Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Analysis of 28 nm SRAM cell stability under mechanical load applied by nanoindentation
Clausner, André; Schlipf, Simon; Kurz, G.; Otto, M.; Paul, J.; Giering, Kay-Uwe; Warmuth, Jens; Lange, André; Jancke, Roland; Aal, A.; Rosenkranz, Rüdiger; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling
Kraatz, Matthias; Sander, Christoph; Clausner, André; Hauschildt, M.; Standke, Yvonne; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018FO-WLP multi-DOF inertial sensor for automotive applications
Kuisma, Heikki; Cardoso, Andre; Mäntyoja, Nikolai; Rosenkrantz, Rüdiger; Nurmi, Sami; Gall, Martin
Conference Paper
2018A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits
Kutukova, Kristina; Niese, Sven; Sander, Christoph; Standke, Yvonne; Gluch, Jürgen; Gall, Martin; Zschech, Ehrenfried
Journal Article
2018Prediction of SRAM reliability under mechanical stress induced by harsh environments
Warmuth, Jens; Giering, Kay-Uwe; Lange, André; Clausner, André; Schlipf, Simon; Kurz, Gottfried; Otto, Michael; Paul, Jens; Jancke, Roland; Aal, Andreas; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018Vorrichtung zur Durchführung von Biegeversuchen an plattenförmigen Proben
Clausner, André; Gall, Martin; Macher, Frank; Sander, Christoph; Zschech, Ehrenfried
Patent
2017Analysis of the effect of TSV-induced stress on devices performance by direct strain and electrical measurements and FEA simulations
Kteyan, Armen; Mühle, Uwe; Gall, Martin; Sukharev, Valeriy; Radojcic, Riko; Zschech, Ehrenfried
Journal Article
2017Doping of graphene induced by boron/silicon substrate
Dianat, Arezoo; Liao, Zhongquan; Gall, Martin; Zhang, Tao; Gutierrez, Rafael; Zschech, Ehrenfried; Cuniberti, Gianaurelio
Journal Article
2017In-Situ Stretching Patterned Graphene Nanoribbons in the Transmission Electron Microscope
Liao, Zhongquan; Sandonas, Leonardo Medrano; Zhang, Tao; Gall, Martin; Dianat, Arezoo; Gutierrez, Rafael; Mühle, Uwe; Gluch, Jürgen; Jordan, Rainer; Cuniberti, Gianaurelio; Zschech, Ehrenfried
Journal Article
2017Low ppm failure analysis for advanced Cu and Cu alloy on-chip wiring
Kraatz, Matthias; Hauschildt, Meike; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2016A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions
Kraatz, Matthias; Gall, Martin; Zschech, Ehrenfried; Schmeißer, Dieter; Ho, Paul S.
Journal Article
2016Novel approaches to determine thermomechanical materials data in advanced interconnect stacks
Zschech, Ehrenfried; Gall, Martin; Clausner, André; Sander, Christoph; Sukharev, Valeriy
Conference Paper
2016Pollen structure visualization using high-resolution laboratory-based hard X-ray tomography
Li, Qiong; Gluch, Jürgen; Krüger, Peter; Gall, Martin; Neinhuis, Christoph; Zschech, Ehrenfried
Journal Article
2016TEM investigation of time-dependent dielectric breakdown mechanisms in Cu/Low-k interconnects
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Rosenkranz, Rüdiger; Aubel, Oliver; Hauschildt, Meike; Zschech, Ehrenfried
Journal Article
2015In situ time-dependent dielectric breakdown in the transmission electron microscope: A possibility to understand the failure mechanism in microelectronic devices
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Gisela; Aubel, Oliver; Beyer, Armand; Hauschildt, Meike; Zschech, Ehrenfried
Journal Article
2015In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Aubel, Oliver; Vogel, Norman; Hauschildt, Meike; Beyer, Armand; Engelmann, Hans Jürgen; Zschech, Ehrenfried
Journal Article, Conference Paper
2015Lateral damage in graphene carved by high energy focused gallium ion beams
Liao, Zhongquan; Zhang, Tao; Gall, Martin; Dianat, Arezoo; Rosenkranz, Rüdiger; Jordan, Rainer; Cuniberti, Gianaurelio; Zschech, Ehrenfried
Journal Article
2014Advanced 3D packaging of chips and materials integrity: Stress-induced effects and mechanical properties of new ultra low-k dielectrics for on-chip interconnect stacks
Sander, Christoph; Gall, Martin; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014Advanced concepts for TDDB reliability in conjunction with 3D stress
Gall, Martin; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014Advanced metallization concepts and impact on reliability
Hauschildt, Meike; Hintze, Bernd; Gall, Martin; Koschinsky, Frank; Preuße, Axel; Bolom, Tibor; Nopper, Markus; Beyer, Armand; Aubel, Oliver; Talut, Georg; Zschech, Ehrenfried
Journal Article
2014Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration
Sander, Christoph; Standke, Yvonne; Niese, Sven; Rosenkranz, Rüdiger; Clausner, André; Gall, Martin; Zschech, Ehrenfried
Journal Article, Conference Paper
2014Electromigration void nucleation and growth analysis using large-scale early failure statistics
Hauschildt, Meike; Gall, Martin; Hennesthal, Christian; Talut, Georg; Aubel, Oliver; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014Empirical BEOL-TDDB evaluation based on I(t)-trace analysis
Aubel, Oliver; Beyer, Armand; Talut, Georg; Gall, Martin
Journal Article, Conference Paper
2014In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms
Yeap, Kong Boon; Gall, Martin; Liao, Zhongquan; Sander, Christoph; Mühle, Uwe; Justison, Patrick; Aubel, Oliver; Hauschildt, Meike; Beyer, Armand; Vogel, Norman; Zschech, Ehrenfried
Journal Article
2014A new in situ microscopy approach to study the degradation and failure mechanisms of time-dependent dielectric breakdown: Set-up and opportunities
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Aubel, Oliver; Mühle, Uwe; Gluch, Jürgen; Niese, Sven; Standke, Yvonne; Rosenkranz, Rüdiger; Löffler, Markus; Vogel, Norman; Beyer, Armand; Engelmann, Hans Jürgen; Guttmann, Peter; Schneider, Gerhard; Zschech, Ehrenfried
Journal Article