Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Micromachined phase-shifted array-type Mirau interferometer for swept-source OCT imaging
Gorecki, C.; Lullin, J.; Perrin, S.; Bargiel, S.; Albero, J.; Gaiffe, O.; Rutkovvski, J.; Cote, J.M.; Krauter, J.; Osten, W.; Wang, W.-S.; Weimer, M.; Froemel, J.
Journal Article
2016Electroplating of neodymium iron alloys
Kurth, F.; Froemel, J.; Tanaka, S.; Esashi, M.; Gessner, T.
Conference Paper
2016Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies
Schroeder, T.; Froemel, J.; Tanaka, S.; Gessner, T.
Conference Paper
2016Investigation of surface pre-treatment methods for wafer-level Cu-Cu thermo-compression bonding
Tanaka, K.; Wang, W.-S.; Baum, M.; Froemel, J.; Hirano, H.; Tanaka, S.; Wiemer, M.; Otto, T.
Journal Article
2016Structure and thermoelectric properties of PbTe films deposited by thermal evaporation method
Nguyen, M.P.; Froemel, J.; Hatayama, S.; Sutou, Y.; Koike, J.; Tanaka, S.; Esashi, M.; Gessner, T.
Conference Paper
2016Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding
Wang, W.-S.; Wiemer, M.; Froemel, J.; Enderlein, T.; Gessner, T.; Lullin, J.; Bargiel, S.; Passilly, N.; Albero, J.; Gorecki, C.
Conference Paper
2015Low-temperature wafer bonding using solid-liquid inter-diffusion mechanism
Froemel, J.; Baum, M.; Wiemer, M.; Gessner, T.
Journal Article
2015Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems
Baranski, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Jia, C.P.; Frömel, J.; Wiemer, M.
Journal Article
2015Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer
Wang, W.S.; Lullin, J.; Froemel, J.; Wiemer, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Gessner, T.
Conference Paper
2015Technological platform for vertical multi-wafer integration of miniature imaging instruments
Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.; Wiemer, M.; Frömel, J.; Wünsch, D.; Wang, W.S.
Conference Paper
2014Ceramic wafer bonding for vertically integrated MEMS
Wuensch, D.; Froemel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2014Mechanical characterization of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T.
Conference Paper
2014Multi-wafer bonding, stacking and interconnecting of integrated 3-D MEMS micro scanners
Wiemer, M.; Wuensch, D.; Frömel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.
Journal Article
2014Solid Liquid Inter-Diffusion Bonding at Low Temperature
Frömel, J.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2014Thermocompression bonding of semiconductor wafers
Frömel, J.; Baum, M.; Wiemer, M.
Book Article
2014Wafer-level fabrication of microcube-typed beam-splitters by saw-dicing of glass substrate
Baranski, M.; Bargiel, S.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M.
Journal Article
20133D micro-optical lens scanner made by multi-wafer bonding technology
Bargiel, S.; Gorecki, C.; Baranski, M.; Passilly, N.; Wiemer, M.; Jia, C.; Frömel, J.
Conference Paper
2013Highly Reliable and Low Voltage Actuated Ohmic RF MEMS Switch with Wafer Level Packaging
Kurth, S.; Nowack, M.; Voigt, S.; Bertz, A.; Froemel, J.; Kaufmann, C.; Gessner, T.; Akiba, A.; Ikeda, K.
Book Article
2013Multi-wafer Bonding, Stacking and Interconnecting of Integrated 3-D MEMS Micro Scanners
Wiemer, M.; Wuensch, D.; Froemel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passily, N.; Gorecki, C.
Conference Paper
2013Solid Liquid Interdiffusion Bonding for Micro Devices near Room Temperature
Froemel, J.; Wiemer, M.; Tanaka, S.; Esashi, M.; Gessner, T.
Conference Paper
2013Wafer-level fabricated micro beam splitter based on 45-degree saw dicing of glass substrate
Bargiel, S.; Baranski, M.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M.
Conference Paper
2012A hierarchic bonding procedure for the assembly of micro confocal microscope
Jia, C.; Frömel, J.; Wiemer, M.; Gessner, T.; Bargiel, S.; Passilly, N.; Baraski, M.; Gorecki, C.
Conference Paper
2012Influence of test speed on the bonding strength of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T.
Abstract
2012Low temperature metal interdiffusion bonding for micro devices
Frömel, J.; Lin, Y.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2012A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface
Haubold, M.; Lin, Y.; Frömel, J.; Wiemer, M.; Esashi, M.; Geßner, T.
Journal Article
2012Vertical integration technologies for optical transmissive 3-D microscanner based on glass microlenses
Bargiel, S.; Jia, C.; Baranski, M.; Frömel, J.; Passilly, N.; Gorecki, C.; Wiemer, M.
Journal Article, Conference Paper
2011HF-MEMS Schalter mit ohmschen Kontakt und lateraler Bewegungsrichtung
Leidich, S.; Kurth, S.; Nowack, M.; Bertz, A.; Froemel, J.; Kaufmann, C.; Gessner, T.
Conference Paper
2011Investigations of thermocompression bonding with thin metal layers
Froemel, J.; Baum, M.; Wiemer, M.; Roscher, F.; Haubold, M.; Jia, C.; Gessner, T.
Conference Paper
2011Metal thermo compression bonding at wafer level and its capabilities for 3D integration
Baum, M.; Roscher, F.; Froemel, J.; Jia, C.; Rank, H.; Hausner, R.; Reichenbach, R.; Wiemer, M.; Gessner, T.
Conference Paper
2011Reliability enhancement of Ohmic RF MEMS switches
Kurth, S.; Leidich, S.; Bertz, A.; Nowack, M.; Frömel, J.; Kaufmann, C.; Faust, W.; Gessner, T.; Akiba, A.; Ikeda, K.
Conference Paper
2011ZR-based metallic glass as a novel MEMS bonding material
Lin, Y.-C.; Froemel, J.; Sharma, P.; Inoue, A.; Esashi, M.; Gessner, T.
Conference Paper
2010A fast and low actuation voltage MEMS switch for mm-wave and its integration
Akiba, A.; Mitarai, S.; Morita, S.; Ikeda, I.; Kurth, S.; Leidich, S.; Bertz, A.; Nowack, M.; Froemel, J.; Gessner, T.
Conference Paper
2010Nanofabrication of reactive structure for low temperature bonding
Lin, Y.; Bräuer, J.; Hofmann, L.; Baum, M.; Frömel, J.; Wiemer, M.; Esashi, M.; Gessner, T.
Conference Paper
2010NEMS/MEMS and passive components integration by using novel LTCC substrate
Frömel, J.; Lin, Y.; Mori, M.; Tanaka, S.; Gessner, T.; Esashi, M.
Conference Paper
2009Characterization of eutectic wafer bonding using gold and silicon
Lin, Y.; Baum, M.; Haubold, M.; Frömel, J.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2009Development and evaluation of AuSi eutectic wafer bonding
Lin, Y.; Baum, M.; Haubold, M.; Frömel, J.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2009Mikrostruktur, Verfahren zu deren Herstellung, Vorrichtung zum Bonden einer Mikrostruktur und Mikrosystem
Baum, M.; Bräuer, J.; Gessner, T.; Hofmann, L.; Froemel, J.; Letsch, H.; Wiemer, M.
Patent
2009New bonding technologies for MEMS
Wiemer, M.; Frömel, J.; Jia, C.; Gessner, T.
Book Article
2009Process development for smart systems integration in MEMS
Ecke, R.; Frömel, J.; Schulz, S.E.; Wiemer, M.; Gessner, T.
Journal Article
2009Thermo compression bonding with gold interfaces
Frömel, J.; Haubold, M.; Wiemer, M.; Gessner, T.
Conference Paper
2008Developments trends in the field of wafer bonding technologies
Wiemer, M.; Haubold, M.; Jia, C.; Wünsch, D.; Frömel, J.; Gessner, T.
Conference Paper
2008Herstellung von Nanostrukturen und ihre Anwendung für Fügeverbindungen
Jia, C.; Frömel, J.; Wiemer, M
Journal Article
2008Reproducible reliable ausi eutectic wafer bond process with high yield
Schwerdtner, R.; Froemel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2008Waferbond technologies and quality assesment
Wiemer, M.; Frömel, J.; Chenping J.; Haubold, M.; Gessner, T.
Conference Paper
2007AVT als Basis erfolgreicher MEMS-Kommerzialisierung
Frömel, J.; Wiemer, M.; Gessner, T.
Journal Article
2007Bulksiliziummikromechanik, Entwicklungstendenzen und Beispiele
Wiemer, M; Frömel, J.; Hiller, K.; Reuter, D.; Jia, C.
Conference Paper
2007Development of wafer level packaging for MEMS micro mirrors
Froemel, J.; Sato, Y.; Ohtaka, K.; Gessner, T.
Conference Paper
2007Improvement of solid Au-Si eutectic bond process
Schwerdtner, R.; Froemel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2007Mikromechanische Schaltervorrichtung mit mechanischer Kraftverstärkung
Frömel, J.; Voigt, S.; Kurth, S.; Leidich, S.; Bertz, A.; Kaufmann, C.; Gessner, T.
Patent
2007Verfahren und Vorrichtung zum Abformen von Strukturen
Otto, T.; Froemel, J.; Nestler, J.; Gessner, T.
Patent
2007Waferbond technologies and quality assesment
Wiemer, M.; Froemel, J.; Bagdahn, J.; Knechtel, R.
Conference Paper
2006Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems
Frömel, J.; Billep, D.; Gessner, T.; Wiemer, M.
Conference Paper, Journal Article
2006Schalteranordnung zur Ansteuerung einer Antennenanordnung mit einzelnen Antennenelementen mit einer Mehrzahl von matrixförmig angeordneten Schaltern und Verfahren zum Schalten von matrixförmig angeordneten Schaltern
Kurth, S.; Frömel, J.; Voigt, S.; Leidich, S.; Nestler, J.; Shaporin, A.; Dötzel, W.; Gessner, T.
Patent
2006Wafer level encapsulation of microsystems using glass frit bonding
Knechtel, R.; Wiemer, M.; Frömel, J.
Conference Paper, Journal Article
2005Packaging of MEMS structures in SCREAM technology using anodic bonding
Frömel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2005Post-processing gap reduction in a micromachined resonator for vacuum pressure measurement
Billep, D.; Hiller, K.; Frömel, J.; Tenholte, D.; Reuter, D.; Dötzel, W.; Gessner, T.
Conference Paper
2005Room temperature vacuum sealing using surfaced activated bonding with Au thin films
Okada, H.; Itoh, T.; Frömel, J.; Gessner, T.; Suga, T.
Conference Paper
2004Wafer Bonding in Micro Mechanics and Microelectronics
Wiemer, M.; Froemel, J.; Gessner, T.; Otto, T.
Book Article
2003Bonding and contacting of MEMS-structures on wafer level
Wiemer, M.; Frömel, J.; Jia, C.; Gessner, T.
Conference Paper
2003Selektives Niedertemperaturbonden mit SU-8 für Wafer-Level-Verkappung von mikromechanischen Strukturen
Reuter, D.; Frömel, J.; Schwenzer, G.; Bertz, A.; Geßner, T.
Conference Paper
2003Silicon wafer bonding for encapsulating surface-micromechanical-systems using intermediate glass layers
Knechtel, R.; Heller, J.; Wiemer, M.; Frömel, J.
Conference Paper
2003Trends der Technologieentwicklung im Bereich Waferbonden
Wiemer, M.; Frömel, J.; Geßner, T.
Conference Paper