Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2007Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites
Oechsner, R.; Pfeffer, M.; Frickinger, J.; Schellenberger, M.; Roeder, G.; Pfitzner, L.; Ryssel, H.; Fritzsche, M.; Kaushik, V.; Renaud, D.; Danel, A.; Claeys, C.; Bearda, T.; Lering, M.; Graef, M.; Murphy, B.; Walther, H.; Hury, S.
Journal Article
2006Approach for a standardized methodology for mulit-site processing of 300 mm wafers at R&D-sites
Öchsner, R.; Frickinger, J.; Pfeffer, M.; Schellenberger, M.; Roeder, G.; Pfitzner, L.; Ryssel, H.; Fritzsche, M.; Kaushik, V.; Renaud, D.; Danel, A.; Claeys, C.; Bearda, T.; Lering, M.; Graef, M.; Murphy, B.; Walther, H.; Hury, S.
Conference Paper
2006Flying Wafer - A standardised methodology for multi-site processing of 300 mm wafers at R&D-sites
Frickinger, J.; Oechsner, R.; Schellenberger, M.; Pfeffer, M.; Pfitzner, L.; Ryssel, H.; Claeys, C.; Claes, M.; Bearda, T.; Renaud, D.; Danel, A.; Lering, M.; Graef, M.; Kaushik, V.; Murphy, B.; Fritzsche, M.; Walther, H.; Hury, S.
Conference Paper
2006Flying wafer - A standardised methodology for multi-site processing Of 300 Mm wafers at research and development-sites
Frickinger, J.; Öchsner, R.; Schellenberger, M.; Pfeffer, M.; Pfitzner, L.; Ryssel, H.; Claes, M.; Bearda, T.; Renaud, D.; Danel, A.; Lering, M.; Graef, M.; Kaushik, V.; Murphy, B.; Fritzsche, M.; Walther, H.; Hury, S.
Conference Paper
2006Prospects for the realization of APC in a distributed 300 mm R&D-line
Roeder, G.; Schellenberger, M.; Öchsner, R.; Pfeffer, M.; Frickinger, J.; Pfitzner, L.; Ryssel, H.; Fritzsche, M.
Conference Paper
2005Management of metallic contamination in advanced IC manufacturing
Danel, A.; Renaud, D.; Besson, P.; Bigot, C.; Grouillet, A.; Claes, M.; Bearda, T.; Frickinger, J.
Conference Paper
2004Polierverfahren in der Halbleiterfertigung
Pfitzner, L.; Bär, E.; Frickinger, J.; Nguyen, H.; Nutsch, A.
Conference Paper
2003Wafer reclaim in semiconductor manufacturing
Frickinger, J.; Nutsch, A.; Pfitzner, L.; Ryssel, H.; Zielonka, G.
Book Article
2001Control of organic contamination in CMOS manufacturing
Bügler, J.; Frickinger, J.; Zielonka, G.; Pfitzner, L.; Ryssel, H.; Schottler, M.
Conference Paper
2001Organic Contamination Workshop 2001. Proceedings
Pfitzner, L.; Bügler, J.; Frickinger, J.
Conference Proceedings
2000Reducing airborne molecular contamination by efficient purging of FOUPs for 300-mm wafers. The influence of material properties
Frickinger, J.; Bügler, J.; Zielonka, G.; Pfitzner, L.; Ryssel, H.; Hollemann, S.; Schneider, H.
Journal Article
1995Chemische Ätzverfahren zur Bestimmung der lateralen Tiefe von pn-Übergängen
Frickinger, J.
Thesis