Conference Paper
2016VIS Fabry-Pérot-Interferometer with (HL)4 PE-Si3N4/PE-SiO2 reflectors on freestanding LP-Si3N4 membranes for surface enhanced Raman spectroscopy
Helke, C.; Meinig, M.; Seifert, M.; Seiler, J.; Hiller, K.; Kurth, S.; Martin, J.; Gessner, T.
Conference Paper
2016Wafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systems
Bonitz, J.; Böttger, S.; Herrmann, S.; Schulz, S.E.; Gessner, T.; Hartmann, S.; Wunderle, B.
Conference Paper
2016Welcome to smart systems integration 2016
Gessner, T.
Conference Paper
2015[Ag{S2CNR(C2H4OH)}] as single-source precursor for Ag2S – synthesis, decomposition mechanism, and deposition studies
Mothes, R.; Jakob, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.
Journal Article
20153D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding
Hofmann, L.; Dempwolf, S.; Reuter, D.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Knechtel, R.; Geßner, T.
Conference Paper
20153d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages
Hofmann, L.; Reuter, D.; Schubert, I.; Wuensch, D.; Rennau, M.; Ecke, R.; Vogel, K.; Gottfried, K.; Schulz, S.E.; Gessner, T.
Conference Paper
2015Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing
Seifert, T.; Sowade, E.; Roscher, F.; Wiemer, M.; Gessner, T.; Baumann, R.R.
Journal Article
2015Aerosol jet printing of nano particle based electrical chip interconnects
Seifert, T.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2015Back-end-of-line compatible contact materials for carbon nanotube based interconnects
Fiedler, H.; Toader, M.; Hermann, S.; Rennau, M.; Rodriguez, R.D.; Sheremet, E.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T.
Journal Article, Conference Paper
2015Carbon Nanotube based sensors in MEMS/NEMS
Hermann, S.; Bonitz, J.; Boettger, S.; Hartmann,S; Shaporin, A.; Mehner, J.; Wunderle, B.; Schulz, S.E.; Gessner, T.
Conference Paper
2015Carbon nanotubes under strain: Electronic and Optical properties
Wagner, C.; Schuster, J.; Gessner, T.
Abstract
2015Comparative analysis of multi-mass high precision vibratory MEMS gyroscopes
Popova, I.; Lestev, A.; Fedorov, M.; Rakityansky, O.; Ivanov, V.; Semenov, A.; Hiller, K.; Hahn, S.; Gessner, T.
Conference Paper
2015Direct integrated strain sensors for robust temperature behaviour
Haas, S.; Schramm, M.; Reuter, D.; Loebel, K.-U.; Horstmann, J.T.; Gessner, T.
Conference Paper
2015Efficient K-band antennas fabricated with large-scale processes
Gaitzsch, M.; Grossmann, T.D.; Hartwig, M.; Heinrich, M.; Kurth, S.; Gessner, T.; Baumann, R.R.; Kroll, L.
Conference Paper
2015Electrically tunable Fabry-Pérot interferometer with inherent compensation of the influence of gravitation and vibration
Meinig, M.; Kurth, S.; Helke, C.; Seifert, M.; Hiller, K.; Ebermann, M.; Neumann, N.; Gessner, T.
Conference Paper
2015Evaluation of sputtered Pd76Cu6Si18 metallic glass for MEMS application
Vogel, K.; Wiemer, M.; Gessner, T.; Vogel, J.; Lin, Y.-C.; Tsai, Y.-C.; Esashi, M.; Tanaka, S.
Conference Paper
2015Experimental and Theoretical Investigations on an in situ k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials
Foerster, A.; Koehler, N.; Zimmermann, S.; Fischer, T.; Wagner, C.; Schuster, J.; Gemming, S.; Schulz, S.E.; Gessner, T.
Abstract
2015Fabrication of micro needle arrays using an ultra short pulse laser
Enderlein, T.; Nestler, J.; Otto, T.; Gessner, T.
Conference Paper
2015Fabrication of nanoporous gold and the application for substrate bonding at low temperature
Wang, W.-S.; Lin, Y.-C.; Gessner, T.; Esashi, M.
Journal Article
2015Fluidic actuators in composite structures
Schueller, M.; Lipowski, M.; Schirmer, E.; Walther, M.; Symmank, C.; Schmidt, A.; Kroll, L.; Gessner, T.; Götze, U.
Conference Paper
2015Highly-sensitive humidity sensors for condition monitoring of hybrid laminates
Seider, T.; Martin, J.; Boeddicker, A.; Ruehling, J.; Wett, D.; Nestler, D.J.; Wagner, G.; Huebler, A.; Otto, T.; Gessner, T.
Conference Paper
2015Influence of different hole transport layers on the performance of quantum dot light emitting diodes
Langenickel, J.; Weiß, A.; Martin, J.; Otto, T.; Geßner, T.
Conference Paper
2015Inkjet and gravure printing of conductive patterns for the application in lightweight structures
Hartwig, M.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kroll, L.; Gessner, T.; Baumann, R.R.
Conference Paper
2015Inkjet-printed quantum dot-based sensor for structural health monitoring
Hartwig, M.; Ortlepp, F.; Möbius, M.; Martin, J.; Otto, T.; Geßner, T.; Baumann, R.R.
Conference Paper
2015Inkjet-printing of conductive components for the manufacturing of a quantum dot based sensor for optical health monitoring
Ortlepp, F.; Hartwig, M.; Moebius, M.; Martin, J.; Otto, T.; Gessner, T.; Baumann, R.R.
Conference Paper
2015Integrated load detection sensor for lightweight structures based on quantum dots
Moebius, M.; Martin, J.; Poppitz, E.A.; Hartwig, M.; Dzhagan, D.; Gordan, O.D.; Lang, H.; Zahn, D.R.T.; Baumann, R.R.; Otto, T.; Gessner, T.
Conference Paper
2015Integration and test of synthetic jet actuators
Schueller, M.; Weigel, P.; Lipowski, M.; Nestler, J.; Otto, T.; Gessner, T.
Conference Paper
2015Integration of fluidic jet actuators in composite structures
Schueller, M.; Lipowski, M.; Schirmer, E.; Walther, M.; Otto, T.; Geßner, T.; Kroll, L.
Conference Paper
2015Kombinierte Simulation integrierter mikrofluidischer Aktoren
Schulze, R.; Nestler, J.; Streit, P.; Billep, D.; Otto, T.; Gessner, T.
Conference Paper
2015Life cycle-oriented analysis and evaluation of Active Flow Control in wind turbines
Götze, U.; Symmank, C.; Dressel, M.; Schüller, M.; Schmidt, A.; Lipowski, M.; Geßner, T.; Otto, T.
Journal Article
2015Low-temperature wafer bonding using solid-liquid inter-diffusion mechanism
Froemel, J.; Baum, M.; Wiemer, M.; Gessner, T.
Journal Article
2015Metallic glass as a mechanical material for microscanners
Lin, Y.C.; Tsai, Y.C.; Ono, T.; Liu, P.; Esashi, M.; Gessner, T.; Chen, M.W.
Journal Article
2015Micro welding of aluminum for post process electrode gap reduction using femtosecond laser
Meinecke, C.; Mueller, M.; Rennau, M.; Bertz, A.; Ebert, R.; Reuter, D.; Exner, H.; Gessner, T.
Conference Paper
2015Mobile communication and control for Smart Microfluidic Systems
Otto, T.; Geidel, S.; Morschhauser, A.; Streiter, R.; Gessner, T.; Heibutzki, B.; Nestler, J.
Conference Paper
2015Modulare aktive Probecard zur Systemcharakterisierung von mikro-elektromechanischen Sensoren am Beispiel von Gyroskopen
Weidlich, S.; Forke, R.; Billep, D.; Konietzka, S.; Koehler, D.; Hiller, K.; Gessner, T.
Conference Paper
2015Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer
Wang, W.S.; Lullin, J.; Froemel, J.; Wiemer, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Gessner, T.
Conference Paper
2015On-chip micro-pseudocapacitors for ultrahigh energy and power delivery
Han, J.; Lin, Y.-C.; Chen, L.; Tsai, Y.-C.; Ito, Y.; Guo, X.; Hirata, A.; Fujita, T.; Esashi, M.; Gessner, T.; Chen, M.
Journal Article
2015Oxygen Detection by Rotational Spectroscopy with a Small Size Millimeter Wave Resonator
Wecker, J.; Mangalgiri, G.; Kurth, S.; Meinig, M.; Hackner, A.; Prechtel, U.; Gessner, T.
Journal Article
2015Performance investigation of UHF RFID tags designed for air and Rubber Belts - impact of electrical parameters and the shape of the belts
Kanwar, K.; Mager, T.; Hilleringmann, U.; Hedayat, C.; Geneis, V.; Gessner, T.
Conference Paper
2015Practical experience and results of an extensive pilot test of the ASTROSE® sensor network for high voltage power line monitoring
Voigt, S.; Pfeiffer, M.; Heibutzki, B.; Brockmann, C.; Großer, V.; Kurth, S.; Geßner, T.
Conference Paper
2015Preliminary Investigations of Processing Impact on Microelectronic Devices by Injection Moulding Technology
Nossol, P.; Schaufuss, J.; Tsapkolenko, A.; Rost,F; Arnold, B.; Kroll, L.; Mehner, J.; Gessner, T.
Conference Paper
2015Preparation of Ni-C thin films for strain sensor applications in new hybrid laminates with thermoplastic matrix
Wett, D.; Nestler, D.; Wagner, G.; Wielage, B.; Seider, T.; Martin, J.; Gessner, T.
Conference Paper
2015Printed functionalities in hybrid laminates
Nestler, D.J.; Jung, H.; Trautmann, M.; Wielage, B.; Wagner, G.; Seider, T.; Martin, J.; Otto, T.; Gessner, T.; Ebert, F.; Illing-Guenther, H.; Nendel, K.; Boeddicker, A.; Fuegmann, U.; Huebler, A.
Conference Paper
2015Printing of conductive patterns for application in smart lightweight structures
Hartwig, M.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kroll, L.; Gessner, T.; Baumann, R.R.
Conference Paper
2015Pulsed jet actuators and their integration in composite structures
Lipowski, M.; Stiehl, C.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T.; Kroll, L.
Conference Paper
2015Quantum dot-based sensor layer in lightweight structures
Fischer, T.; Heinrich, K.; Spudat, C.; Martin, J.; Otto, T.; Gessner, T.; Kroll, L.
Journal Article
2015Remote ice detection on rotor blades of wind turbines
Großmann, T.D.; Gaitzsch, M.; Hartwig, M.; Heinrich, M.; Symmank, C.; Schmidt, A.; Kurth, S.; Gessner, T.; Baumann, R.R.; Kroll, L.; Götze, U.
Conference Paper
2015RF MEMS switch for modulated backscatter communication
Gaitzsch, M.; Voigt, S.; Haas, S.; Kurth, S.; Gessner, T.
Conference Paper
2015Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Bodny, F.; Wiemer, M.; Gessner, T.; Brunschwiler, T.; Zürcher, J.; Burg, B.R.; Zimmermann, S.
Conference Paper
2015Semiconductor nanocrystals – versatile building blocks for innovative microsystems
Weiss, A.; Heinrich, K.; Martin, J.; Otto, T.; Gessner, T.; Langenickel, J.
Conference Paper
2015Simulation of ALD chemistry of (nBu3P)2Cu(acac) and Cu(acac)2 precursors on Ta(110) surface
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T.
Journal Article, Conference Paper
2015Smart systems integration. Short review and further development of smart systems
Gessner, T.; Vogel, M.; Hiller, K.; Otto, T.; Kurth, S.; Nestler, J.; Köhler, T.
Book Article
2015Subwavelength Grating Reflectors for Fabrication Cost Reduction of Fabry-Perot Infrared Filters
Rupprecht, J.; Kurth, S.; Hiller, K.; Seifert, M.; Besser, J.; Meinig, M.; Ebermann, M.; Neumann, N.; Gessner, T.
Conference Paper, Journal Article
2015Surface chemistry of copper metal and copper oxide atomic layer deposition from copper(II) acetylacetonate
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T.
Journal Article
2015Surface patterning and self-assembly of DNA-Origami based transistor nanoarchitectures
Helke, C.; Nestler, J.; Gessner, T.
Conference Paper
2015Synthesis and characterization of nanogenerators based on doped zinc oxide
Heinrich, K.; Justeau, C.; Mielke, B.; Martin, J.; Otto, T.; Geßner, T.
Conference Paper
2015System zum Messen einer Axialkraft einer Schraubverbindung
Geßner, Thomas; Otto, Thomas; Halder, Stefan; Hummel, Dieter; Martin, Jörg; Weiss, Martin; Möbius, Martin; Spudat, Christian; Gessner, Thomas; Otto, Thomas
Patent
2015Technologieentwicklung einer post-process Elektrodenspaltverringerung zur Herstellung von hochauflösenden Sensorsystemen
Meinecke, C.; Mueller, M.; Rennau, M.; Reuter, D.; Ebert, R.; Bertz, A.; Exner, H.; Gessner, T.
Conference Paper
2015Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics
Hartmann, S.; Shaporin, A.; Hermann, S.; Bonitz, J.; Heggen, M.; Meszmer, P.; Sturm, H.; Hölck, O.; Blaudeck, T.; Schulz, S.E.; Mehner, J.; Gessner, T.; Wunderle, B.
Conference Paper
2015TSCuPc/Au hybrid trench devices. A comparative study of solution processed and thermally evaporated molecular channels
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Salvan, G.; Zahn, D.R.T.
Abstract
2015VORRICHTUNGEN ZUR AUSSENDUNG UND/ODER ZUM EMPFANG ELEKTROMAGNETISCHER STRAHLUNG UND VERFAHREN ZUR BEREITSTELLUNG DERSELBEN
Geßner, Thomas; Otto, Thomas; Schulz, Stefan Prof.; Hermann, Sascha; Blaudeck, Thomas; Spudat, Christian
Patent
2015Wafer-level decoration of carbon nanotubes in field-effect transistor geometry with preformed gold nanoparticles using a microfluidic approach
Blaudeck, T.; Adner, D.; Hermann, S.; Lang, H.; Gessner, T.; Schulz, S.E.
Journal Article, Conference Paper
2015Welcome to Smart Systems Integration 2015
Gessner, T.
Journal Article
2015Yet another tuning fork gyroscope
Forke, R.; Hiller, K.; Hahn, S.; Konietzka, S.; Motl, T.; Köhler, D.; Heinz, S.; Billep, D.; Gessner, T.
Conference Paper
2014 System-level-model development of an SWCNT based piezoresistive sensor in VHDL-AMS
Kolchuzhin, V.; Mehner, J.; Markert, E.; Heinkel, U.; Wagner, C.; Schuster, J.; Gessner, T.
Conference Paper
2014ALD of Nickel Oxide and its Reduction to Nickel for Potential Applications in Interconnects and Spintronics
Wächtler, T.; Sharma, A.; Ahner, N.; Melzer, M.; Mueller, S.; Lehmann, D.; Schäfer, P.; Schulze, S.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Gessner, T.
Conference Paper
2014Analysis of Au metal–metal contacts in a lateral actuated RF MEMS switch
Gaitzsch, M.; Kurth, S.; Voigt, S.; Haas, S.; Gessner, T.
Conference Paper, Journal Article
2014ANAn UPS/IPS Study of Band Level Alignment Of a Quantum Dot Based Sensor
Tofighi, G.; Moebius, M.; Haidu, F.; Martin, J.; Dzhagan, V.M.; Spudat, C.; Otto, T.; Gessner, T.; Gordan, O.D.; Zahn, D.R.T.
Abstract
2014Capillary microfluidic chip with integrated pump and valve actuator
Große, Allyn; Geidel, Sascha; Enderlein, Tom; Groß, Stefan; Morschhauser, Andreas; Nestler, Jörg; Edelmann, Jan; Otto, Thomas; Gessner, Thomas
Poster
2014Capillary microfluidic chip with integrated pump and valve actuator
Große, Allyn; Geidel, Sascha; Enderlein, Tom; Groß, Stefan; Morschhauser, Andreas; Nestler, Jörg; Edelmann, Jan; Otto, Thomas; Geßner, Thomas
Conference Paper
2014Carbon nanotube based via interconnects: Performance estimation based on the resistance of individual carbon nanotubes
Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T.
Journal Article, Conference Paper
2014Carbon nanotubes under strain: Ab-initio investigations and compact models
Wagner, C.; Kolchuzhin, V.; Markert, E.; Schuster, J.; Mehner, J.; Gessner, T.
Abstract
2014Ceramic wafer bonding for vertically integrated MEMS
Wuensch, D.; Froemel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2014Chemical post-treatment and thermoelectric properties of poly(3,4-ethylenedioxylthiophene):poly(styrenesulfonate) thin films
Luo, J.; Billep, D.; Blaudeck, T.; Sheremet, E.; Rodriguez, R.D.; Zahn, Dietrich R.T.; Toader, M.; Hietschold, M.; Otto, T.; Gessner, T.
Journal Article
2014A cobalt layer deposition study: Dicobaltatetrahedranes as convenient MOCVD precursor systems
Georgi, C.; Hildebrandt, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.
Journal Article
2014Deposition of copper thin films for ULSI interconnects by ALD of copper oxide and subsequent reduction
Waechtler, T.; Mothes, R.; Hofmann, L.; Schulze, S.; Oswald, S.; Schulz, S.E.; Lang, H.; Hietschold, M.; Gessner, T.
Book Article
2014Development and test of synthetic jet actuators based on dual transducer concept
Schueller, M.; Wiegel, P.; Lipowski, M.; Schulze, R.; Otto, T.; Gessner, T.
Conference Paper
2014Development of Micro-Valves for Pulsed Jet Actuators
Lipowski, M.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T.
Conference Paper
2014Dry Integration Strategies of rolled-up Nanostructures by a Combination of Laser and Mems Technologies
Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T.
Conference Paper
2014Entwicklung eines experimentellen Aufbaus zur Systemcharakterisierung von MEMS Gyroskopen auf Waferlevel
Weidlich, S.; Forke, R.; Konietzka, S.; Hiller, K.; Gessner, T.
Conference Paper
2014Entwicklung eines intelligenten, textilen Halbzeugs
Schaufuss, J.; Decker, R.; Walther, M.; Tsapkolenko, A.; Dienel, M.; Schueller, M.; Kroll, L.; Gessner, T.; Mehner, J.
Conference Paper
2014Fiber-reinforced Composite Structures with Embedded Piezoelectric Sensors
Schulze, R.; Streit, P.; Fischer, T.; Tsapkolenko, A.; Heinrich, M.; Sborikas, M.; Kroll, L.; Gessner, T.; Wegener, M.
Conference Paper
2014Fügen mit iRMS: Eine neue Raumtemperatur - Aufbau- und Verbindungstechnik in der Informationstechnik
Bräuer, J.; Besser, J.; Schneider, W.; Wiemer, M.; Gessner, T.
Conference Paper
2014Functional nano patterns realized by aligned nano imprint lithography
Baum, M.; Besser, J.; Wiemer, M.; Thanner, C.; Kreindl, G.; Wimplinger, M.; Gessner, T.
Conference Paper
2014A hermetic and room-temperature wafer bonding technique based on integrated reactive multilayer systems
Braeuer, J.; Gessner, T.
Journal Article
2014Implantable MEMS sensors and medical MEMS packaging issues for future implants
Baum, M.; Haubold, M.; Wiemer, M.; Gessner, T.
Conference Paper, Journal Article
2014Improvement of copper bonding by analyzing the mechanical properties of the bond interface
Vogel, K.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T.
Book Article
2014Integrateable light sources based on semiconductor nanocrystals
Böttger, P.; Meyer, M.; Martin, J.; Otto, T.; Gessner, T.; Seidlitz, H.; Kroll, L.
Conference Paper
2014Integration von MOS-Transistoren als Wandler für mechanische Spannungen
Schramm, M.; Haas, S.; Reuter, D.; Loebel, K.-U.; Heinz, S.; Bertz, A.; Horstmann, J.T.; Gessner, T.
Abstract
2014Interface Resistance of Carbon-Nanotube-Based Interconnects
Fiedler, H.; Toader, Marius; Hermann, S.; Rennau, M.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Hietschold, Michael; Schulz, S.E.; Gessner, T.
Conference Paper
2014Investigation of low temperature wafer bonding using plasma activation
Wünsch, D.; Hofmann, C.; Bräuer, J.; Wiemer, M.; Gessner, T.
Book Article
2014Investigation of reactive and nano scale material systems for room-temperature reactive wafer bonding
Bräuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Book Article
2014Kombination von Laser- und MEMS Technologieprozessen fuer Integrationsstrategien von rolled-up Nano-Architekturen
Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T.
Conference Paper
2014Laser based dry Integration of rolled-up Nanomembranes into Polymer Substrates
Enderlein, T.; Helke, C.; Harazim, S.; Geidel, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T.
Conference Paper
2014Laser based integration method of rolled-up nano membranes in polymer based LoC systems
Enderlein, T.; Helke, C.; Harazim, S.; Nestler, J.; Schmidt, O.G.; Otto, T.; Gessner, T.
Abstract
2014Localization length of integrated multi-walled carbon nanotubes
Fiedler, H.; Hermann, S.; Rennau, M.; Schulz, S.E.; Gessner, T.
Conference Paper
2014Mechanical characterization of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T.
Conference Paper
2014MEMS based integration of nano scaled architectures manufactured by the rolled-up nanotech method
Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Schmidt, O.G.; Otto, T.; Gessner, T.
Abstract
2014Metallic carbon nanotubes with metal contacts: electronic structure and transport
Zienert, A.; Schuster, J.; Gessner, T.
Journal Article
2014Microfluidic chips for cells capture using 3-D hydrodynamic structure array
Chen, J.; Chen, D.; Yuan, T.; Chen, X.; Zhu, J.; Morschhauser, A.; Nestler, J.; Otto, T.; Gessner, T.
Journal Article
2014Modeling and optimization of a vortex induced vibration fluid kinetic energy harvester
Wen, Q.; Schulze, R.; Billep, D.; Otto, T.; Gessner, T.
Journal Article, Conference Paper
2014Modellierung des optimalen Arbeitsbereiches für Inertialsensoren auf Basis von Kohlenstoffnanoröhrchen
Wagner, C.; Schuster, J.; Gessner, T.
Conference Paper
2014Modelling the reaction behavior in reactive multilayer systems on substrates used for wafer bonding
Masser, R.; Braeuer, J.; Gessner, T.
Journal Article
2014Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments
Hartmann, S.; Hölck, O.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Conference Paper
2014Multi-wafer bonding, stacking and interconnecting of integrated 3-D MEMS micro scanners
Wiemer, M.; Wuensch, D.; Frömel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.
Journal Article
2014Nanoporous gold as a versatile bonding intermediate
Lin, Y.-C.; Wang, W.-S.; Gessner, T.; Esashi, M.
Conference Paper
2014A new generation of MEMS middle-infrared spectrometers
Otto, T.; Saupe, R.; Stock, V.; Seider, T.; Gessner, T.
Conference Paper
2014Optimizing quantum dot based sensor device structure by determining the band level alignment for better charge injection: a combined UPS/IPS study
Tofighi, G.; Moebius, M.; Haidu, F.; Gordan, O.D.; Martin, J.; Spudat, C.; Otto, T.; Gessner, T.; Zahn, D.R.T.
Conference Paper
2014Organic lateral trench devices fabricated by trench technology
Banerjee, S.; Richter, P.; Buelz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Zahn, D.R.T.; Salvan, G.
Abstract
2014Overview of wafer bonding and characterization of the bonded interface
Vogel, K.; Haubold, M.; Wiemer, M.; Gessner, T.
Book Article
2014Piezoelectric P(VDF-TrFE) transducers assembled with micro injection molded polymers
Schulze, R.; Heinrich, M.; Nossol, P.; Forke, R.; Sborikas, M.; Tsapkolenko, A.; Billep, D.; Wegener, M.; Kroll, L.; Gessner, T.
Journal Article
2014Pulsed DC magnetron sputtered piezoelectric thin film aluminum nitride - Technology and piezoelectric properties
Stoeckel, C.; Kaufmann, C.; Hahn, R.; Schulze, R.; Billep, D.; Gessner, T.
Journal Article
2014Pulsed Jet Actuator development for the integration in composite structures
Lipowski, M.; Stiehl, C.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T.; Kroll, L.
Conference Paper
2014Quantitative in-situ scanning electron microscope pull-out experiments and molecular dynamics simulations of carbon nanotubes embedded in palladium
Hartmann, S.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Journal Article
2014Reactive bonding with integrated reactive and nano scale energetic material systems (iRMS): State-of-the-art and future development trends
Braeuer, J.; Besser, J.; Hertel, S.; Masser, R.; Schneider, W.; Wiemer, M.; Gessner, T.
Conference Paper
2014Roll-to-roll infrared sintering of gravure printed silver patterns in applications of back-injection-molded functional lightweight structures
Hartwig, M.; Ueberfuhr, P.; Mischke, A.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kurth, S.; Kroll, L.; Gessner, T.; Baumann, R.R.
Conference Paper
2014Simulation of ALD chemistry of copper metalorganic precursors on Ta(110) Surface
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T.
Conference Paper
2014Smart monitoring systems for a green future
Saupe, R.; Stock, V.; Otto, T.; Kurth, S.; Hiller, K.; Meinig, M.; Neumann, N.; Gessner, T.
Conference Paper
2014Smart systems integration for micro- and nanotechnologies
: Michel, B. (Hrsg.); Gessner, T.
Book
2014Solid Liquid Inter-Diffusion Bonding at Low Temperature
Frömel, J.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2014Structural health monitoring with quantum dots
Moebius, M.; Martin, J.; Poppitz, E.A.; Ueberfuhr, P.; Tofighi, G.; Gordan, O.D.; Dzhagan, V.M.; Lang, H.; Baumann, R.R.; Zahn, D.R.T.; Otto, T.; Gessner, T.; Kroll, L.
Conference Paper
2014Subwavelength grating reflectors in MEMS tunable Fabry-Perot infrared filters with large aperture
Kurth, S.; Hiller, K.; Meinig, M.; Besser, J.; Seifert, M.; Ebermann, M.; Neumann, N.; Schlachter, F.; Gessner, T.
Conference Paper
2014Surface chemistry of a Cu(I) beta-diketonate precursor and the atomic layer deposition of Cu2O on SiO2 studied by x-ray photoelectron spectroscopy
Dhakal, D.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.; Mothes, R.; Tuchscherer, A.
Journal Article
2014Technologieentwicklung, Herstellung und Charakterisierung von hochauflösenden Inertialsystemen
Meinecke, C.; Bertz, A.; Dittrich, C.; Schunke, S.; Kreutziger, P.; Gessner, T.
Conference Paper
2014Wafer bonding technologies for 3D integration
Baum, M.; Hofmann, C.; Besser, J.; Vogel, K.; Wiemer, M.; Gessner, T.
Conference Paper
2014Wafer-Level Functionalization of Integrated Carbon Nanotubes with Metal Nanoparticles
Blaudeck, T.; Adner, David; Hermann, S.; Schulz, S.E.; Lang, Heinrich; Gessner, T.
Conference Paper
20133D integration technologies for MEMS based on copper TSVs and copper-to-copper metal thermo compression bonding
Hofmann, L.; Baum, M.; Schulz, S.E.; Wiemer, M.; Geßner, T.
Conference Paper
2013Analysis of metal-metal contacts in RF MEMS switches
Kurth, S.; Voigt, S.; Haas, S.; Bertz, A.; Kaufmann, C.; Gessner, T.; Akiba, A.; Ikeda, K.
Conference Paper
2013Biocompatibility evaluation of MEMS packaging materials for implantable devices
Baum, M.; Haubold, M.; Besser, J.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2013Comparison of quantum mechanical methods for the simulation of electronic transport through carbon nanotubes
Zienert, A.; Schuster, J.; Gessner, T.
Journal Article
2013Conductive AFM for CNT characterization
Toader, M.; Fiedler, H.; Hermann, S.; Schulz, S.E.; Gessner, T.; Hietschold, M.
Journal Article, Conference Paper
2013Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications
Melzer, M.; Waechtler, T.; Müller, S.; Fiedler, H.; Hermann, S.; Rodriguez, R.D.; Villabona, A.; Sendzik, A.; Mothes, R.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Lang, H.; Gessner, T.
Journal Article
2013Degree of integration enhancement of membrane actuators in LOCs utilizing laser technology
Geidel, S.; Enderlein, T.; Nestler, J.; Morschhauser, A.; Otto, T.; Gessner, T.
Conference Paper
2013Design and simulation of nanomaterial-enhanced LTCC integrated inductors
Lin, Y.-C.; Gabler, F.; Tanaka, S.; Esashi, M.; Gessner, T.
Conference Paper
2013Design, fabrication and characterization of MEMS probe card for fine pitch IC testing
Yuan, T.; Chen, D.; Chen, J.; Fu, H.; Kurth, S.; Otto, T.; Gessner, T.
Journal Article
2013Development and characterisation of 3D integration technologies for MEMS based on copper filled TSVs and copper-to-copper metal thermo compression bonding
Baum, M.; Hofmann, L.; Wiemer, M.; Schulz, S.E.; Gessner, T.
Conference Paper
2013Direct integration of field effect transistors as electro mechanical transducer for stress
Haas, S.; Reuter, D.; Bertz, A.; Gessner, T.; Schramm, M.; Loebel, K.-U.; Horstmann, J.T.
Conference Paper
2013Enhancement of the thermoelectric properties of PEDOT:PSS thin films by post-treatment
Luo, J.; Billep, D.; Waechtler, T.; Otto, T.; Toader, M.; Gordan, O.; Sheremet, E.; Martin, J.; Hietschold, M.; Zahn, D.R.T.; Gessner, T.
Journal Article
2013Erweiterungen und Anwendungen der BDRIE-Technologie zur Herstellung hermetisch gekapselter Sensoren mit hoher Güte
Hiller, K.; Hahn, S.; Kuechler, M.; Billep, D.; Forke, R.; Koehler, D.; Konietzka, S.; Pohle, A.; Gessner, T.
Conference Paper
2013Extended Hückel Theory for Carbon Nanotubes: Band Structure and Transport Properties
Zienert, A.; Schuster, J.; Gessner, T.
Journal Article
2013Fabrication of subwavelength holes using nanoimprint lithography
Weiss, A.; Besser, J.; Baum, M.; Saupe, R.; Otto, T.; Gessner, T.
Conference Paper
2013Highly Reliable and Low Voltage Actuated Ohmic RF MEMS Switch with Wafer Level Packaging
Kurth, S.; Nowack, M.; Voigt, S.; Bertz, A.; Froemel, J.; Kaufmann, C.; Gessner, T.; Akiba, A.; Ikeda, K.
Book Article
2013Integrated smart systems for theranostic applications
Haubold, M.; Baum, M.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2013Integration and fabrication of PZT and metallic glass films for micro-mirror device
Tsai, Y.-C.; Lee, J.-W.; Naono, T.; Lin, Y.-C.; Esashi, M.; Fujii, T.; Gessner, T.
Conference Paper
2013Investigations on partially filled HAR TSVs for MEMS applications
Hofmann, L.; Schubert, I.; Gottfried, K.; Schulz, S.E.; Gessner, T.
Conference Paper
2013Laterally stacked organic devices fabricated by trench technology
Reuter, D.; Banerjee, S.; Fronk, M.; Salvan, G.; Hiller, K.; Zahn, D.R.T.; Gessner, T.
Conference Paper
2013Low temperature wafer bonding technology for RF based MEMS devices
Haubold, M.; Figur, S.; Schoenlinner, B.; Kurth, S.; Gessner, T.
Conference Paper
2013LTCC-based three dimensional inductors with nano-ferrite embedded core for one-chip tunable RF system
Lin, Y.-C.; Gabler, F.; Tsai, Y.-C.; Tanaka, S.; Gessner, T.; Esashi, M.
Conference Paper
2013Manipulation of Ni catalyst particle size, shape and areal density on TiN support layer for growth of vertical aligned CNTs
Tittmann, J.; Hermann, S.; Fiedler, H.; Schulz, S.E.; Gessner, T.
Abstract
2013Metallic glass micro-mirror integrated with PZT actuation for low resonant frequency and large exciting angle
Tsai, Y.-C.; Lee, J.-W.; Naono, T.; Lin, Y.-C.; Esashi, M.; Fujii, T.; Gessner, T.
Conference Paper
2013Mikrofluidisches System für Agglutinationsuntersuchungen
Morschhauser, A.; Geidel, S.; Nestler, J.; Otto, T.; Gessner, T.
Conference Paper
2013Multi-wafer Bonding, Stacking and Interconnecting of Integrated 3-D MEMS Micro Scanners
Wiemer, M.; Wuensch, D.; Froemel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passily, N.; Gorecki, C.
Conference Paper
2013Nanoporous gold for MEMS packing applications
Lin, Y.-C.; Wang, W.-S.; Chen, L.Y.; Chen, M.W.; Gessner, T.; Esashi, M.
Journal Article
2013Optimization of biogas production using MEMS based near infrared inline-sensor
Saupe, R.; Seider, T.; Stock, V.; Kujawski, O.; Otto, T.; Gessner, T.
Conference Paper
2013Optimization of MEMS/NEMS for reliable resonance frequencies
Stoeckel, C.; Hofmann, K.; Forke, R.; Billep, D.; Gessner, T.
Conference Paper
2013Picosecond Laser Micromachining in the context of MEMS/NEMS applications
Enderlein, T.; Helke, C.; Hiller, K.; Nestler, J.; Schueller, M.; Geidel, S.; Otto, T.; Gessner, T.
Conference Paper
2013Piezoelectric Accelerometer Based on Micro Injection Molded Polymers
Schulze, R.; Heinrich, M.; Wegener, M.; Forke, R.; Billep, D.; Gessner, T.
Conference Paper
2013Precise determination of piezoelectric longitudinal charge coefficients for piezoelectric thin films assisted by finite element modeling
Stoeckel, C.; Kaufmann, C.; Schulze, R.; Billep, D.; Gessner, T.
Conference Paper
2013Reaktives Bonden
Braeuer, J.; Freitag, A.; Dietrich, T.R.; Wiemer, M.; Gessner, T.
Conference Paper
2013Schichtsystem mit einer Schicht aus parallel zueinander angeordneten Kohlenstoffröhren und einer elektrisch leitenden Deckschicht, Verfahren zur Herstellung des Schichtsystems und dessen Verwendung in der Mikrosystemtechnik
Schulz, Stefan Prof.; Hermann, Sascha; Geßner, Thomas
Patent
2013Smart systems for a better life
Gessner, T.; Vogel, M.; Nestler, J.; Hiller, K.; Kurth, S.; Otto, T.
Conference Paper
2013Smart Systems Integration - trends in the field of smart medtech systems
Gessner, T.; Nestler, J.; Vogel, M.; Otto, T.
Conference Paper
2013Solid Liquid Interdiffusion Bonding for Micro Devices near Room Temperature
Froemel, J.; Wiemer, M.; Tanaka, S.; Esashi, M.; Gessner, T.
Conference Paper
2013Studies on the piezoresistive effect in MOS transistors for use in integrated MEMS sensors
Haas, S.; Schramm, M.; Loebel, K.-U.; Heinz, S.; Reuter, D.; Bertz, A.; Horstmann, J.T.; Gessner, T.
Conference Paper
2013Technologieentwicklung für optimiertes MEMS Packaging durch Si-TSV-Rückseitenkontaktierung
Meinecke, C.; Hofmann, L.; Bertz, A.; Gottfried, K.; Gessner, T.
Conference Paper
2013TSVs mit hohem Aspektverhältnis und Kupfer-Bonden für MEMS
Hofmann, L.; Baum, M.; Gottfried, K.; Schulz, S.E.; Wiemer, M.; Gessner, T.
Conference Paper
2013Vertical Integration techniques for MEMS using HAR TSV
Hofmann, L.; Schubert, I.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Gessner, T.
Conference Paper
2013Wafer-level technology for piezoresistive electro-mechanical transducer based on Carbon Nanotubes
Shaporin, A.; Hermann, S.; Kaufmann, C.; Schulz, S.E.; Gessner, T.; Voigt, S.; Mehner, J.; Hartmann, S.; Wunderle, B.; Bonitz, J.
Conference Paper
2013Welcome note. International Semiconductor Conference Dresden - Grenoble, ISCDG 2013
Gessner, T.
Conference Paper
2012ALD of Metal and Metal Oxide Thin Films for Applications in ULSI Metallization Systems and Spintronic Layer Stacks
Waechtler, T.; Mueller, S.; Fiedler, H.; Melzer, M.; Schulz, S.E.; Gessner, T.
Conference Paper
2012Autarkes Sensornetzwerk zum Monitoring von Hochspannungsleitungen
Voigt, S.; Pfeiffer, M.; Grolms, A.; Kurth, S.; Keutel, T.; Brockmann, C.; Braunschweig, M.; Gessner, T.
Conference Paper
2012Autonomous sensor network for power line monitoring
Voigt, S.; Kurth, S.; Geßner, T.
Conference Paper
2012Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications
Fiedler, H.; Ecke, R.; Hermann, S.; Schulz, S.E.; Gessner, T.
Conference Paper
2012Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study
Sommer, J.; Zienert, A.; Gemming, S.; Schuster, J.; Schulz, S.E.; Gessner, T.
Conference Paper
2012Bonding technologies for standard bulk PZT ceramics without the need of after process-polarization especially on thin silicon membranes
Helke, C.; Schueller, M.; Hiller, K.; Schulze, R.; Braeuer, J.; Nestler, J.; Otto, T.; Gessner, T.
Conference Paper
2012Chip-based optical sensor to determine the arterial oxygen concentration
Möbius, M.; Weiss, A.; Otto, T.; Gessner, T.
Conference Paper
2012Comparison of lumped and finite element modeling for thermoelectric devices
Streit, P.; Schulze, R.; Billep, D.; Otto, T.; Gessner, T.
Conference Paper
2012Design and manufacturing of micro synthetic jet actuators
Gebauer, C.; Schueller, M.; Hiller, K.; Schulze, R.; Otto, T.; Gessner, T.
Conference Paper
2012Development of transfer Electrostatic Carriers (T-ESC®) for thin 300mm wafer handling using seal glass bonding technology
Balaj, I.; Raschke, R.; Baum, M.; Uhlig, S.; Wiemer, M.; Gessner, T.; Grafe, J.
Conference Paper
2012Device for storing power supply information of e.g. TV, supplies electrical charge carriers to nanoparticles selectively in regions in specific operating state
Reuter, Danny; Geßner, Thomas; Morschhauser, Andreas; Otto, Thomas; Martin, Jörg; Kießling, Torsten; Piasta, Doreen
Patent
2012DFT investigations of the piezoresistive effect of carbon nanotubes for sensor application
Wagner, C.; Schuster, J.; Gessner, T.
Journal Article
2012Distinguishing between individual contributions to the via resistance in carbon nanotubes based interconnects
Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T.
Journal Article
2012Fabrication of freestanding Pb(Zr,Ti)O film microstructures using Ge sacrificial layer
Lee, J.-W.; Kawai, Y.; Tanaka, S.; Lin, Y.-C.; Gessner, T.; Esashi, M.
Journal Article
2012Fabry-Perot tunable infrared filter based on structured reflectors
Kurth, S.; Hiller, K.; Neumann, N.; Seifert, M.; Ebermann, M.; Specht, H.; Meinig, M.; Gessner, T.
Conference Paper
2012Festigkeitsanalyse an thermokompressionsgebondeten Sensorstrukturen in Abhängigkeit von der Oberflächenvorbehandlung
Vogel, K.; Baum, M.; Roscher, F.; Kinner, R.; Rank, H.; Mayer, T.; Wiemer, M.; Gessner, T.
Conference Paper
2012FIB/SEM analysis for smart systems integration
Waechtler, T.; Auerswald, E.; Hoebelt, I.; Nowack, M.; Noack, E.; Gollhardt, A.; Vogel, D.; Michel, B.; Schulz, S.E.; Gessner, T.
Conference Paper
2012Growth of carbon nanotube forests between a bi-metallic catalyst layer and a SiO2 substrate to form a self-assembled carbon-metal heterostructure
Hermann, S.; Schulze, S.; Ecke, R.; Liebig, A.; Schaefer, P.; Zahn, D.R.T.; Albrecht, M.; Hietschold, M.; Schulz, S.E.; Gessner, T.
Journal Article
2012A hierarchic bonding procedure for the assembly of micro confocal microscope
Jia, C.; Frömel, J.; Wiemer, M.; Gessner, T.; Bargiel, S.; Passilly, N.; Baraski, M.; Gorecki, C.
Conference Paper
2012Influence of test speed on the bonding strength of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T.
Abstract
2012Integrated nano scale multilayer systems for reactive bonding in microsystems technology
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Conference Paper
2012Integration of piezoelectric polymer transducers into microsystems for sensing applications
Schulze, R.; Gessner, T.; Schueller, M.; Forke, R.; Billep, D.; Hahn, R.; Heinrich, M.; Sborikas, M.; Wegener, M.
Conference Paper
2012Investigation of different nano scale energetic material systems for reactive wafer bonding
Braeuer, J.; Besser, J.; Tomoscheit, E.; Klimm, D.; Anbumani, S.; Wiemer, M.; Gessner, T.
Conference Paper
2012Laser micromachining and micro hot embossing for highly integrated lab-on-chip systems
Enderlein, T.; Baum, M.; Nestler, J.; Otto, T.; Besser, J.; Wiemer, M.; John, B.; Hänel, J.; Gessner, T.
Conference Paper
2012Laserbasierter Multilayer-Fügeprozess zur Erzeugung heterogener und druckstabiler mikrofluidischer Systeme
Geidel, S.; Enderlein, T.; Morschhauser, A.; Nestler, J.; Otto, T.; Gessner, T.
Conference Paper
2012A less damaging patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices
Zimmermann, S.; Ahner, N.; Fischer, T.; Schaller, M.; Schulz, S.E.; Gessner, T.
Conference Paper
2012LoC Integrationsstrategien für aufgerollte Sensoren
Harazim, S.; Helke, C.; Enderlein, T.; Morschhauser, A.; Nestler, J.; Sanchez, S.; Grimm, D.; Otto, T.; Schmidt, O.; Gessner, T.
Conference Paper
2012Low temperature metal interdiffusion bonding for micro devices
Frömel, J.; Lin, Y.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2012Membrane based sample preparation chip
Morschhauser, A.; Stiehl, C.; Große, A.; Nestler, J.; Otto, T.; Gessner, T.
Conference Paper, Journal Article
2012Micro arc welding for electrode gap reduction of high aspect ratio microstructures
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuechler, M.; Bertz, A.; Gessner, T.
Journal Article, Conference Paper
2012Micro hot embossing and micro laser welding technologies for fluidic applications
Baum, M.; Besser, J.; John, B.; Keiper, B.; Hänel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2012Micro injection moulded MEMS with integrated piezoelectric PVDF
Heinrich, H.; Schulze, R.; Wegener, M.; Kroll, L.; Walther, M.; Schueller, M.; Gessner, T.
Conference Paper
2012Modeling of TDDB in advanced Cu interconnect systems under BTS conditions
Blský, P.; Streiter, R.; Wolf, H.; Schulz, S.E.; Aubel, O.; Gessner, T.
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2012Nanomechanics oc CNTs for Sensor Simulation
Wagner, C.; Hartmann, S.; Schuster, J.; Wunderle, B.; Schulz, S.E.; Gessner, T.
Conference Paper
2012Nanomechanics of CNTs for sensor application
Wagner, C.; Hartmann, S.; Wunderle, B.; Schuster, J.; Schulz, S.E.; Gessner, T.
Conference Paper
2012Nanosensor technology based on semiconductor nanocrystals
Martin, J.; Staudinger, U.; Demir, E.; Spudat, C.; Pötschke, P.; Voit, B.; Otto, T.; Gessner, T.
Conference Paper
2012A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface
Haubold, M.; Lin, Y.; Frömel, J.; Wiemer, M.; Esashi, M.; Geßner, T.
Journal Article
2012Novel nano-scale energetic systems for low-temperature and stress-free joining of dissimilar materials
Bräuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Conference Paper
2012A novel technique for MEMS packaging: Reactive bonding with integrated material systems
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2012Optimizing sonication parameters for dispersion of single-walled carbon nanotubes
Yu, H.B.; Hermann, S.; Schulz, S.E.; Gessner, T.; Dong, Z.L.; Li, W.J.
Journal Article
2012Out of plane capacitive transducer in air gap insulation microstructures technology for high precision monolithic 3-axis sensors
Reuter, D.; Nowack, M.; Shaporin, A.; Rockstroh, J.; Haas, S.; Bertz, A.; Mehner, J.; Gessner, T.
Conference Paper
2012Plasma activated bonding of the heterogeneous material combinations LiTaO3/Si and poly-Si/SiO2
Wuensch, D.; Braeuer, J.; Wiemer, M.; Gessner, T.
Conference Paper
2012Plasma-activated bonding
Wiemer, M.; Wuensch, D.; Braeuer, J.; Gessner, T.
Book Article
2012Processes for wafer level integration of carbon nanotubes in electronic and sensor applications
Hermann, S.; Fiedler, H.; Loschek, S.; Schulz, S.E.; Gessner, T.
Conference Paper
2012RIE patterning technology of Zr-based metallic glass for MEMS devices fabrication
Tsai, Y.-C.; Lin, Y.-C.; Abe, T.; Esashi, M.; Gessner, T.
Conference Paper
2012Ruthenocenes and half-open ruthenocenes: Synthesis, characterization, and their use as CVD precursors for ruthenium thin film deposition
Tuchscherer, A.; Georgi, C.; Roth, N.; Schaarschmidt, D.; Rüffer, T.; Waechtler, T.; Schulze, S.E.; Oswald, S.; Gessner, T.; Lang, H.
Journal Article
2012Sensormodul und Verfahren zum Herstellen eines Sensormoduls
Roscher, F.; Baum, M.; Wiemer, M.; Geßner, T.; Gebhardt, C.
Patent
2012Sensornetzwerk zum Monitoring von Hochspannungsleitungen
Voigt, S.; Wolfrum, J.; Pfeiffer, M.; Keutel, T.; Brockmann, C.; Grosser, V.; Lissek, S.; During, H.; Rusek, B.; Braunschweig, M.; Kurth, S.; Gessner, T.
Conference Paper
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Voigt, S.; Kurth, S.; Gessner, T.
Conference Paper
2012Si interposer technologies for three dimensional AMR sensor systems
Raukopf, S.; Gebhardt, C.; Roscher, F.; Baum, M.; Kinner, R.; Wiemer, M.; Gessner, T.
Conference Paper
2012Simulation of nanostructures for sensor and circuit applications
Zienert, A.; Wagner, C.; Mohammadzadeh, S.; Schuster, J.; Streiter, R.; Schulz, S.E.; Gessner, T.
Conference Paper
2012Simulation von Kohlenstoffnanoröhrchen für NEMS
Wagner, C.; Schuster, J.; Gessner, T.
Conference Paper
2012Smart Systems for Different Applications from Fraunhofer ENAS
Vogel, M.; Braeuer, J.; Wiemer, M.; Nestler, J.; Kurth, S.; Otto, T.; Gessner, T.
Book Article
2012Structuring of carbon nanotubes for field emission based movement sensors
Loschek, S.; Hermann, S.; Yu, H.; Schulz, S.E.; Gessner, T.
Conference Paper
2012Substrate bonding at low temperature by using plasma activated porous gold
Wang, W.-S.; Lin, Y.-C.; Gessner, T.; Esashi, M.
Conference Paper
2012Thermal and UV nanoimprint lithography for applications from the micro to the nano scale
Besser, J.; Baum, M.; Wiemer, M.; Gessner, T.; Sanchez-Ordonez,S.; Thanner, C.; Vetter, C.
Conference Paper
2012Towards integration of silica membrand based DNA extraction on chip
Morschhauser, A.; Stiehl, C.; Geidel, S.; Nestler, J.; Otto, T.; Gessner, T.
Conference Paper
2012Tunable Fabry-Pérot Interferometers for Infrared Spectroscopy
Kurth, S.; Hiller, K.; Meinig, M.; Gessner, T.
Book Article
2012A two-step UV curing process for producing high tensile stressed silicon nitride layers
Fischer, T.; Prager, L.; Hohage, J.; Ruelke, H.; Schulz, S.E.; Richter, R.; Gessner, T.
Conference Paper
2012Untersuchungen zum piezoresistiven Effekt in MOS-Transistoren für die Anwendung in integrierten MEMS-Sensoren
Haas, S.; Schramm, M.; Heinz, S.; Loebel, K.-U.; Reuter, D.; Bertz, A.; Gessner, T.; Horstmann, J.T.
Conference Paper
2012Using of Different Nano Scale Energetic Material Systems for Reactive Bonding
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Abstract
2012Vorrichtung zur Erzeugung einer Strömung
Schüller, Martin; Lipowski, M.; Gebauer, C.; Nestler, J.; Otto, T.; Gessner, T.
Patent
2012Wafer level approaches for carbon nanotube integration in interconnects and MEMS/NEMS
Hermann, S.; Schulz, S.E.; Gessner, T.
Conference Paper
2012Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications
Hermann, S.; Fiedler, H.; Haibo, Y.; Loschek, S.; Bonitz, J.; Schulz, S.E.; Gessner, T.
Conference Paper
20113D Integration for MEMS devices using photosenitive glass
Wuensch, D.; Hofmann,Ch.; Besser, J.; Schubert, I.; Gottfried, K.; Wiemer, M.; Gessner, T.
Conference Paper
2011Aerosol jet as a deposition method for conductive layers in micro- system-technology using nanoparticle inks
Müller, M.; Roscher, F.; Sowade, E.; Seifert, T.; Wiemer, M.; Gessner, T.; Baumann, R.R.
Conference Paper
2011ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems
Waechtler, T.; Ding, S.-F.; Hofmann, L.; Mothes, R.; Xie, Q.; Oswald, S.; Detavernier, C.; Schulz, S.E.; Qu, X.-P.; Lang, H.; Gessner, T.
Conference Paper, Journal Article
2011Anodically-bondable LTCC substrates with novel nano-structured electrical interconnection for MEMS packaging
Lin, Y.-C.; Wang, W.-S.; Chen, L.Y.; Chen, M.W.; Gessner, T.; Esashi, M.
Conference Paper
2011Application of sub-wavelength structures in infrared optical filters
Kurth, S.; Seifert, M.; Zajadacz, J.; Ebermann, M.; Hiller, K.; Neumann, N.; Gessner, T.
Conference Paper
2011Autarkes Sensornetzwerk zur Überwachung von Hochspannungsleitungen
Voigt, S.; Nowack, M.; Bertz, A.; Leidich, S.; Meinig, M.; Kurth, S.; Gessner, T.; Grosser, V.; Braunschweig, M.; Krumm, R.
Conference Paper
2011Development of the large scanning mirror using Fe-based metallic glass ribbon
Lee, J.-W.; Lin, Y.-C.; Chen, N.; Louzguine, D.V.; Esashi, M.; Gessner, T.
Journal Article
2011Development of the micro-mirror with large scaning angle using FE-based metallic glass thin film
Lee, J.-W.; Lin, Y.-C.; Kaushik, N.; Sharma, P.; Inoue, A.; Esashi, M.; Gessner, T.
Conference Paper
2011Dual-band MEMS Fabry-Pérot filter with two movable reflectors for mid- and long-wave infrared microspectrometers
Meinig, M.; Ebermann, M.; Neumann, N.; Kurth, S.; Hiller, K.; Gessner, T.
Conference Paper
2011Elektrochemische Abscheidung von Pd/Zn-Multilagen für das Fügen mit reaktiven Materialsystemen
Besser, J.; Bräuer, J.; Wiemer, M.; Geßner, T.
Conference Paper
2011Entwicklung einer Verkappungstechnologie für optisch transparente MEMS/NEMS-Gehäuse mit niedrigem Temperatureintrag
Haubold, M.; Leidich, S.; Wiemer, M.; Geßner, T.; Schubert, I.
Conference Paper
2011Fabrication and characterisation of CNT via interconnects for application in ULSI circuits
Fiedler, H.; Hermann, S.; Schulz, S.E.; Gessner, T.
Conference Paper
2011Fabrication of an all-spin-coated CdSe/ZnS quantum dot light-emitting diode
Weiss, A.; Martin, J.; Piasta, D.; Otto, T.; Gessner, T.
Conference Paper
2011Fabrication of an all-spincoated CdSe/ZnS quantum dot light-emitting diode
Weiss, A.; Martin, J.; Piasta, D.; Otto, T.; Gessner, T.
Conference Paper
2011FEM simulation and its application in MEMS design
Jia, C.; Reuter, D.; Wen, Z.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2011The fluorescence of semiconductor nanocrystals - from basics to nanosensor technology
Martin, J.; Piasta, D.; Weiss, A.; Otto, T.; Gessner, T.
Conference Paper
2011HF-MEMS Schalter mit ohmschen Kontakt und lateraler Bewegungsrichtung
Leidich, S.; Kurth, S.; Nowack, M.; Bertz, A.; Froemel, J.; Kaufmann, C.; Gessner, T.
Conference Paper
2011Influence of charges on the photoluminescence of semiconductor nanocrystals
Martin, J.; Piasta, D.; Otto, T.; Gessner, T.
Conference Paper
2011Influence of copper on the catalytic carbon nanotube growth process
Fiedler, H.; Hermann, S.; Schulz, S.E.; Gessner, T.
Conference Paper
2011Influence of the additives argon, O-2, C4F8, H-2, N-2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma
Zimmermann, S.; Ahner, N.; Blaschta, F.; Schaller, M.; Zimmermann, H.; Rülke, H.; Lang, N.; Röpcke, J.; Schulz, S.E.; Geßner, T.
Conference Paper, Journal Article
2011The inhibition of enhanced Cu oxidation on ruthenium/diffusion barrier layers for Cu interconnects by carbon alloying into Ru
Ding, S.-F.; Xie, Q.; Mueller, S.; Waechtler, T.; Lu, H.-S.; Schulz, S.E.; Detavernier, C.; Qu, X.-P.; Gessner, T.
Journal Article
2011Investigations of thermocompression bonding with thin metal layers
Froemel, J.; Baum, M.; Wiemer, M.; Roscher, F.; Haubold, M.; Jia, C.; Gessner, T.
Conference Paper
2011Investigations regarding through silicon via filling for 3D integration by periodic pulse reverse plating with and without additives
Hofmann, L.; Ecke, R.; Schulz, S. E.; Geßner, T.
Conference Paper, Journal Article
2011Kapazitiver MEMS-Mischer und Signalfilter für wake up receiver
Kurth, S.; Voigt, S.; Leidich, S.; Nowack, M.; Bertz, A.; Gessner, T.
Conference Paper
2011Lewis-base copper(I) formates: Synthesis, reaction chemistry, structural characterization and their use as spin-coating precursors for copper deposition
Tuchscherer, A.; Shen, Y.; Jakob, A.; Mothes, R.; Al-Anber, M.; Walfort, B.; Rüffer, T.; Frühauf, S.; Ecke, R.; Schulz, S.E.; Gessner, T.; Lang, H.
Journal Article
2011Lokales Mikroschweißen als post-process Technologie zur permanenten Reduzierung des Elektrodenabstandes von HARMS
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuechler, M.; Bertz, A.; Gessner, T.
Conference Paper
2011Low temperature wafer bonding technologies
Haubold, M.; Baum, M.; Schubert, I.; Leidich, S.; Wiemer, M.; Gessner, T.
Conference Paper
2011Materialintegrierte Sensorschicht basierend auf Quantum-Dot Lumineszenz
Martin, J.; Piasta, D.; Kießling, T.; Otto, T.; Geßner, T.; Staudinger, U.; Demir, E.; Pötschke, P.; Voit, B.
Conference Paper
2011Mechanical and electrical packaging technologies by the application of functional layers at micro and nano scale
Haubold, M.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2011Metal thermo compression bonding at wafer level and its capabilities for 3D integration
Baum, M.; Roscher, F.; Froemel, J.; Jia, C.; Rank, H.; Hausner, R.; Reichenbach, R.; Wiemer, M.; Gessner, T.
Conference Paper
2011Method for characterizing movable micro-mirror for projector used in e.g. digital camera, involves determining function parameters of micro-mirror by evaluating device, based on detected portions of test image of micro-mirror
Specht, H.; Kurth, S.; Gessner, T.; Fiess, R.; Krayl, O.; Krueger, M.; Wiest, G.; Hilberath, T.
Patent
2011Method for the production of a substrate having a coating comprising copper, and coated substrate and device prepared by this method
Wächtler, Thomas; Schulz, Stefan; Gessner, T.; Mueller, Steve; Tuchscherer, A.; Lang, Heinrich
Patent
2011Micromachining of polymers on base of renewable raw materials for microfluidic systems
Otto, T.; Enderlein, T.; Nestler, J.; Morschhauser, A.; Klenert, P.; Gessner, T.
Conference Paper
2011Micromirror with large-tilting angle using Fe-based metallic glass
Lee, J.-W.; Lin, Y.-C.; Kaushik, N.; Sharma, P.; Makino, A.; Inoue, A.; Esashi, M.; Gessner, T.
Journal Article
2011Mikrosysteme auf Basis der Mehrkomponentenmikrospritzgießtechnologie
Schulze, R.; Heinrich, M.; Wegener, M.; Schueller, M.; Kroll, L.; Gessner, T.
Conference Paper
2011Model based design of micro actuators for flow control applications
Schueller, M.; Schulze, R.; Zeising, V.; Gebauer, C.; Otto, T.; Gessner, T.
Conference Paper
2011Modeling of TDDB in advanced Cu interconnect systems under BTS conditions
Belsky, P.; Streiter, R.; Wolf, H.; Schulz, S.E.; Aubel, O.; Gessner, T.
Conference Paper
2011Nano patterned surfaces and their influence on living cells
Baum, M.; Besser, J.; Vetter, C.; Sanchez Ordonez, S.; Wang, X.; Harazim, S.; Schmidt, O.; Wiemer, M.; Gessner, T.
Conference Paper, Journal Article
2011Nano scale AL/PD multilayer systems for reactive bonding in microsystems technology
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Abstract
2011Netzwerkmodellierung von Doppelwandler Synthetic Jet Aktoren. Poster
Schüller, M.; Schulze, R.; Gebauer, C.; Lipowski, M.; Kaulfersch, E.; Nestler, J.; Otto, T.; Geßner, T.
Conference Paper
2011Neuartiger frequenz- und amplitudenabstimmbarer Infrarotfilter
Specht, H.; Meinig, M.; Kurth, S.; Hiller, K.; Ebermann, M.; Neumann, N.; Gittler, E.; Gessner, T.
Conference Paper
2011New generation of electrostatic carrier technology (T-ESC) for reversible thin wafer clamping with seal glass bonding
Balaj, I.; Raschke, R.; Baum, M.; Uhlig, S.; Wiemer, M.; Gessner, T.
Abstract
2011Novel post-process gap reduction technology of high aspect ratio microstructures utilizing micro welding
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuchler, M.; Bertz, A.; Gessner, T.
Conference Paper
2011Prediction of wafer homogeneity maps using a virtual metrology scheme consisting of time resolved OES measurements and a neural network
Zimmermann, S.; Reich, R.; Zacher, M.; Schulz, S.E.; Gessner, T.
Conference Paper
2011Quantum mechanical methods for the simulation of electronic transport through carbon nanotubes
Zienert, A.; Schuster, J.; Streiter, R.; Gessner, T.
Conference Paper
2011Radio transmission system for power line monitoring
Voigt, S.; Leidich, S.; Gratias, A.; Kurth, S.; Keutel, T.; Gessner, T.
Conference Paper
2011Reliability enhancement of Ohmic RF MEMS switches
Kurth, S.; Leidich, S.; Bertz, A.; Nowack, M.; Frömel, J.; Kaufmann, C.; Faust, W.; Gessner, T.; Akiba, A.; Ikeda, K.
Conference Paper
2011Robust design of MEMS structures
Hofmann, K.; Billep, D.; Forke, R.; Hiller, K.; Gessner, T.
Conference Paper
2011Room-temperature reactive bonding by using nano scale multilayer systems
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Conference Paper
2011Room-temperature reactive bonding: An overview of integrated nano scale multilayer systems
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Conference Paper
2011Rotating free fluid kinetic energy harvester based on Karman vortex street
Wen, Q.; Billep, D.; Schulze, R.; Gessner, T.
Conference Paper
2011Si interposer technologies for three dimensional sensor systems
Roscher, F.; Baum, M.; Gebhardt, C.; Raukopf, S.; Wiemer, M.; Gessner, T.
Conference Paper
2011Slot-antenna for autonomous sensor systems mounted on overhead power lines
Leidich, S.; Voigt, S.; Gratias, A.; Keutel, T.; Kurth, S.; Gessner, T.
Conference Paper
2011Smart systems
Gessner, T.; Vogel, M.; Otto, T.; Schulz, S.E.; Baumann, R.
Conference Paper
2011Thermal ALD of Cu via reduction of CuxO films for the advanced metallization in spintronic and ULSI interconnect systems
Mueller, S.; Waechtler, T.; Tuchscherer, A.; Mothes, R.; Gordan, O.; Lehmann, D.; Haidu, F.; Ogiewa, M.; Gerlich, L.; Ding, S.-F.; Schulz, S.E.; Gessner, T.; Lang, H.; Zahn, D.R.T.; Qu, X.-P.
Conference Paper
2011Tunable mid-infrared filter based on Fabry-Perot interferometer with two movable reflectors
Meinig, M.; Kurth, S.; Hiller, K.; Neumann, N.; Ebermann, M.; Gittler, E.; Gessner, T.
Conference Paper
2011Variable-shaped e-beam lithography enabling process development for future copper damascene technology
Jaschinsky, P.; Erben, J.-W.; Choi, K.-H.; Schulze, K.; Gutsch, M.; Freitag, M.; Schulz, S.E.; Steidel, K.; Hohle, C.; Gessner, T.; Kücher, P.
Journal Article, Conference Paper
2011Wake-up-generator detecting external events of mechanical excitation for the improvement of energy efficient wireless inertial sensor systems
Schulze, R.; Billep, D.; Bach, D.; Gratias, A.; Gessner, T.
Conference Paper
2011ZR-based metallic glass as a novel MEMS bonding material
Lin, Y.-C.; Froemel, J.; Sharma, P.; Inoue, A.; Esashi, M.; Gessner, T.
Conference Paper
2010Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS
Zimmermann, S.; Ahner, N.; Blaschta, F.; Schaller, M.; Rülke, H.; Schulz, S.E.; Gessner, T.
Conference Paper
2010Business units and core competences of Fraunhofer ENAS
Gessner, T.; Vogel, M.; Otto, T.; Schulz, S.E.; Baumann, R.R.
Journal Article
2010Carbon nanotubes for nanoscale low temperature flip chip connections
Hermann, S.; Pahl, B.; Ecke, R.; Schulz, S.E.; Gessner, T.
Conference Paper
2010Challenges of smart system integration
Gessner, T.; Vogel, M.; Hiller, K.; Otto, T.; Bertz, A.; Billep, D.
Conference Paper
2010Compact meta-material transmission line balun based on meander lines structure and MEMS technology
Huang, C.; Chen, D.; Leidich, S.; Gessner, T.
Journal Article
2010Disilver(I) coordination complexes: Synthesis, reaction chemistry, and their potential use in CVD and spin-coating processes for silver deposition
Jakob, A.; Rüffer, T.; Schmidt, H.; Djiele, P.; Körbitz, K.; Ecorchard, P.; Haase, T.; Kohse-Hoeinghaus, K.; Frühauf, S.; Wächtler, T.; Schulz, S.; Gessner, T.; Lang, H.
Journal Article
2010Electrical resistivity calculations for copper nanointerconnect
Zong, Z.X.; Mohammadzadeh, S.; Cao, Y.F.; Qiu, Z.J.; Liu, R.; Streiter, R.; Gessner, T.
Conference Paper, Journal Article
2010Entwurf und Technologie eines Dualband Fabry-Pérot-Filters für den mittleren Infrarotbereich mit zwei beweglichen Reflektoren
Meinig, M.; Kurth, S.; Hiller, K.; Ebermann, M.; Gittler, E.; Gessner, T.
Conference Paper
2010Eutectic wafer bonding for 3D integration
Baum, M.; Jia, C.; Haubold, M.; Wiemer, M.; Schneider, A.; Rank, H.; Trautmann, A.; Gessner, T.
Conference Paper
2010Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology
Boettge, B.; Braeuer, J.; Wiemer, M.; Petzold, M.; Bagdahn, J.; Gessner, T.
Journal Article
2010Fabrication of metal-based nanoporous structures
Lin, Y.-C.; Chen, P.-C.; Chen, L.Y.; Chen, M.W.; Esashi, M.; Gessner, T.
Conference Paper
2010A fast and low actuation voltage MEMS switch for mm-wave and its integration
Akiba, A.; Mitarai, S.; Morita, S.; Ikeda, I.; Kurth, S.; Leidich, S.; Bertz, A.; Nowack, M.; Froemel, J.; Gessner, T.
Conference Paper
2010Fortschritte in der Anwendung des tiefen Siliziumätzens (DRIE).
Kuechler, M.; Hofmann, L.; Hahn, R.; Bertz, A.; Gessner, T.
Conference Paper
2010Gütebestimmung von MEMS-Strukturen im Zeitbereich mittels Laser Doppler Vibrometer und einem Logarithmierer
Voigt, S.; Tenholte, D.; Franke, D.; Reuter, D.; Hiller, K.; Gessner, T.; Mehner, J.
Conference Paper
2010High sensitive humidity sensor based on nanocomposites
Piasta, D.; Martin, J.; Wegener, M.; Hammacher, J.; Otto, W.; Gessner, T.
Conference Paper
2010Highly-integrated, low-cost in-vitro diagnostic platform for miniaturized assay development
Nestler, J.; Morschhauser, A.; Otto, T.; Koger, B.; Brandenburg, A.; Wunderlich, K.; Ehrentreich-Förster, E.; Bier, F.F.; Gessner, T.
Conference Paper
2010Image based test methodology for laser display scanners
Specht, H.; Kurth, S.; Billep, D.; Kaufmann, C.; Gessner, T.
Conference Paper
2010Integration von Kohlenstoffnanoröhren für MEMS/NEMS Anwendungen
Hermann, S.; Loschek, S.; Haibo, Y.; Bonitz, J.; Schulz, S.E.; Gessner, T.
Conference Paper
2010LEM based design optimization of SJAs
Schueller, M.; Schulze, R.; Billep, D.; Otto, T.; Gessner, T.
Conference Paper
2010Low temperature wafer bonding for microsystems using dielectric barrier discharge
Wünsch, D.; Wiemer, M.; Gabriel, M.; Gessner, T.
Journal Article
2010MEMS temperature scanner system: Principle, advances and applications
Otto, T.; Saupe, R.; Stock, V.; Gessner, T.
Conference Paper
2010Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik
Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T.
Journal Article
2010A method for the fabrication of extra-thin silicon substrates
Jia, C.; Hiller, K.; Wiemer, M.; Reuter, D.; Gessner, T.
Conference Paper
2010Micro/nano technologies towards smart systems integration
Gessner, T.; Vogel, M.; Kaufmann, C.; Hiller, K.; Kurth, S.; Nestler, J.; Otto, T.
Conference Paper
2010Mikro- und Nanotechnologien für Smart Integrated Systems
Gessner, T.; Vogel, M.; Schulz, S.E.; Wiemer, M.; Hiller, K.; Kurth, S.
Journal Article
2010Mikrofluidvorrichtung und Verfahren zum Herstellen derselben
Otto, T.; Nestler, J.; Geßner, T.
Patent
2010Mikrostrukturierung von dünnen Kunststofffolien durch Heißprägen
Baum, M.; Vetter, C.; Haehnel, M.; Hänel, J.; Wiemer, M.; Geßner, T.
Conference Paper
2010Nanofabrication of reactive structure for low temperature bonding
Lin, Y.; Bräuer, J.; Hofmann, L.; Baum, M.; Frömel, J.; Wiemer, M.; Esashi, M.; Gessner, T.
Conference Paper
2010Nanostrukturierte Breitbandreflektoren und deren Anwendung in abstimmbaren mikromechanischen Infrarot-Filtern
Kurth, S.; Hiller, K.; Neumann, N.; Seifert, M.; Ebermann, M.; Zajadazc, J.; Gessner, T.
Conference Paper
2010NEMS/MEMS and passive components integration by using novel LTCC substrate
Frömel, J.; Lin, Y.; Mori, M.; Tanaka, S.; Gessner, T.; Esashi, M.
Conference Paper
2010Neue Materialien und Technologien für Nanoelektronik und Sensorik
Schulz, S.E.; Gessner, T.
Journal Article
2010A novel three-axis AIM vibration sensor for high accuracy condition monitoring
Nowack, M.; Reuter, D.; Bertz, A.; Kuechler, M.; Aurich, T.; Dittrich, C.; Gessner, T.
Conference Paper
2010Phosphane copper(I) dicarboxylates: Synthesis and their potential use as precursors for the spin-coating process in the deposition of copper
Jakob, A.; Rüffer, T.; Ecorchard, P.; Walfort, B.; Körbitz, K.; Frühauf, J.; Schulz, S.E.; Gessner, T.; Lang, H.
Journal Article
2010Phosphite copper(I) trifluoroacetates [((RO)(3)P)(m)CuO2CCF3] (m=1, 2, 3): synthesis, solid state structures and their potential use as CVD precursors
Mothes, R.; Rüffer, T.; Shen, Y.Z.; Jakob, A.; Walfort, B.; Petzold, H.; Schulz, S.E.; Ecke, R.; Gessner, T.; Lang, H.
Journal Article
2010Polymer lab-on-chip systems with integrated electrochemical pumps suitable for large-scale fabrication
Nestler, J.; Morschhauser, A.; Hiller, K.; Otto, T.; Bigot, S.; Auerswald, J.; Knapp, H.F.; Gavillet, J.; Gessner, T.
Conference Paper, Journal Article
2010Pulse reverse electroplating for TSV filling in 3D integration
Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T.
Conference Paper
2010Reactive bonding and low temperature bonding of heterogeneous materials
Wiemer, M.; Braeuer, J.; Wünsch, D.; Gessner, T.
Conference Paper
2010Reaktives Fügen löst Temperaturprobleme
Braeuer, J.; Wiemer, M.; Gessner, T.
Journal Article
2010Selbstausbreitende exotherme Reaktionen als interne Wärmequelle für die Aufbau- und Verbindungstechnik von Mikrosystemen
Bräuer, J.; Böttge, B.; Wiemer, M.; Petzold, M.; Gessner, T.
Conference Paper
2010Self-contained microfluidic cartridges for in-vitro diagnostic applications: Recent advances and improvements
Nestler, J.; Otto, T.; Sommer, J.-P.; Michel, B.; Gessner, T.; Bier, F.F.
Conference Paper
2010Sensormodul mit Weckeinrichtung
Billep, D.; Schulze, R.; Geßner, T.
Patent
2010Simulation of TaNx deposition by reactive PVD
Wolf, H.; Streiter, R.; Friedemann, M.; Belsky, P.; Bakaeva, O.; Letz, T.; Gessner, T.
Journal Article
2010Smart Integrated Systems - Developments of Fraunhofer ENAS
Vogel, M.; Hiller, K.; Bertz, A.; Wiemer, M.; Gessner, T.
Book Article
2010Smart Systems Integration - Eine Herausforderung für zukünftige Mikro- und Nanosysteme
Gessner, T.; Vogel, M.
Journal Article
2010Subwavelength structures for infrared filtering
Kurth, S.; Hiller, K.; Neumann, N.; Seifert, M.; Ebermann, M.; Zajadacz, J.; Gessner, T.
Conference Paper
2010Technologie zur Integration von Kohlenstoffnanoröhren für Intertialsensoren
Bonitz, J.; Hermann, S.; Kaufmann, C.; Gessner, T.
Conference Paper
2010Thermoelectric generators based on polymers and nanocomposites
Martin, J.; Schwittlinsky, M.; Piasta, D.; Streit, P.; Billep, D.; Otto, T.; Gessner, T.
Conference Paper
2010Transport in carbon nanotubes: Contact models and size effects
Zienert, A.; Schuster, J.; Streiter, R.; Gessner, T.
Journal Article, Conference Paper
2009Analysis of image quality for laser display scanner test
Specht, H.; Kurth, S.; Billep, D.; Gessner, T.
Conference Paper
2009Characterization of eutectic wafer bonding using gold and silicon
Lin, Y.; Baum, M.; Haubold, M.; Frömel, J.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2009Controlling the formation of nanoparticles for definite growth of carbon nanotubes for interconnect applications
Hermann, S.; Ecke, R.; Schulz, S.E.; Gessner, T.
Journal Article
2009Coplanar electromagnetic signal coupler for wafer-scale packaging of RF-MEMS devices
Leidich, S.; Voigt, S.; Hiller, K.; Gessner, T.
Journal Article
2009Copper oxide ALD from a Cu(I) beta-diketonate: Detailed growth studies on SiO2 and TaN
Wächtler, T.; Roth, N.; Mothes, R.; Schulze, S.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M.
Conference Paper
2009Copper oxide ALD from a Cu(I) beta-diketonate: Growth studies and application as seed layers for electrochemical copper deposition
Waechtler, T.; Hofmann, L.; Mothes, R.; Schulze, S.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M.
Abstract
2009Copper oxide films grown by atomic layer deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO2
Waechtler, T.; Oswald, S.; Roth, N.; Jakob, A.; Lang, H.; Ecke, R.; Schulz, S.E.; Gessner, T.; Moskvinova, A.; Schulze, S.; Hietschold, M.
Journal Article
2009Detailed study of copper oxide ALD on SiO2, TaN, and Ru
Wächtler, T.; Schulze, S.; Hofmann, L.; Hermann, S.; Roth, N.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M.
Poster
2009Development and evaluation of AuSi eutectic wafer bonding
Lin, Y.; Baum, M.; Haubold, M.; Frömel, J.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2009Electrochemical deposition of reactive nanoscale metallization systems for low temperature bonding in 3D integration
Hofmann, L.; Braeuer, J.; Baum, M.; Schulz, S.E.; Gessner, T.
Conference Paper
2009Electronic transport properties in copper nanowire
Mohammadzadeh, S.; Pouladsaz, D.; Streiter, R.; Gessner, T.
Journal Article
2009Electronic transport properties of copper atomic wires
Mohammadzadeh, S.; Streiter, R.; Gessner, T.
Conference Paper
2009Geometry dependent I-V characteristics of gold atomic-sized contacts
Mohammadzadeh, S.; Streiter, R.; Gessner, T.
Conference Paper
2009Hermetic thin film encapsulation of mechanical transducers for smart label applications
Reuter, D.; Nowack, M.; Rennau, M.; Bertz, A.; Wiemer, M.; Kriebel, F.; Gessner, T.
Conference Paper
2009Herstellung und Evaluierung nanoskaliger reaktiver Strukturen für den Einsatz von Niedertemperatur-Bondverfahren in der Mikrosystemtechnik
Bräuer, J.; Hofmann, L.; Wiemer, M.; Gessner, T.
Conference Paper
2009Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods
Zimmermann, S.; Ahner, N.; Blaschta, F.; Schaller, M.; Zimmermann, H.; Rülke, H.; Lang, N.; Röpcke, J.; Schulz, S.E.; Gessner, T.
Conference Paper
2009Integration von MEMS-Inertialsensoren in Smart RFID Label zur Transportüberwachung empfindlicher Güter
Nowack, M.; Reuter, D.; Bertz, A.; Gessner, T.
Conference Paper
2009Low temperature bonding of hetero-materials using ambient pressure plasma activation
Wiemer, M.; Wünsch, D.; Bräuer, J.; Eichler, M.; Hennecke, P.; Gessner, T.
Conference Paper
2009Low-cost in-vitro diagnostic cartridges with integrated sensor, micropumps and reagents
Nestler, J.; Schueller, M.; Morschhauser, A.; Otto, T.; Gessner, T.; Brandenburg, A.; Michel, D.; Bier, F.F.
Conference Paper
2009MEMS analyzer for fast determination of mixed gases
Otto, T.; Saupe, R.; Weiß, A.; Stock, V.; Throl, O.; Grählert, W.; Kaskel, S.; Schreck, H.; Gessner, T.
Conference Paper
2009Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik
Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T.
Conference Paper
2009Mikrosensoren überwachen Endoprothesen
Baum, M.; Boese-Landgraf, J.; Gessner, T.
Conference Paper
2009Mikrostruktur, Verfahren zu deren Herstellung, Vorrichtung zum Bonden einer Mikrostruktur und Mikrosystem
Baum, M.; Bräuer, J.; Gessner, T.; Hofmann, L.; Froemel, J.; Letsch, H.; Wiemer, M.
Patent
2009Nanotechnology for polymer-based sensors and actuators
Martin, J.; Piasta, D.; Gessner, T.
Conference Paper
2009Near field scanner in time and frequency domain
Reinhold, C.; Mager, T.; Hedayat, C.; Gessner, T.
Journal Article
2009New bonding technologies for MEMS
Wiemer, M.; Frömel, J.; Jia, C.; Gessner, T.
Book Article
2009A novel method for the fabrication of deep-submicron structure
Jia, C.; Wiemer, M.; Grunert, J.; Otto, T.; Gessner, T.
Conference Paper
2009Performance and reliability test of MEMS optical scanners
Kurth, S.; Kaufmann, C.; Hahn, R.; Specht, H.; Gessner, T.
Journal Article
2009Plasmagestütztes Hochrateätzen von Silikatgläsern mit variablem Ätzprofil
Bertz, A.; Fendler, R.; Schuberth, R.; Werner, T.; Gessner, T.
Conference Paper
2009Process development for smart systems integration in MEMS
Ecke, R.; Frömel, J.; Schulz, S.E.; Wiemer, M.; Gessner, T.
Journal Article
2009Reaktives Mikrofügen unter Ausnutzung nanoskaliger Effekte
Bräuer, J.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2009Resonant mode detection for fast determination of structural and material parameters of MEMS
Meinig, M.; Kurth, S.; Shaporin, A.; Bauer, W.; Gessner, T.
Conference Paper
2009Silicon cylinder spiral coil for nuclear magnetic resonance spectroscopy of nanoliter samples
Leidich, S.; Braun, M.; Gessner, T.; Riemer, T.
Journal Article
2009Smart integrated systems: From components to products
Gessner, T.; Baum, M.; Gessner, W.; Lugert, G.
Book Article
2009Smart systems integration by using micro and nano technologies
Gessner, T.; Wiemer, M.; Bertz, A.; Vogel, M.
Journal Article
2009Smart systems integration by using micro- and nanotechnologies
Gessner, T.; Reuter, D.
Conference Paper
2009Solid-Liquid-Interdiffusion Bonding für 3D-Integration und Wafer-Level-Packaging
Baum, M.; Hofmann, L.; Wiemer, M.; Gessner, T.
Conference Paper
2009Technologies and MEMS sensor solutions for smart integrated systems
Hiller, K.; Kurth, S.; Bertz, A.; Gessner, T.
Journal Article
2009Thermo compression bonding with gold interfaces
Frömel, J.; Haubold, M.; Wiemer, M.; Gessner, T.
Conference Paper
2009Time efficient test method for dimensional parameter determination based on resonant mode detection
Meinig, M.; Kurth, S.; Shaporin, A.; Giessmann, S.; Gessner, T.
Conference Paper
2009Trends in 3D Integration of MEMS and Electronics
Wiemer, M.; Braeuer, J.; Besser, J.; Gessner, T.
Conference Paper
2009Using of reactive multilayer systems for room temperature bonding of micro components
Bräuer, J.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2008Airgap structures by using sacrificial wet etch: Fabrication, thermal and mechanical behaviour, reliability
Schulze, K.; Schulz, S.E.; Koerner, H.; Gessner, T.
Conference Paper
2008ALD of Copper and Copper Oxide Thin Films for Applications in Metallization Systems of ULSI Devices
Waechtler, T.; Oswald, S.; Roth, N.; Lang, H.; Schulz, S.E.; Gessner, T.
Conference Paper
2008An all-polymer microfluidic system for protein sensing applications with integrated Iow-cost pumps, surface modification and sealing
Nestler, J.; Hiller, K.; Gessner, T.; Gavillet, J.; Auerswald, J.; Knapp, H.F.; Griffiths, C.; Bigot, S.; Beckers, M.-C.
Conference Paper
2008Characterization of mechanical shock by impulse specific peak deflection (ISPD)
Kurth, S.; Shaporin, A.; Gessner, T.
Conference Paper
2008Complex miniaturized analysis system for nuclear magnetic resonance spectroscopy of nanoliter amounts of biological sample material
Leidich, S.; Riemer, T.; Braun, M.; Kurth, S.; Gessner, T.
Conference Paper
2008Continuously tunable RF-MEMS varactor for high power applications
Leidich, S.; Kurth, S.; Gessner, T.
Conference Paper
2008Controlling the formation of nanoparticles for definite growth of carbon nanotubes for interconnect applications
Hermann, S.; Ecke, R.; Schulz, S.; Gessner, T.
Journal Article, Conference Paper
2008Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers
Wächtler, T.; Oswald, S.; Pohlers, A.; Schulze, S.; Schulz, S.E.; Gessner, T.
Conference Paper
2008Copper(I) Carboxylates of Type [(nBu3P)mCuO2CR] (m = 1, 2, 3) - Synthesis, Properties, and their Use as CVD Precursors
Jakob, A.; Shen, Y.; Wächtler, T.; Schulz, S.E.; Gessner, T.; Riedel, R.; Fasel, C.; Lang, H.
Journal Article
2008Developments trends in the field of wafer bonding technologies
Wiemer, M.; Haubold, M.; Jia, C.; Wünsch, D.; Frömel, J.; Gessner, T.
Conference Paper
2008Dual-detector optical MEMS spectrum analyzer: advances, applications, and prospects
Otto, T.; Saupe, R.; Weiss, A.; Stock, V.; Wiesner, K.; Lampe, U.; Fleischer, M.; Gessner, T.
Conference Paper
2008Electronic transport properties in copper nanowire
Mohammadzadeh, S.; Pouladsaz, D.; Streiter, R.; Gessner, T.
Conference Paper, Journal Article
2008Electrostatic force coupling of MEMS oscillators for spectral vibration measurements
Forke, R.; Scheibner, D.; Mehner, J.E.; Gessner, T.; Dötzel, W.
Conference Paper, Journal Article
2008Evaluation of airgap structures produced by wet etch of sacrificial dielectrics: Impact of wet etch media on diffusion barriers, copper, and the Cu/SiC:H interface
Schulze, K.; Schulz, S.E.; Gessner, T.
Conference Paper
2008Fabrication and characterization of a force coupled sensor-actuator system for adjustable resonant low frequency vibration detection
Forke, R.; Scheibner, D.; Hiller, K.; Gessner, T.; Doetzel, W.; Mehner, J.
Journal Article
2008Fabrication of a low-frequency ultrasonic transducer
Jia, C.; Wiemer, M.; Hiller, K.; Otto, T.; Gessner, T.
Conference Paper
2008Fabrication of magnetic polymer membranes with microfluidic functionality
Morschhauser, A.; Nestler, J.; Baum, M.; Schüller, M.; Jänig, O.; Otto, T.; Gessner, T.
Conference Paper
2008Fuel gas determination using a MEMS gas analyser
Otto, T.; Saupe, R.; Weiss, A.; Throl, O.; Stock, V.; Gessner, T.
Conference Paper
2008Highly integrated polymer-based technology platform for in-vitro diagnostics
Otto, Thomas; Nestler, Jörg; Morschhauser, Andreas; Schüller, Martin; Geßner, T.; Krissler, Jan; Ebling, Frank; Wegener, Michael; Grzesiak, Andrzej; Burgard, Matthias; Brandenburg, Albrecht; Sulz, Gerd; Nebling, Eric; Hintsche, Rainer; Wirth, Ingo; Godlinski, Dirk; Tovar, Günter E.M.; Weber, Achim; Ehrentreich-Förster, Eva; Gajovic-Eichelmann, Nenad; Bier, Frank F.
Conference Paper
2008In-plane-resonator for NMR spectroscopy of nano liter samples
Leidich, S.; Gessner, T.; Riemer, T.
Conference Paper
2008Investigation of etch processes of dense and porous low-k dielectrics using OES and QMS as in situ diagnostic methods
Zimmermann, S.; Blaschta, F.; Schaller, M.; Rülke, H.; Schulz, S.E.; Gessner, T.
Conference Paper
2008Investigations on via geometry and wetting behavior for the filling of through silicon vias by copper electro deposition
Hofmann, L.; Küchler, M.; Gumprecht, T.; Ecke, R.; Schulz, S.; Gessner, T.
Conference Paper
2008Low cost valveless magnetic micropumps suitable for array applications
Schüller, M.; Nestler, J.; Morschhauser, A.; Otto, T.; Gessner, T.
Conference Paper
2008Low-cost micro valves based on electrolysis inside hydrogels
Nestler, J.; Hiller, K.; Morschhauser, A.; Schüller, M.; Otto, T.; Gessner, T.
Conference Paper
2008Low-cost, fully integrated liquid handling platform for protein assays
Nestler, J.; Hiller, K.; Morschhauser, A.; Bigot, S.; Griffiths, C.; Auerswald, J.; Gavillet, J.; Nonglaton, G.; Otto, T.; Gessner, T.
Conference Paper
2008A MEMS friction vacuum gauge suitable for high temperature environment
Tenholte, D.; Kurth, S.; Gessner, T.; Dötzel, W.
Conference Paper, Journal Article
2008MEMS-based spectroscopic ellipsometry
Saupe, R.; Otto, T.; Gruska, B.; Weiss, A.; Stock, V.; Gessner, T.
Conference Paper
2008Micro Actuators based on Structured Water
Nestler, J.; Hiller, K.; Otto, T.; Gessner, T.
Journal Article
2008Micro machining technologies for non silicon materials
Baum, M.; Rota, A.; Salk, N.; Otto, T.; Gessner, T.
Conference Paper
2008Microfluidic cartridge with integrated pumps and liquid position feedback design for running protein assays
Nestler, J.; Enderlein, T.; Hiller, K.; Otto, T.; Gessner, T.; Auerswald, J.; Knapp, H.F.; Griffiths, C.; Bigot, S.
Conference Paper
2008Mikrofluidische Schnittstellen durch Laserstrukturierung
Baum, M.; Keiper, B.; Hänel, J.; Otto, T.; Gessner, T.
Journal Article
2008Mikropumpe und Verfahren zum Pumpen eines Fluids
Otto, T.; Schüller, M.; Nestler, J.; Gessner, T.; Baum, M.; Morschhauser, A.
Patent
2008Nanostructured polymer thin films: Application to biosensors
Gavillet, J.; Getin, S.; Quesnel, E.; Martin, S.; Gelapierre, G.; Hiller, K.; Nestler, J.; Gessner, T.; Soechtig, J.; Voirin, G.; Buergi, L.; Auerswald, J.; Knapp, H.F.; Ross, S.; Bigot, S.; Ehrat, M.; Lieb, A.; Beckers, M.-C.; Dresse, D.
Conference Paper
2008Reliability of MEMS devices in shock and vibration overload situations
Kurth, S.; Shaporin, A.; Hiller, K.; Kaufmann, C.; Gessner, T.
Conference Paper
2008Reproducible reliable ausi eutectic wafer bond process with high yield
Schwerdtner, R.; Froemel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2008Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits
Baum, M.; Letsch, H.; Shaporin, A.V.; Otto, T.; Gessner, T.
Conference Paper
2008Thin film encapsulation technology for harms using sacrificial CF-polymer
Reuter, D.; Bertz, A.; Nowack, A.; Gessner, T.
Conference Paper, Journal Article
2008Vorrichtung und Verfahren zum Hin- und Herbewegen einer Fluessigkeit ueber eine vorbestimmte Flaeche
Otto, T.; Schüller, M.; Nestler, J.; Gessner, T.; Morschhauser, A.
Patent
2008Vorrichtung und Verfahren zur Ermittlung von Informationen über eine in einem Strömungskanal strömende Flüssigkeit
Schüller, M.; Otto, T.; Geßner, T.; Nestler, J.; Morschhauser, A.
Patent
2008Waferbond technologies and quality assesment
Wiemer, M.; Frömel, J.; Chenping J.; Haubold, M.; Gessner, T.
Conference Paper
2007Acceleration Sensor Arrays
Dienel, M.; Hiller, K.; Gessner, T.; Dötzel, W.
Conference Paper
2007Adjustable Force Coupled Sensor-Actuator System for Low Frequency Resonant Vibration Detection
Forke, R.; Scheibner, D.; Mehner, J.; Gessner, T.; Dötzel, W.
Conference Paper
2007Application of higher order derivatives method to parametric simulation of MEMS
Kolchuzhin, V.; Mehner, J.; Gessner, T.; Doetzel, W.
Conference Paper
2007Arrays of Sensors with Variable Stiffness
Shaporin, A.V.; Seifert, M.; Hanf, M.; Hiller, K.; Frühauf, J.; Gessner, T.; Dötzel, W.
Conference Paper
2007Atomic layer deposition of copper and copper oxide for applications in microelectronic metallization systems
Waechtler, T.; Schulz, S.E.; Oswald, S.; Gessner, T.
Journal Article, Conference Paper
2007AVT als Basis erfolgreicher MEMS-Kommerzialisierung
Frömel, J.; Wiemer, M.; Gessner, T.
Journal Article
2007Bonding of glass chip based SPR sensors to thermoplastic microfluidic scaffolds
Auerswald, J.; Niedermann, P.; Dias, F.; Keppner, H.; Bigot, S.; Beckers, M.-C.; Nestler, J.; Hiller, K.; Gessner, T.; Knapp, H.F.
Conference Paper
2007Characterization of sputtered Ta and TaN films by spectroscopic ellipsometry
Waechtler, T.; Gruska, B.; Zimmermann, S.; Schulz, S.E.; Gessner, T.
Conference Paper
2007CMP issues arising from novel materials and concepts in the BEOL of advanced Microelectronic Devices
Gottfried, K.; Schubert, I.; Schulze, K.; Schulz, S.E.; Gessner, T.
Conference Paper
2007Demonstration des Einsatzes flächiger low-cost-Sensoren am Beispiel eines trainingsunterstützenden Tischtennisschlägers
Schuberth, R.; Otto, T.; Schwerdtner, R.; Bach, D.; Wegener, M.; Gessner, T.
Conference Paper
2007Design and fabrication of a micromechanical vertical resonator
Jia, C.; Wiemer, M.; Kurth, S.; Otto, T.; Gessner, T.
Conference Paper
2007Determination of dimensional parameters in MEMS components by vibration analyses
Kurth, S.; Mehner, J.; Shaporin, A.V.; Michael, S.; Ebert, M.; Gessner, T.
Conference Paper
2007Development and characterization of Cu to Cu bonding technology
Baum, M.; Letsch, H.; Shaporin, A.V.; Otto, T.; Gessner, T.
Conference Paper
2007Development of wafer level packaging for MEMS micro mirrors
Froemel, J.; Sato, Y.; Ohtaka, K.; Gessner, T.
Conference Paper
2007Electrochemical microfluidic pumps based on super absorbing polymers
Nestler, J.; Morschhauser, A.; Hiller, K.; Bigot, S.; Auerswald, J.; Gavillet, J.; Otto, T.; Gessner, T.
Conference Paper
2007enversys - Towards a Competence Center for Advanced Engineering and Verification Techniques for Heterogeneous Systems
Specht, H.; Mehner, J.; Otto-Adamczak, T.; Cristiano, D.; Winkler, T.; Neugebauer, R.; Gessner, T.
Abstract
2007Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Critical processes and reliability of Air Gap formation
Schulze, K.; Schulz, S.E.; Gessner, T.
Conference Paper, Journal Article
2007Flexible taktile Sensorarrays auf Basis verschiedener piezoelektrischer Funktionspolymere
Schwerdtner, R.; Geßner, T.; Schuberth, R.; Bach, D.; Otto, T.; Wagner, M.; Danz, R.; Wegener, M.
Conference Paper
2007Flexile taktile Sensorarrays auf Basis verschiedener piezoelektrischer Funktionspolymere
Schwerdtner, R.; Otto, T.; Schuberth, R.; Bach, D.; Wegener, M.; Danz, R.; Gessner, T.
Conference Paper
2007Forensische Untersuchungen mittels MEMS-Spektrometern
Otto, T.; Saupe, R.; Weiss, A.; Stock, V.; Gessner, T.
Conference Paper
2007Fully integrated polymer based microfluidic pumps and valves in Lab-on-Chip systems for Point-of-Care use
Nestler, J.; Morschhauser, A.; Hiller, K.; Auerswald, J.; Knapp, H.F.; Otto, T.; Gessner, T.
Conference Paper
2007Hochreflektiver mikromechanischer Scanner für Materialbearbeitung und medizinische Anwendungen
Bonitz, J.; Kaufmann, C.; Gessner, T.; Bundesmann, C.; Eichentopf, I.-M.; Maendl, S.; Neumann, H.
Conference Paper
2007Impact of dielectric material and metal arrangement on thermal behaviour of interconnect systems
Schulze, K.; Schulz, S.E.; Gessner, T.
Conference Paper
2007Improvement of solid Au-Si eutectic bond process
Schwerdtner, R.; Froemel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2007Influence of barrier crystallization on CV characteristics of MIS structures
Ecke, R.; Rennau, M.; Zimmermann, S.; Schulz, S.E.; Gessner, T.
Conference Paper
2007Integrated polymer multimode waveguides for microfluidic sensing applications
Otto, T.; Nestler, J.; Baum, M.; Schroeder, H.; Ebling, F.; Bruch, R.; Gessner, T.
Conference Paper
2007Integration aspects of a polymer based SPR biosensor with active micro optical and micro fluidic elements
Hiller, K.; Nestler, J.; Gessner, T.; Gavillet, J.; Getin, S.; Quesnel, E.; Martin, S.; Delapierre, G.; Soechtig, J.; Voirin, G.; Buergi, L.; Auerswald, J.; Knapp, H.F.; Stanley, R.; Bigot, S.; Dimov, S.; Ehrat, M.; Lieb, A.; Beckers, M.-C.; Dresse, D.; Victor-Pujebet, E.
Conference Paper
2007Das intelligente Produkt gewinnt
Baum, M.; Gessner, T.
Journal Article
2007Laser-Display-System auf Basis von MEMS-Scannern
Specht, H.; Kurth, S.; Kaufmann, C.; Hahn, R.; Dötzel, W.; Gessner, T.; Mehner, J.
Conference Paper
2007Low-Temperature Ti-Si bonding and its application in micro-device fabrication
Jia, C.; Hiller, K.; Wiemer, M.; Otto, T.; Gessner, T.
Conference Paper
2007MEMS based laser display system
Specht, H.; Kurth, S.; Kaufmann, C.; Gessner, T.; Dötzel, W.
Conference Paper
2007Mikromechanische Schaltervorrichtung mit mechanischer Kraftverstärkung
Frömel, J.; Voigt, S.; Kurth, S.; Leidich, S.; Bertz, A.; Kaufmann, C.; Gessner, T.
Patent
2007Mikrospiegelspektrometer für den Nahinfraroten Spektralbereich - Applikationen & Trends
Otto, T.; Saupe, R.; Weiss, A.; Stock, V.; Gessner, T.
Conference Paper
2007Mikrospulen und RF-MEMS Varaktoren für die kernmagnetische Resonanzspektroskopie - Applikationen und Technologie
Leidich, S.; Hofmann, L.; Riemer, T.; Kurth, S.; Schubert, I.; Kaufmann, C.; Gessner, T.
Conference Paper
2007Mikrostrukturierung von Kunststoffen durch Heißprägen und Laserablation
Baum, M.; Mann, M.; Ebling, F.; Keiper, B.; Haenel, J.; Otto, T.; Gessner, T.
Conference Paper
2007Miniaturisierung in der instrumentellen Analytik dank Mikrospiegeln
Otto, T.; Saupe, R.; Weiss, A.; Stock, V.; Gessner, T.
Journal Article
2007Modeling of mass printed organic field effect transistors
Martin, J.; Otto, T.; Gessner, T.
Conference Paper
2007Neue Technologie in der Herstellung - neue Chance am Markt
Thieme, T.; Bertz, A.; Gessner, T.; Dittrich, C.
Conference Paper
2007A new method for high-rate deep dry etching of silicate glass with variable ETCH profile
Bertz, A.; Fendler, R.; Schuberth, R.; Hentsch, W.; Gessner, T.
Conference Paper
2007Novel Copper(I) and Silver(I) Complexes as Precursors for Chemical Vapor Deposition and Spin-Coating of Copper and Silver
Frühauf, S.; Gessner, T.; Haase, T.; Jakob, A.; Kohse-Hoeinghaus, K.; Lang, H.; Schulz, S.E.; Wächtler, T.
Conference Paper
2007Optimized fabrication of silicon nanofocusing x-ray lenses using deep reactive ion etching
Kurapova, O.; Lengeler, B.; Schroer, C.G.; Küchler, M.; Gessner, T.; Hart, A. van der
Journal Article
2007Packaging aspects of MEMS-based optical systems
Saupe, R.; Otto, T.; Weiss, A.; Stock, V.; Gessner, T.
Conference Paper
2007Performance and reliability test of MEMS optical scanners
Kurth, S.; Kaufmann, C.; Hahn, R.; Mehner, J.; Dötzel, W.; Gessner, T.
Conference Paper
2007Permanentmagnetische Membranen für mikrofluidische Aktorik
Morschhauser, A.; Nestler, J.; Voigt, S.; Schueller, M.; Otto, T.; Gessner, T.
Conference Paper
2007Phosphane copper(I) complexes as CVD precursors
Roth, N.; Jakob, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.
Journal Article, Conference Paper
2007Polymer Lab-on-Chip systems with integrated electrochemical pumps
Nestler, J.; Morschhauser, A.; Hiller, K.; Otto, T.; Bigot, S.; Gessner, T.
Conference Paper
2007Roughness improvement of the COSi2/Si-interface for an application as buried silicide
Zimmermann, S.; Zhao, Q.T.; Höhnemann, H.; Wiemer, M.; Kaufmann, C.; Mantl, S.; Dudek, V.; Gessner, T.
Conference Paper, Journal Article
2007Siliziumätzen schafft Sensibilität
Baum, M.; Gessner, T.
Journal Article
2007Smart Hip Joint Implants
Baum, M.; Schaufuß, J.; Boese-Landgraf, J.; Otto, T.; Gessner, T.
Conference Paper
2007Spektrale Vibrationsmessung mit mikromechanischen kraftgekoppelten Silizium-Schwingern
Forke, R.; Scheibner, D.; Hiller, K.; Gessner, T.; Dötzel, W.; Mehner, J.
Conference Paper
2007Substrat mit einer Kupfer enthaltenden Beschichtung und Verfahren zu deren Herstellung mittels Atomic Layer Deposition
Gessner, T.; Schulz, S.; Wächtler, T.; Lang, H.; Jakob, A.
Patent
2007Test-Structure based MEMS Characterization Technique
Shaporin, A.V.; Hanf M.; Forke, R.; Mehner, J.; Gessner, T.; Dötzel, W.
Conference Paper
2007Thin Film Encapsulation of High Aspect Ratio Microstructures using sacrificial CF-Polymer
Reuter, D.; Bertz, A.; Gessner, T.
Conference Paper
2007Thin Film Encapsulation of Microstructures using sacrificial CF-Polymer
Reuter, D.; Bertz, A.; Werner, T.; Nowack, M.; Gessner, T.
Conference Paper
2007Verfahren und Vorrichtung zum Abformen von Strukturen
Otto, T.; Froemel, J.; Nestler, J.; Gessner, T.
Patent
2007Verfahren zur Herstellung von elektrisch und/oder magnetisch ansteuerbaren Membranen sowie magnetischer Aktor mit einer derartigen Membran
Otto, T.; Morschhauser, A.; Nestler, J.; Gessner, T.; Voigt, S.
Patent
2007Wafer-Level Active Testing of Capacitive Inertial Sensors
Nowack, M.; Reuter, D.; Rennau, M.; Bertz, A.; Gessner, T.
Conference Paper
200624 GHz RF-MEMS phase shifter with non-galvanic electromagnetic coupling fabricated in silicon-bulk technology
Voigt, S.; Leidich, S.; Doetzel, W.; Kurth, S.; Gessner, T.
Journal Article
2006Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems
Frömel, J.; Billep, D.; Gessner, T.; Wiemer, M.
Conference Paper, Journal Article
2006Cu/barrier CMP on porous low-k based interconnect schemes
Gottfried, K.; Schubert, I.; Schulz, S.E.; Gessner, T.
Conference Paper, Journal Article
2006Different approaches to integrate patterned buried CoSi2 layers in SOI substrates
Zimmermann, S.; Zhao, Q.T.; Höhnemann, H.; Wiemer, M.; Kaufmann, C.; Mantl, S.; Dudek, V.; Gessner, T.
Conference Paper, Journal Article
2006Direct bonding with on-wafer metal interconnections
Jia, C.; Wiemer, M.; Gessner, T.
Conference Paper, Journal Article
2006Electrostatic force coupling of MEMS oscillators for spectral vibration measurements
Forke, R.; Scheibner, D.; Mehner, J.; Geßner, T.; Doetzel, W.
Conference Paper
2006In-process gap reduction of capacitive transducers
Reuter, D.; Bertz, A.; Billep, D.; Scheibner, D.; Dötzel, W.; Gessner, T.
Journal Article
2006MEMS based micro scanners: Components, technologies and applications
Geßner, T.; Bonitz, J.; Kaufmann, C.; Kurth, S.; Specht, H.
Conference Paper
2006MEMS Vakuumsensor nach dem Reibungsprinzip
Kurth, S.; Tenholte, D.; Hiller, K.; Kaufmann, C.; Gessner, T.; Dötzel, W.
Patent
2006Microfluidic bubble actuators based on hydrogels
Nestler, J.; Hiller, K.; Otto, T.; Gessner, T.
Conference Paper
2006Micromachined force coupled sensor actuator system for frequency selective vibration monitoring
Forke, R.; Scheibner, D.; Mehner, J.; Geßner, T.; Doetzel, W.
Conference Paper
2006Microwave phase shifter with electromagnetic signal coupling in silicon bulk technology
Leidich, S.; Voigt, S.; Kurth, S.; Hiller, K.; Gessner, T.
Journal Article
2006Parametric finite element analysis for reduced order modeling of MEMS
Kolchuzhin, V.; Mehner, J.E.; Gessner, T.; Doetzel, W.
Conference Paper
2006Parametric simulation of MEMS based on automatic differentiation of finite element codes
Kolchuzhin, V.; Mehner, J.; Gessner, T.; Doetzel, W.
Conference Paper
2006Principle and applications of a new MOEMS spectrometer
Otto, T.; Saupe, R.; Weiss, A.; Stock, V.; Bruch, R.; Gessner, T.
Conference Paper
2006Schalteranordnung zur Ansteuerung einer Antennenanordnung mit einzelnen Antennenelementen mit einer Mehrzahl von matrixförmig angeordneten Schaltern und Verfahren zum Schalten von matrixförmig angeordneten Schaltern
Kurth, S.; Frömel, J.; Voigt, S.; Leidich, S.; Nestler, J.; Shaporin, A.; Dötzel, W.; Gessner, T.
Patent
2006Smart Systems Integration - Eine Herausforderung für zukünftige Mikro- und Nanotechnologien
Gessner, T.; Baum, M.; Hiller, K.; Mehner, J.; Wiemer, M.; Otto, T.; Saupe, R.; Nestler, J.
Conference Paper
2006A tunable resonant vibration measurement unit based on a micromachined force coupled sensor-actuator system
Mehner, J.; Gessner, T.; Forke, R.; Scheibner, D.; Doetzel, W.
Conference Paper
2005Bonding and Deep RIE - A powerful combination for high aspect ratio sensors and actuators
Hiller, K.; Küchler, M.; Billep, D.; Schröter, B.; Dienel, M.; Scheibner, D.; Gessner, T.
Conference Paper
2005The current limits of the laser-acoustic test method to characterize low-k films
Schneider, D.; Frühauf, S.; Schulz, S.E.; Gessner, T.
Conference Paper, Journal Article
2005Dresden/Chemnitz - A great place for small things
Leson, A.; Gessner, T.
Journal Article
2005Efficient and flexible high aspect ratio micromachining for the fabrication of low-g-sensors
Bertz, A.; Lohmann, C.; Reuter, D.; Geßner, T.
Abstract
2005Fabrication and characterization of a micro-machined ultrasonic transducer
Jia, C.; Wiemer, M.; Zichner, N.; Otto, T.; Gessner, T.
Conference Paper
2005Fabrication and characterization of buried silicide layers on SOI substrates for BICMOS-applications
Zimmermann, S.; Zhao, Q.T.; Trui, B.; Wiemer, M.; Kaufmann, C.; Mantl, S.; Dudek, V.; Gessner, T.
Conference Paper, Journal Article
2005Fabrication of embedded micro-channels by intended under-etching and trench filling
Jia, Chenping; Wiemer, M.; Müller, R.; Otto, T.; Geßner, T.
Conference Paper
2005Fabrication of SOI substrates with buried silicide layers for BiCMOS applications
Wiemer, M.; Zimmermann, S.; Zhao, Q.T.; Trui, B.; Kaufmann, C.; Mantl, S.; Dudek, V.; Gessner, T.
Conference Paper
2005Finite element based reduced order modeling for micro electro mechanical systems (MEMS)
Mehner, J.; Kolchuzhin, V.; Schaporin, A.; Dötzel, W.; Gessner, T.
Conference Paper
2005Flexible Herstellung und Charakterisierung von Inertialsensoren basierend auf der AIM-Technologie
Lohmann, C.; Bertz, A.; Reuter, D.; Küchler, M.; Geßner, T.
Conference Paper
2005Improved silicon master tools for hot embossing
Baum, M.; Nestler, J.; Rost, D.; Weissmantel, S.; Otto, T.; Reisse, G.; Gessner, T.
Conference Paper
2005In-process gap reduction of capacitive transducers
Reuter, D.; Bertz, A.; Billep, D.; Scheibner, D.; Buschnakowski, S.; Doetzel, W.; Gessner, T.
Conference Paper
2005Koplanare elektromagnetische Koppler zur Signalkontaktierung von RF-MEMS Bauelementen bei Mikrowellenfrequenzen
Voigt, S.; Leidich, S.; Kurth, S.; Geßner, T.; Doetzel, W.
Conference Paper
2005Material development for integrated optics, microelectronics and display technology - selected examples
Dreyer, C.; Schneider, J.; Keil, N.; Zawadzki, C.; Yao, H.H.; Schuldt, U.; Schulze, K.; Kahle, O.; Schulz, S.E.; Uhlig, M.; Uhlig, C.; Boeffel, C.; Gessner, T.; Bauer, M.
Conference Paper
2005Mikrofluidische Vorrichtung fuer die optische Analyse
Otto, T.; Nestler, J.; Baum, M.; Gessner, T.
Patent
2005Mikromechanisches gekoppeltes Schwingsystem für frequenzselektive Vibrationsmessungen
Forke, R.; Mehner, J.; Doetzel, W.; Geßner, T.
Conference Paper
2005Model building, control design and practical implementation of a high precision, high dynamical MEMS acceleration sensor
Wolfram, H.; Schmiedel, R.; Hiller, K.; Aurich, T.; Günther, W.; Kurth, S.; Mehner, J.; Dötzel, W.; Gessner, T.
Conference Paper
2005A novel 24-kHz resonant scanner for high-resolution laser display
Kurth, S.; Kaufmann, C.; Hahn, R.; Mehner, J.; Dötzel, W.; Gessner, T.
Conference Paper
2005A novel dual-detector micro spectrometer
Otto, T.; Saupe, R.; Stock, V.; Bruch, R.; Gruska, B.; Gessner, T.
Conference Paper
2005Novel low-k polycyanurates for integrated circuit (IC) metallization
Schulze, K.; Schuldt, U.; Kahle, O.; Schulz, S.E.; Uhlig, M.; Uhlig, C.; Dreyer, C.; Bauer, M.; Gessner, T.
Conference Paper, Journal Article
2005Novel modeling techniques of MEMS sensors and actuators for electronic and system design in automotive applications
Mehner, J.E.; Shaporin, A.; Kolchuzhin, V.; Doetzel, W.; Gessner, T.
Conference Paper, Journal Article
2005Packaging of MEMS structures in SCREAM technology using anodic bonding
Frömel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2005Parametric model extraction for MEMS based on variational finite element techniques
Mehner, J.E.; Schaporin, A.; Kolchuzhin, V.; Doetzel, W.; Gessner, T.
Conference Paper
2005Post-processing gap reduction in a micromachined resonator for vacuum pressure measurement
Billep, D.; Hiller, K.; Frömel, J.; Tenholte, D.; Reuter, D.; Dötzel, W.; Gessner, T.
Conference Paper
2005Ein resonanter 24 kHz Scanner für hoch auflösende Laserdisplays
Kurth, S.; Kaufmann, C.; Hahn, R.; Mehner, J.; Dötzel, W.; Gessner, T.
Conference Paper
2005Room temperature vacuum sealing using surfaced activated bonding with Au thin films
Okada, H.; Itoh, T.; Frömel, J.; Gessner, T.; Suga, T.
Conference Paper
2005Scaling down thickness of ULK materials for 65 nm node and below and its effect on electrical performance
Frühauf, S.; Himcinschi, C.; Rennau, M.; Schulze, K.; Schulz, S.E.; Friedrich, M.; Gessner, T.; Zahn, D.R.T.; Le, Q.T.; Caluwaerts, R.
Conference Paper, Journal Article
2005Selective adhesive bonding with SU-8 for zero-level-packaging
Reuter, D.; Bertz, A.; Schwenzer, G.; Gessner, T.
Conference Paper
2005A spectral vibration detection system based on tunable micromechanical resonators
Scheibner, D.; Mehner, J.; Reuter, D.; Gessner, T.; Dötzel, W.
Conference Paper, Journal Article
2005Validierung der AIM Technologie: Darstellung der Leistungsfähigkeit anhand hergestellter Sensor- und Aktorstrukturen
Lohmann, C.; Bertz, A.; Reuter, D.; Küchler, M.; Geßner, T.
Conference Paper
2005Variational finite element technologies for parametric model
Mehner, J.; Schaporin, A.; Kolchuzhin, V.; Dötzel, W.; Gessner, T.
Conference Paper
2005Verschleißmonitoring bei Hüftgelenkendoprothesen durch integrierte Mikrosensorik
Baum, M.; Hientzsch, M.; Boese-Landgraf, J.; Otto, T.; Gessner, T.
Conference Paper
2004Advanced Technologies for Microsystems Design
Mehner, J.; Dötzel, W.; Geßner, T.
Book Article
2004Application of micromirror arrays for Hadamard transform optics
Hanf, M.; Kurth, S.; Billep, D.; Hahn, R.; Faust, W.; Heinz, S.; Dötzel, W.; Gessner, T.
Conference Paper
2004Application of molecular dynamics to the simulation of IPVD
Belsky, P.; Streiter, R.; Wolf, H.; Gessner, T.
Conference Paper
2004Characterization and self-test of electrostatically tunable resonators for frequency selective vibration measurements
Scheibner, D.; Mehner, J.; Reuter, D.; Kotarsky, U.; Geßner, T.; Dötzel, W.
Conference Paper, Journal Article
2004Contributions to the static dielectric constant of low-k xerogel films derived from ellipsometry and IR spectroscopy
Himcinschi, C.; Friedrich, M.; Frühauf, S.; Schulz, S.E.; Gessner, T.; Zahn, D.R.T.
Conference Paper, Journal Article
2004Electrostatic driven scanning micro mirrors applied in spectral sensing devices
Saupe, R.; Otto, T.; Mehner, J.; Kurth, S.; Kaufmann, C.; Geßner, T.
Journal Article
2004High aspect ratio micromachining using the AIM technology
Lohmann, C.; Reuter, D.; Bertz, A.; Geßner, T.
Book Article
2004Improvement of mechanical integrity of ultra low k dielectric stack and CMP compatibility
Schulze, K.; Schulz, S.E.; Frühauf, S.; Körner, H.; Seidel, U.; Schneider, D.; Gessner, T.
Conference Paper, Journal Article
2004Infrared micro mirror spektrometer for gas analysis
Otto, T.; Saupe, R.; Kaufmann, C.; Geßner, T.
Conference Paper
2004MEMS Metallization
Lohmann, C.; Gottfried, K.; Bertz, A.; Reuter, D.; Hiller, K.; Kuhn, M.; Gessner, T.
Conference Paper
2004A novel microactuator based on the working principle of a step-by-step switchgear
Schröter, B.; Mehner, J.; Hiller, K.; Geßner, T.; Dötzel, W.
Conference Paper
2004Packaging and characterization of micro-opto-electro-mechanical systems
Saupe, R.; Otto, T.; Stock, V.; Fritzsch, U.; Geßner, T.
Conference Paper
2004Packaging and characterization of miniaturized spectral sensing devices
Otto, T.; Saupe, R.; Stock, V.; Fritzsch, U.; Bruch, R.; Gessner, T.
Conference Paper
2004Potentials for Microsystems in Biotechnology and Healthcare
Nestler, J.; Baum, M.; Otto, T.; Geßner, T.
Conference Paper, Journal Article
2004Sensor-actuator-arrays for dynamic atomic force microscopy and their application in temporary MESFET devices
Müller, A.-D.; Müller, F.; Mehner, J.; Geßner, T.; Hietschold, M.
Conference Paper
2004Wafer Bonding in Micro Mechanics and Microelectronics
Wiemer, M.; Froemel, J.; Gessner, T.; Otto, T.
Book Article
2003Advanced silicon micromachining
Geßner, T.; Bertz, A.; Lohmann, C.; Kurth, S.; Hiller, K.
Journal Article
2003Application of low temperature direct bonding in optical devices and integrated systems
Hiller, K.; Kurth, S.; Neumann, N.; Hahn, R.; Kaufmann, C.; Hanf, M.; Heinz, S.; Geßner, T.; Dötzel, W.; Ebest, G.
Conference Paper
2003Bonding and contacting of MEMS-structures on wafer level
Wiemer, M.; Frömel, J.; Jia, C.; Gessner, T.
Conference Paper
2003Closed loop control of a tunable infrared filter
Sternberger, A.; Hiller, K.; Geßner, T.; Dötzel, W.; Kurth, S.; Neumann, N.; Heinze, M.
Conference Paper
2003CVD TiN layers as diffusion barrier films on porous SiO2 aerogel
Bonitz, J.; Schulz, S.E.; Gessner, T.
Conference Paper
2003Deposition and treatment of titanium based barrier layers by MOCVD
Ecke, R.; Schulz, S.E.; Gessner, T.; Riedel, S.; Lipp, E.; Eizenberg, M.
Conference Paper
2003Development and characterization of a high aspect ratio vertical FET sensor for motion detection
Buschnakowski, S.; Bertz, A.; Bräuer, W.; Heinz, S.; Schuberth, R.; Ebest, G.; Gessner, T.
Conference Paper
2003An electrically tunable infrared filter on base of Fabry-Perot interferometer
Kurth, S.; Hiller, K.; Neumann, N.; Heinze, M.; Dötzel, W.; Gessner, T.
Conference Paper
2003Harmonic Analysis of Microbeams with PZT on-Chip Actuating and Sensing
Zhou, J.; Baum, M.; Schmiedel, R.; Huang, Y.; Ruan, G.; Geßner, T.
Conference Paper, Journal Article
2003Hot embossing for MEMS using silicon tools
Küchler, M.; Otto, T.; Gessner, T.; Ebling, F.; Schröder, H.
Journal Article, Conference Paper
2003Influence of SiH4 on the WN4-PECVD process
Ecke, R.; Schulz, S.E.; Hecker, M.; Mattern, N.; Gessner, T.
Conference Paper
2003Interconnect systems in automotive sensors at elevated temperatures
Gottfried, K.; Kaufmann, C.; Gessner, T.
Conference Paper
2003Mechanical reliability of MEMS fabricated by a special technology using standard silicon wafers
Lohmann, C.; Bertz, A.; Küchler, M.; Reuter, D.; Gessner, T.
Conference Paper
2003A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers
Lohmann, C.; Bertz, A.; Küchler, M.; Gessner, T.
Conference Paper
2003Novel possibilities in physical analytics employing miniaturized devices
Otto, T.; Saupe, R.; Geßner, T.
Conference Paper
2003Polymer BioMEMs with integrated optical and fluidic functionality
Windhorn, K.; Meixner, L.; Drost, S.; Schröder, H.; Kilgus, E.; Scheel, W.; Ebling, F.; Otto, T.; Küchler, M.; Nestler, J.; Geßner, T.
Conference Paper
2003Selektives Niedertemperaturbonden mit SU-8 für Wafer-Level-Verkappung von mikromechanischen Strukturen
Reuter, D.; Frömel, J.; Schwenzer, G.; Bertz, A.; Geßner, T.
Conference Paper
2003Thermal conductivity of ultra low-k dielectrics
Delan, A.; Rennau, M.; Schulz, S.E.; Gessner, T.
Conference Paper
2003Trends der Technologieentwicklung im Bereich Waferbonden
Wiemer, M.; Frömel, J.; Geßner, T.
Conference Paper
2003Tunable Fabry-Perot interferometer for 3 - 4.5 mu m wavelength with bulk micromachined reflector carrier
Kurth, S.; Hiller, K.; Neumann, N.; Heinze, M.; Dötzel, W.; Gessner, T.
Conference Paper
2003Tunable infrared filter based on a Fabry-Perot-Interferometer
Kurth, S.,; Hiller, K.; Dötzel, W.; Geßner, T.; Neumann, N.; Heinze, M.
Conference Paper
2002Application of combined thermal and electrical simulation for optimization of deep submicron interconnection systems
Streiter, R.; Wolf, H.; Zhu, Z.; Xiao, X.; Gessner, T.
Journal Article
2002Application of combined thermal and electrical simulation for optimization of deep submicron interconnection systems
Streiter, R.; Wolf, H.; Zhu, Z.; Xiao, X.; Gessner, T.
Conference Paper
2002Copper alloy formation and film properties after annealing of Al/Cu stacks in different ambients
Chen, Z.; Richter, K.; Riedel, S.; Schulz, S.E.; Gessner, T.
Journal Article
2002Development of a microspectrometer for the infrared range
Otto, T.; Saupe, R.; Bruch, R.; Gessner, T.
Conference Paper
2002InterChip via technology by using copper for vertical system integration
Ramm, P.; Bonfert, D.; Ecke, R.; Iberl, F.; Klumpp, A.; Riedel, S.; Schulz, S.E.; Wieland, R.; Zacher, M.; Gessner, T.
Conference Paper
2002Investigation of long throw PVD of titanium films from polycrystalline targets with texture
Wolf, H.; Streiter, R.; Tirschler, W.; Giegengack, H.; Urbansky, N.; Gessner, T.
Journal Article
2002A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers
Bertz, A.; Küchler, M.; Knöfler, R.; Gessner, T.
Journal Article
2002Thermal and electrical simulation of deep submicron interconnection systems
Streiter, R.; Wolf, H.; Zhu, Z.; Xiao, X.; Gessner, T.
Conference Paper
2001Abstimmbare Siliziumsensoren zur Vibrationsanalyse mit elektromagnetischer Selbsttest-Funktionalität
Scheibner, D.; Mehner, J.; Brämer, B.; Gessner, T.; Dötzel, W.
Conference Paper
2001Application of high and low wafer bonding processes for bulk micromachined components
Wiemer, M.; Hiller, K.; Hahn, R.; Kaufmann, C.; Gessner, T.
Conference Paper
2001Bulk micromachined and wafer bonded resonators for vacuum pressure measurement
Hiller, K.; Kurth, S.; Zichner, N.; Gessner, T.; Dötzel, W.; Iwert, T.; Fritsch, H.; Biehl, S.
Conference Paper
2001Charakterisierung von CVD-WNx-Schichten als Barriere gegen Kupferdiffusion
Ecke, R.; Richter, K.; Schulz, S.E.; Gessner, T.
Conference Paper
2001Closed-form formulae for frequency-dependent 3-D interconnect inductance
Zhu, Z.; Xiao, X.; Streiter, R.; Ruan, G.; Otto, T.; Wolf, H.; Gessner, T.
Journal Article
2001Copper metallization scheme for vertical chip integration
Riedel, S.; Ecke, R.; Schulz, S.E.; Gessner, T.; Wieland, R.; Leutenecker, R.; Klumpp, A.; Ramm, P.
Conference Paper
2001Einsatz von Mikrospiegel-Arrays zur Lichtmodulation in einem Hadamard-Transformations-Spektrometer
Hanf, M.; Kurth, S.; Faust, W.; Hahn, R.; Heinz, S.; Dötzel, W.; Gessner, T.
Conference Paper
2001Einsatz von Niedertemperaturbondverfahren für die Fertigung von Sensoren
Wiemer, M; Otto, T.; Gessner, T.; Hiller, K.; Kapser, K.; Seidel, H.; Bagdahn, J.; Petzold, M.
Conference Paper
2001Einsatzerfahrungen mit einer Multiplex-Ätzanlage für tiefes Siliziumätzen
Küchler, M.; Hiller, K.; Hahn, R.; Bertz, A.; Gessner, T.
Conference Paper
2001Implementation of a low temperature wafer bonding process for acceleration sensors
Wiemer, M.; Otto, T.; Gessner, T.; Hiller, K.; Kapser, K.; Seidel, H.; Bagdahn, J.; Petzold, M.
Conference Paper
2001Influence of barrier and cap layer deposition on the properties of capped and non-capped porous silicon oxide
Schulz, S.E.; Koerner, H.; Murray, C.; Streiter, I.; Gessner, T.
Journal Article
2001Influence of different treatment techniques on the barrier properties of MOCVD TiN against copper diffusion
Riedel, S.; Schulz, S.E.; Baumann, J.; Rennau, M.; Gessner, T.
Conference Paper, Journal Article
2001Micromachined pressure gauge for the vacuum range based on damping of a resonator
Kurth, S.; Hiller, K.; Zichner, N.; Mehner, J.; Iwert, T.; Biehl, S.; Dötzel, W.; Gessner, T.
Conference Paper
2001Ein mikromechanischer Vakuumsensor nach dem Reibungsprinzip
Hiller, K.; Kurth, S.; Zichner, N.; Gessner, T.; Dötzel, W.; Iwert, T.; Fritsch, H.; Biehl, S.
Conference Paper
2001Monolithic integration of vibration sensors in near surface bulk silicon micromachining with microelectronics
Steiniger, D.; Bertz, A.; Gessner, T.
Conference Paper
2001Nanoporous dielectric materials for advanced CMOS
Gessner, T.; Bohuslavova, A.; Schulz, S.E.
Conference Paper
2001Neue Dünnschichtmaterialien für die fortgeschrittene Mikroelektronik
Gessner, T.; Schulz, S.E.
Abstract
2001Plasma deposited CF polymer films as ultra low k intermetal dielectric, film properties and application
Uhlig, M.; Bertz, A.; Werner, T.; Gessner, T.
Conference Paper
2001Silicon oxide in Si-Si bonded wafers
Himcinschi, C.; Milekhin, A.; Friedrich, M.; Hiller, K.; Wiemer, M; Gessner, T.; Schule, S.; Zahn, D.R.T.
Journal Article
2001Simulation of the dielectric constant of aerogels and estimation of their water content
Xiao, X.; Streiter, R.; Wolf, H.; Ruan, G.; Murray, C.; Gessner, T.
Journal Article
2001A single-crystal Si-resonator with on-chip readout amplifier in standard CMOS
Bertz, A.; Symanzik, H.; Steiniger, C.; Höffer, A.; Griesbach, K.; Stegemann, K.; Ebest, G.; Gessner, T.
Journal Article
2001Übersicht zur Mikrosystemtechnik: Definition, Technologien, Markt und Probleme in 2001
Wiemer, M.; Otto, T.; Gessner, T.
Journal Article
2001Vertikal-Transistor mit beweglichen Gate und Verfahren zu dessen Herstelllung
Gessner, T.; Heinz, S.; Bertz, A.
Patent
2000Fabrication of micro-optical components by high-precision embossing
Otto, T.; Schubert, A.; Böhm, J.; Gessner, T.
Conference Paper
2000High throughput, high quality dry etching of copper/barrier film stacks
Markert, M.; Bertz, A.; Gessner, T.; Ye, Y.; Zhao, A.; Ma, D.
Journal Article
2000Investigation of bonding behaviour of different borosilicate glasses
Wiemer, M; Hiller, K.; Gessner, T.; Kloss, T.; Schneider, K.; Leipold-Haas, U.; Bagdahn, J.; Petzold, M.
Conference Paper
2000Investigation of the plasma treatment in a multistep TiN MOCVD process
Riedel, S.; Schulz, S.E.; Gessner, T.
Journal Article
2000Micromirrors and micromirror arrays for scanning applications
Gessner, T.; Kurth, S.; Kaufmann, C.; Markert, J.; Dötzel, W.
Conference Paper
2000Modelling and simulation for dielectric constant of aerogel
Xiao, X.; Streiter, R.; Ruan, G.; Song, R.R.; Otto, T.; Gessner, T.
Journal Article
2000Numerical simulation of time delay and cross-talk noise for the interconnect in VLSI circuits
Ruan, G.; Xiao, X.; Song, R.R.; Streiter, R.; Otto, T.; Gessner, T.
Journal Article
2000Patterning of SOI-materials for fabrication of resonator systems using waferbonding approaches
Wiemer, M.; Hiller, K.; Gessner, T.
Conference Paper
2000A resonance method for the determination of Young's modulus and residual stress of thin microstructures
Mehner, J.; Kehr, K.; Schröter, B.; Kaufmann, C.; Dötzel, W.; Gessner, T.
Conference Paper
2000Stress-induced laterial deflections of microstructures
Küchler, M.; Knöfler, R.; Steiniger, c.; Raschke, T.; Gessner, T.; Dudek, R.; Döring, R.
Conference Paper
1999Advanced silicon bulk micromachining for angular rate sensor
Wiemer, M.; Hiller, K.; Gessner, T.; Billep, D.; Ryrko, B.; Breng, U.; Zimmermann, S.; Gutmann, W.
Conference Paper
1999Analogously working micromirror arrays
Kehr, K.; Kurth, S.; Mehner, J.; Kaufmann, C.; Hahn, R.; Dötzel, W.; Gessner, T.
Conference Paper
1999Anwendung von Niedertemperatur-Bondverfahren für die Herstellung von Microscanner-Arrays hoher Frequenz
Wiemer, M.; Hiller, K.; Hahn, R.; Kaufmann, C.; Kurth, S.; Kehr, K.; Gessner, T.; Dötzel, W.
Conference Paper
1999µCORS - a bulk micromachined gyroscope based on coupled resonators
Breng, U.; Gutmann, W.; Leinfelder, P.; Ryrko, B.; Zimmermann, S.; Billep, D.; Gessner, T.; Hiller, K.; Wiemer, M.
Conference Paper
1999Fabrication of high frequency microscanners by using low temperature silicon wafer bonding
Hiller, K.; Wiemer, M.; Hahn, R.; Kaufmann, C.; Kurth, S.; Kehr, K.; Gessner, T.; Dötzel, W.; Milekhin, A.; Friedrich, M.; Zahn, D.
Conference Paper
1999Infrared study of the Si surfaces and bonded Si wafers
Milekhin, A.; Friedrich, M.; Wiemer, M; Hiller, K.; Gessner, T.; Zahn, D.R.T.
Journal Article
1999Infrared study of the Si surfaces and buried interfaces
Milekhin, A.; Friedrich, M.; Wiemer, M; Hiller, K.; Gessner, T.; Zahn, D.R.T.
Conference Paper
1999Investigation of heat transfer in micromirrors
Kehr, K.; Kurth, S.; Mehner, J.; Dötzel, W.; Gessner, T.
Conference Paper
1999Kapazitiver Drehratensensor auf der Basis einer Stimmgabel mit gekoppeltem Resonator
Wiemer, M; Hiller, K.; Gessner, T.; Billep, D.; Ryrko, B.; Breng, U.; Zimmermann, S.; Gutmann, W.
Conference Paper
1999Low-temperature approaches for fabrication of high-frequency microscanners
Hiller, K.; Hahn, R.; Kaufmann, C.; Kurth, S.; Kehr, K.; Gessner, T.; Dötzel, W.; Wiemer, M; Schubert, I.
Conference Paper
1999Process and equipment simulation of copper CVD using Cu(hfac)vtms
Wolf, H.; Gieser, H.; Riedel, S.; Streiter, R.; Gessner, T.
Journal Article
1999Process and equipment simulation of dry silicon etching in the absence of ion bombardment
Otto, T.; Wolf, H.; Streiter, R.; Dehoff, A.; Wandel, K.; Gessner, T.
Journal Article
1999Resonante Siliziumsensoren mit elektrostatischer Abstimmung für die Vibrationsanalyse
Wibbeler, J.; Küchler, M.; Steiniger, C.; Bertz, A.; Wolf, K.; Mehner, J.; Gessner, T.
Conference Paper
1999Simulation of dry silicon etching in the absence of ion bombardment
Otto, T.; Hofmann, M.; Wolf, H.; Streiter, R.; Schubert, A.; Gessner, T.
Conference Paper
1999A study of the interface states in MIS-structures with thin SiO2 and SiOxNy layers using deep level transient spectroscopy
Beyer, R.; Burghardt, H.; Thomas, E.; Reich, R.; Zahn, D.R.T.; Gessner, T.
Journal Article
1999Synchronously working micromirrors for beam steering
Kurth, S.; Kehr, K.; Mehner, J.; Kaufmann, C.; Hahn, R.; Seidel, R.; Dötzel, W.; Gessner, T.
Conference Paper
1999Untersuchungen zur Herstellung von lateralen Tastnadeln für die Rasterkraftmikroskopie
Knöfler, R.; Bertz, A.; Wolf, K.; Küchler, M.; Gessner, T.
Conference Paper
1998Morphology and electromigration lifetime of copper lines with different barriers
Schulz, S.E.; Baumann, J.; Weidner, J.-O.; Hasse, W.; Koerner, H.; Gessner, T.
Conference Paper
1995Charakterisierung mehrfach gebondeter Wafer für die Sensorik
Wiemer, M.; Hiller, K.; Hopfe, S.; Petzold, M.; Reiche, M.; Geßner, T.; Gösele, U.
Conference Paper