Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2014Analytische und numerische Beschleunigungsmodelle für Lötverbindungen und Verifizierung mit Feldtestergebnissen
Dudek, R.; Hildebrandt, M.; Faust, W.; Trageser, H.; Kohl, R.; Schuch, B.
Conference Paper
2012Chances and limits of computer tomography in materialographic investigations
Faust, W.; Noack, E.; Michel, B.
Journal Article
2012Hochgenaue Bestimmung mechanischer Spannungen in Elektronik- und MEMS-Komponenten durch ein Stressmesschip
Schindler-Saefkow, F.; Otto, A.; Faust, W.; Wunderle, B.; Michel, B.; Rzepka, S.
Conference Paper
2012Stress chip measurements of the internal package stress for process characterization and health monitoring
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Faust, W.; Wunderle, B.; Michel, B.; Rzepka, S.
Conference Paper
2011Formulation of percolating thermal underfill by sequential convective gap filling
Branschwiler, T.; Goicochea, J.V.; Matsumoto, K.; Wolf, H.; Kiimin, C.; Michel, B.; Wunderle, B.; Faust, W.
Conference Paper
2011Reliability enhancement of Ohmic RF MEMS switches
Kurth, S.; Leidich, S.; Bertz, A.; Nowack, M.; Frömel, J.; Kaufmann, C.; Faust, W.; Gessner, T.; Akiba, A.; Ikeda, K.
Conference Paper
2011Three-dimensional deformation analysis of MEMS/NEMS by means of X-ray computer-tomography
Hammacher, J.; Dost, M.; Faust, W.; Scheiter, L.; Erb, R.; Michel, B.
Conference Paper
2010A detailed investigation of the failure formation of copper trace cracks during drop tests
Kraemer, F.; Wiese, S.; Rzepka, S.; Faust, W.; Lienig, J.
Conference Paper
2009Exploring microsystems - measurement and test in fabrication and R&D
Kurth, S.; Faust, W.; Specht, H.; Meinig, M.; Fernholz, G.
Journal Article
2008Effective thermal modelling evaluation and non-destructive tests for thermal via-structures in organic multi layer PCBs
Schacht, R.; Wunderle, B.; May, D.; Abo Ras, M.; Faust, W.; Michel, B.; Reichel, H.
Conference Paper
2008Insitu-Measurement System for Analysis of Thermaly Caused Deformation
Hammacher, J.; Noack, E.; Faust, W.
Journal Article, Conference Paper
2008Investigations of Reliability of Lead-Free Solder Joints
Faust, W.; Poller, T.; Dudek, R.; Michel, B.
Journal Article, Conference Paper
2008Material characterization and non-destructive failure analysis by transient pulse generation and IR-thermography
May, D.; Wunderle, B.; Abo Ras, M.; Faust, W.; Gollhard, A.; Schacht, R.; Michel, B.
Conference Paper
2008Nano-Computertomographie - ein wertvolles Hilfsmittel bei metallographischen Untersuchungen zur Schadensanalyse mikroelektronischer und mikrotechnischer Komponenten
Faust, W.; Noack, E.; Michel, B.
Conference Paper
2008Reliability of Several Sn-Based Solders under Test- and Field Fatigue Loadings
Dudek, R.; Ratchev, R.; Faust, W.; Michel, B.
Journal Article, Conference Paper
2008Thermal test- and field cycling induced degradation and its Fe-based prediction for different SAC solders
Dudek, R.; Faust, W.; Ratchev, R.; Roellig, M.; Albrecht, H.-J.; Michel, B.
Conference Paper
2007Design for reliability with AuSn interconnects
Dudek, R.; Wittler, O.; Faust, W.; Brämer, B.; Klein, M.; Jun, W.; Michel, B.
Conference Paper
2007In-situ Microscopic Studies on Microstructural Degradation and FE Analyses for Miniaturized SAC Solder Joints under Thermal Test- and Field Cycling
Dudek, R.; Faust, W.; Döring, R.; Michel, B.
Conference Paper
2007Low-cycle fatigue of Ag-based solders dependent on alloying composition and thermal cycle conditions
Dudek, R.; Faust, W.; Wiese, S.; Röllig, M.; Michel, B.
Conference Paper
2007Microstucture of Damaged Solder
Faust, W.; Dudek, R.; Michel, B.
Conference Paper
2007Schadensanalyse in der AVT am Beispiel bleifreier Lotverbindungen
Faust, W.; Dudek, R.; Michel, B.; Poller, T.
Conference Paper
2006Deformation and fatigue behaviour of AuSn interconnects
Wittler, O.; Walter, H.; Dudek, R.; Faust, W.; Jun, W.; Michel, B.
Conference Paper
2006Experimental investigation for fracture analysis of solder joints in microelectronic and mems applications
Walter, H.; Bombach, C.; Dudek, R.; Faust, W.; Michel, B.
Conference Paper
2006A FE-study of solder fatigue compared to microstructural damage evaluation by in-situ laser scanning and FIB microscopy
Dudek, R.; Faust, W.; Gollhard, A.; Michel, B.
Conference Paper
2005A comparative study of solder fatigue evaluated by microscopic in-situ analysis, on-line resistance measurement and FE calculations
Dudek, R.; Faust, W.; Vogel, J.; Michel, B.
Conference Paper
2005Damage and failure analysis of lead-free solder interconnects in automotive electronics
Faust, W.; Kreyßig, K.; Michel, B.
Abstract
2005Die Möglichkeiten der FIB-Technik bei der Schadensanalyse bleifreier Lote
Faust, W.; Gollhardt, A.; Michel, B.
Conference Paper
2005Thermal Lap Shear Tests on MEMS Interconnect Solder joints
Vogel, J.; Dudek, R.; Faust, W.; Dost, M.; Michel, B.
Conference Paper
2004Application of micromirror arrays for Hadamard transform optics
Hanf, M.; Kurth, S.; Billep, D.; Hahn, R.; Faust, W.; Heinz, S.; Dötzel, W.; Gessner, T.
Conference Paper
2004In-situ solder fatigue studies using a thermal lap shear test
Dudek, R.; Faust, W.; Vogel, J.; Michel, B.
Conference Paper
2004Mechanische Charakterisierung membranartiger Sonsorstrukturen
Winkler, T.; Seiler, B.; Dost, M.; Brokmann, G.; Übensee, H.; Rümmler, N.; Faust, W.; Sommer, J.-P.
Conference Paper
2003Schadensanalyse an Komponenten der Mikrosystemtechnik und Mikroelektronik
Faust, W.; Dost, M.; Michel, B.
Conference Paper
2001Einsatz von Mikrospiegel-Arrays zur Lichtmodulation in einem Hadamard-Transformations-Spektrometer
Hanf, M.; Kurth, S.; Faust, W.; Hahn, R.; Heinz, S.; Dötzel, W.; Gessner, T.
Conference Paper
2001In-situ-Messungen an Komponenten der Mikroelektronik und Mikrosystemtechnik mit optischen Methoden
Faust, W.; Bombach, C.; Pritzke, B.; Michel, B.
Conference Paper
2000Deformation behavior of micro mirror arrays under optical power
Kurth, S.; Kehr, K.; Kaufmann, C.; Faust, W.; Dötzel, W.; Michel, B.
Conference Paper
2000In situ measurement of deformations on microelectronic components by microscopic methods
Faust, W.; Bombach, C.; Michel, M.; Michel, B.
Conference Paper
2000Material Characterization and FE Analysis of Electroplated Microrelays
Vogel, J.; Sommer, J.-P.; Faust, W.; Kieselstein, E.; Michel, B.
Conference Paper
2000New investigations in materials research by confocal laser scanning microscopy
Kunath-Fandrei, G.; Faust, W.; Ullmann, P.; Michel, B.
Conference Paper
2000Rapid prototyping of microcomponents and demonstrators in micro system technology
Fleischer, L.; Faust, W.; Dost, M.; Michel, B.; Vogel, J.; Zeidler, H.
Conference Paper
2000Reliability investigations of vibration excited circuit boards
Rümmler, N.; Schnitzer, R.; Döring, R.; Kaulfersch, E.; Faust, W.; Michel, B.
Conference Paper
1999Analysis of field coupling effects in fracture by combining infrared thermography and FE-calculation
Vogel, J.; Dost, M.; Auersperg, J.; Faust, W.; Michel, B.
Journal Article
1999Facilities and results of micro deformation measurements
Faust, W.; Bombach, C.; Michel, B.
Book Article
1999Investigation of thermomechanical field coupling effects near crack tips by combining thermal emission analysis and FE-simulation
Vogel, J.; Auersperg, J.; Dost, M.; Faust, W.; Michel, B.
Book Article
1999Optical measurement methods for MEMS applications
Großer, V.; Bombach, C.; Faust, W.; Vogel, D.; Michel, B.
Book Article
1998Investigation of a rigid carrier CSP with the microDAC method
Simon, J.; Vogel, D.; Faust, W.; Gollhardt, A.; Michel, B.
Conference Paper
1998Thermomechanische Untersuchungen zur Zuverlässigkeitserhöhung von Mikrosystemen
Michel, B.; Faust, W.; Auersperg, J.
Conference Paper
1997Confocal laser scanning microscopy for testing of microsystems
Faust, W.; Michel, B.
Conference Paper
1997Laseroptical deformation measurements on SAA-materials
Faust, W.; Bombach, C.; Oehmigen, M.; Großer, V.; Michel, B.
Conference Paper
1997Mechanical characterization of polymers in microelectronics
Walter, H.; Faust, W.; Schubert, A.; Grellmann, W.; Michel, B.
Conference Paper
1996Mechanisch-thermische Zuverlässigkeit von Chipkarten
Schubert, A.; Dudek, R.; Faust, W.; Vogel, D.; Michel, B.; Reichl, H.
Book Article
1996Zuverlässigkeitsuntersuchungen an AlN-Cu-Verbunden
Auerswald, E.; Kämpfe, B.; Dudek, R.; Faust, W.
Book Article
1995Anwendungen der Laser Scanning Mikroskopie in der Mikrosystemtechnik
Faust, W.; Dudek, R.; Michel, B.; Dost, M.
Conference Paper
1995Anwendungen der Laser Scanning Mikroskopie in der Mikrosystemtechnik
Faust, W.; Dudek, R.; Michel, B.; Dost, M.
Conference Paper
1995Anwendungen der Laser Scanning Mikroskopie in der Mikrotechnik
Faust, W.; Dost, M.
Conference Paper
1995Bruchmechanische Untersuchungen zur Zuverlässigkeitsbewertung mikrotechnischer Aufbauten
Michel, B.; Sommer, J.-P.; Krause, F.; Winkler, T.; Faust, W.
Conference Paper
1995Experimentelle Untersuchungen zu Deformationen und Eigenspannungen an kunststoffabgedeckten mikroelektronischen Aufbauten
Krause, F.; Rehme, F.; Faust, W.; Voges, T.
Conference Paper
1995Laseroptische Analysen von Miniaturbauelementen
Bombach, C.; Großer, V.; Faust, W.; Michel, B.
Conference Paper
1995Laseroptische Verformungsmessungen an Mikroaufbauten
Großer, V.; Lindemann, G.; Faust, W.; Bombach, C.; Michel, B.
Conference Paper
1995Lötstellenbewertung an SMD-Aufbauten
Dudek, R.; Sommer, J.-P.; Faust, W.; Döring, R.
Conference Paper
1995Mechanisch-thermische Simulation und Lebensdauerbewertung von mikrotechnischen Komponenten
Sommer, J.-P.; Dudek, R.; Faust, W.; Michel, B.
Book Article
1995Mechanisch-thermische Versagensdetektion an Leiterplatten mittel numerischer und laseroptischer Verfahren
Großer, V.; Sommer, J.-P.; Faust, W.; Bombach, C.; Michel, B.
Conference Paper
1995Thermomechanische Analysen mikrotechnischer Komponenten
Faust, W.; Dudek, R.; Michel, B.
Conference Paper
1995Werkstoffmechanische Untersuchungen an Chipkarten
Vogel, D.; Schubert, A.; Faust, W.; Michel, B.; Reichl, H.
Conference Paper
1995Zuverlässigkeitsuntersuchungen an AlN-Verbunden, angewendet auf die Mikrosystem-Modultechniken
Auerswald, E.; Dudek, R.; Faust, W.; Kämpfe, B.
Conference Paper
1994Reliability of epoxy Globtop in microelectronic assemblies
Krause, F.; Voges, T.; Rehme, F.; Dudek, R.; Vogel, D.; Faust, W.
Conference Paper
1993Beanspruchung von Lötverbindungen oberflächenmontierter ICs in Abhängigkeit von der Pin-Form
Dudek, R.; Faust, W.; Michel, B.; Hartmann, H.J.
Conference Paper
1993Qualitätskontrolle an mikromechanischen Bauteilen
Faust, W.; Michel, B.; Winkler, T.
Journal Article