Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Handbook of 3D Integration. Design, Test, and Themal Management. Vol.4: Design, Test and Thermal Management of 3D Integrated Circuits
Franzon, Paul D.; Marinissen, Erik Jan; Bakir, Muhannad S.; Garrou, Philip; Koyanagi, Mitsumasa; Ramm, Peter
Book
2019Introduction to Design, Test and Thermal Management of 3D Integrated Circuits
Garrou, Philip; Koyanagi, Mitsumasa; Ramm, Peter
Book Article
20143D IC Integration Since 2008
Garrou, P.; Ramm, P.; Koyanagi, M.
Book Article
2014Handbook of 3D integration. Vol.3
: Garrou, P.; Koyanagi, M.; Ramm, P.
Book
2012Three-Dimensional Integration
Garrou, P.; Lu, J.J.-Q.; Ramm, P.
Book Article
2004The wafer-level packaging evolution
Töpper, M.; Garrou, P.
Journal Article