Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes
Curran, B.; Fotheringham, G.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Journal Article
2014Thin glass characterization in the radio frequency range
Ebberg, A.; Meggers, J.; Rathjen, K.; Fotheringham, G.; Ndip, I.; Ohnimus, F.; Tschoban, C.; Pieper, I.; Kilian, A.; Methfessel, S.; Letz, M.; Fotheringham, U.
Conference Paper
2011Integration of planar antennas considering electromagnetic interactions at board level
Ohnimus, F.; Fotheringham, G.; Ndip, I.; Engin, A.E.; Guttowski, S.; Reichl, H.; Lang, K.D.
Journal Article
2010Design and comparison of 24 GHz patch antennas on glass substrates for compact wireless sensor nodes
Ohnimus, F.; Maaß, U.; Fotheringham, G.; Curran, B.; Ndip, I.; Fritsch, T.; Wolf, J.; Guttowski, S.; Lang, K.-D.
Journal Article
2010Managing the return-currents of signal vias in organic and silicon substrates
Ndip, I.; Löbicke, K.; Bierwirth, M.; Tschoban, C.; Curran, B.; Erxleben, R.; Ohnimus, F.; Maaß, U.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010Eine neue planare Funktionsstruktur zur Entkopplung hochfrequenter Störungen auf Schaltungsträgern
Ndip, I.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010RFID - Theoretische Konzepte und Anwendungsbeispiele
Fotheringham, G.; Ohnimus, F.; Maaß, U.; Ndip, I.; Guttowski, S.; Reichl, H.
Journal Article
2010Eine systematische Entwurfsmethode zur Sicherstellung der elektromagnetischen Zuverlässigkeit in Mikrosystemen
Ndip, I.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2009Parameterization of bent coils on curved flexible surface substrates for RFID applications
Fotheringham, G.; Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009RFID - Theoretische Konzepte und Anwendungsbeispiele
Fotheringham, G.; Ohnimus, F.; Maaß, U.; Ndip, I.; Guttowski, S.; Reichl, H.
Book Article
2007Optimal Electrical Design of System Packages and Integrated Components using the M3-Approach
Ndip, I.; Salhi, F.; Maaß, U.; Fotheringham, G.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2004Design aspects of self-sufficient distributed MicroSystems
Niedermayer, M.; Polityko, D.-D.; Fotheringham, G.; Guttowski, S.; John, W.
Journal Article
2004Quality Challenges of Reused Components
Stobbe, I.; Pötter, H.; Griese, H.; Fotheringham, G.; Reichl, H.
Conference Paper
2003Comparison of HDI organic and LTTC substrate technology with its potential for RF module application
Sommer, G.; Fotheringham, G.; John, W.; Reichl, H.
Conference Paper
2003Electrical characterisation of a power SO-package in the context of electrostatic discharge
Dörr, I.; Gieser, H.A.; Sommer, G.; Wolf, H.; Wilkening, W.; Willemen, J.; Andreini, A.; Salhi, F.; Fotheringham, G.; John, W.; Reichl, H.
Conference Paper
1999Diamond as a heat spreader material for laser applications
Töpfer, M.; Kaulfersch, E.; Fotheringham, G.; Schmidt, M.; Dai, W.; Reichl, H.
Book Article
1999Towards the Re-Use of Electronic Products
Pötter, H.; Griese, H; Middendorf, A.; Fotheringham, G.; Reichl, H.
Conference Paper
1999Towards the re-use of electronic products-quality assurance for the re-use of electronics
Potter, H.; Griese, H.; Middendorf, A.; Fotheringham, G.; Reichl, H.
Conference Paper
1998Quality Insurance for the Reuse of Electronics
Pötter, H.; Griese, H.; Middendorf, A.; Fotheringham, G.
Conference Paper