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| 2020 | Frugal innovation in, by and for Europe
Kroll, Henning; Gabriel, Madeleine | Journal Article |
| 2017 | Study on frugal innovation and reengineering of traditional techniques
Kroll, Henning; Gabriel, Madeleine; Braun, Annette; Engasser, Florence; Meister, Michael; Muller, Emmanuel; Nowlan, Oscar; Neuhäusler, Peter; Saunders, Tom; Schnabl, Esther; Zenker, Andrea | Study |
| 2012 | Plasma activation as a pretreatment tool for low-temperature direct wafer bonding in microsystems technology
Eichler, M.; Hennecke, P.; Nagel, K.; Gabriel, M.; Klages, C.-P. | Journal Article, Conference Paper |
| 2010 | Local plasma treatment in a mask aligner for selective wafer surface modification
Eichler, M.; Gabriel, M. | Journal Article |
| 2010 | Low temperature wafer bonding for microsystems using dielectric barrier discharge
Wünsch, D.; Wiemer, M.; Gabriel, M.; Gessner, T. | Journal Article |
| 2010 | Low-temperature direct bonding of borosilicate, fused silica, and functional coatings
Eichler, M.; Michel, B.; Hennecke, P.; Gabriel, M.; Klages, C.-P. | Conference Paper |
| 2009 | Einsatz von Mikroplasmen für die Herstellung von Silizium-Mehrlagenaufbauten
Eichler, M.; Michel, B.; Gabriel, M.; Klages, C.-P. | Journal Article |
| 2009 | Lokale Plasma-Behandlung in einem Mask Aligner zur selektiven Veränderung der Oberfläche von Wafern
Gabriel, M.; Milde, S.; Eichler, M.; Klages, C.-P. | Conference Paper |
| 2008 | Atmospheric-pressure plasma pretreatment for direct bonding of silicon wafers at low temperatures
Eichler, M.; Michel, B.; Thomas, M.; Gabriel, M.; Klages, C.-P. | Journal Article, Conference Paper |
| 2008 | Technology trends of microlens imprint lithography and wafer level cameras (WLC)
Völkel, R.; Duparré, J.; Wippermann, F.; Dannberg, P.; Bräuer, A.; Zoberbier, R.; Gabriel, M.; Hornung, M.; Hansen, S.; Süss, R. | Conference Paper |
| 2006 | Ambient pressure plasma activation for low temperature bonding
Eichler, M.; Michel, B.; Thomas, M.; Klages, C.-P.; Ruddy, C.; Reinecke, H.; Reiche, M.; Radu, I.; Gabriel, M. | Conference Paper |
| 2006 | Anodic and direct bonding of Si and glass - Similarities and distinctions in applications
Gabriel, M.; Cetin, V.; Ludewig, T.; Eichler, M. | Conference Paper |
| 2006 | Patterned DBD pretreatment at ambient pressure for low temperature wafer bonding
Eichler, M.; Michel, B.; Thomas, M.; Ruddy, C.; Reinecke, H.; Reiche, M.; Gabriel, M.; Klages, C.-P. | Conference Paper |
| 2006 | Patterned surface modification using ambient pressure plasma processes for enhanced wafer packaging by low temperature bonding
Eichler, M.; Mewes, H.; Thomas, M.; Klages, C.-P.; Ruddy, C.; Reinecke, H.; Reiche, M.; Gabriel, M. | Conference Paper |
| 2006 | Wafer direct bonding with ambient pressure plasma activation
Gabriel, M.; Johnson, B.; Suss, R.; Reiche, M.; Eichler, M. | Journal Article |
| 2005 | Capabilities of an ambient pressure plasma for activation in LT wafer bonding processes
Gabriel, M.; Cetin, V.; Hansen, S.; Reiche, M.; Radu, I.; Eichler, M. | Conference Paper |
| 2005 | Mechanisms of low-temperature wafer bonding
Reiche, M.; Radu, I.; Gabriel, M.; Zoberbier, M.; Hansen, S.; Eichler, M. | Conference Paper |