Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2010Cellular interactions of biodegradable nanorod arrays prepared by nondestructive extraction from nanoporous alumina
Grimm, S.; Martin, J.; Rodriguez, G.; Fernandez-Gutierrez, M.; Mathwig, K.; Wehrspohn, R.B.; Gösele, U.; San Roman, J.; Mijangos, C.; Steinhart, M.
Journal Article
2009The complex evolution of strain during nanoscale patterning of 60 nm thick strained silicon layer directly on insulator
Moutanabbir, O.; Reiche, M.; Erfurth, W.; Naumann, F.; Petzold, M.; Gösele, U.
Journal Article
2009Greatly increased toughness of infiltrated spider silk
Lee, S.-M.; Pippel, E.; Gösele, U.; Dresbach, C.; Qin, Y.; Chandran, C.V.; Bräuniger, T.; Hause, G.; Knez, M.
Journal Article
2009Low-temperature ZnO atomic layer deposition on biotemplates
Lee, S.-M.; Grass, G.; Kim, G.-M.; Dresbach, C.; Zhang, L.; Gösele, U.; Knez, M.
Journal Article
2009Probing the strain states in nanopatterned strained SOI
Moutanabbir, O.; Reiche, M.; Hähnel, A.; Erfurth, W.; Naumann, F.; Petzold, M.; Gösele, U.
Conference Paper
2008III-V and III-Nitride engineered heterostructures: Wafer bonding, ion slicing and more
Moutanabbir, O.; Christiansen, S.; Senz, S.; Scholz, R.; Petzold, M.; Gösele, U.
Conference Paper
2008Strained silicon on wafer level by waferbonding: Materials processing, strain measurements and strain relaxation
Reiche, M.; Moutanabbir, O.; Himcinschi, C.; Christiansen, S.; Erfurth, W.; Gösele, U.; Mantl, S.; Buca, D.; Zhao, Q.; Loo, R.; Nguyen, D.; Muster, F.; Petzold, M.
Conference Paper
2007Enhanced magneto-optics and size effects in ferromagnetic nanowire arrays
Gonzalez-Diaz, J.B.; Garcia-Martin, A.; Armelles, G.; Navas, D.; Vázquez, M.; Nielsch, K.; Wehrspohn, R.B.; Gösele, U.
Journal Article
2007Nondestructive mechanical release of ordered polymer microfiber arrays from porous templates
Grimm, S.; Schwirn, K.; Göring, P.; Knoll, H.; Miclea, P.T.; Greiner, A.; Wendorff, J.H.; Wehrspohn, R.B.; Gösele, U.; Steinhart, M.
Journal Article
2007Strain relaxation in nanopatterned strained silicon round pillars
Himcinschi, C.; Singh, R.; Radu, I.; Milenin, A.P.; Erfurth, W.; Reiche, M.; Gösele, U.; Christiansen, S.H.; Muster, F.; Petzold, M.
Journal Article
2007Uniaxially strained silicon by wafer bonding and layer transfer
Himcinschi, C.; Radu, I.; Muster, F.; Singh, R.; Reiche, M.; Petzold, M.; Gösele, U.; Christiansen, S.H.
Conference Paper, Journal Article
2001A new approach for handling and transferring of thin semiconductor materials
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.; Alexe, M.; Dragoi, V.; Gösele, U.
Conference Paper
2001Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.; Alexe, M.; Dragoi, V.; Gösele, U.
Conference Paper
1998The interface of silicon samples joined at room temperature by wafer direct bonding in ultrahigh vacuum
Plößel, A.; Scholz, R.; Bagdahn, J.; Stenzel, H.; Tu, K.N.; Gösele, U.
Conference Paper
1995Charakterisierung mehrfach gebondeter Wafer für die Sensorik
Wiemer, M.; Hiller, K.; Hopfe, S.; Petzold, M.; Reiche, M.; Geßner, T.; Gösele, U.
Conference Paper
1978Verbesserung der Schalldämmung von Isolierglasscheiben durch Gasfüllungen
Gösele, K.; Gösele, U.; Lakatos, B.
Journal Article