Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016Electroplating of neodymium iron alloys
Kurth, F.; Froemel, J.; Tanaka, S.; Esashi, M.; Gessner, T.
Conference Paper
2016Structure and thermoelectric properties of PbTe films deposited by thermal evaporation method
Nguyen, M.P.; Froemel, J.; Hatayama, S.; Sutou, Y.; Koike, J.; Tanaka, S.; Esashi, M.; Gessner, T.
Conference Paper
2015Evaluation of sputtered Pd76Cu6Si18 metallic glass for MEMS application
Vogel, K.; Wiemer, M.; Gessner, T.; Vogel, J.; Lin, Y.-C.; Tsai, Y.-C.; Esashi, M.; Tanaka, S.
Conference Paper
2015Fabrication of nanoporous gold and the application for substrate bonding at low temperature
Wang, W.-S.; Lin, Y.-C.; Gessner, T.; Esashi, M.
Journal Article
2015Metallic glass as a mechanical material for microscanners
Lin, Y.C.; Tsai, Y.C.; Ono, T.; Liu, P.; Esashi, M.; Gessner, T.; Chen, M.W.
Journal Article
2015On-chip micro-pseudocapacitors for ultrahigh energy and power delivery
Han, J.; Lin, Y.-C.; Chen, L.; Tsai, Y.-C.; Ito, Y.; Guo, X.; Hirata, A.; Fujita, T.; Esashi, M.; Gessner, T.; Chen, M.
Journal Article
2014Nanoporous gold as a versatile bonding intermediate
Lin, Y.-C.; Wang, W.-S.; Gessner, T.; Esashi, M.
Conference Paper
2013Design and simulation of nanomaterial-enhanced LTCC integrated inductors
Lin, Y.-C.; Gabler, F.; Tanaka, S.; Esashi, M.; Gessner, T.
Conference Paper
2013Integration and fabrication of PZT and metallic glass films for micro-mirror device
Tsai, Y.-C.; Lee, J.-W.; Naono, T.; Lin, Y.-C.; Esashi, M.; Fujii, T.; Gessner, T.
Conference Paper
2013LTCC-based three dimensional inductors with nano-ferrite embedded core for one-chip tunable RF system
Lin, Y.-C.; Gabler, F.; Tsai, Y.-C.; Tanaka, S.; Gessner, T.; Esashi, M.
Conference Paper
2013Metallic glass micro-mirror integrated with PZT actuation for low resonant frequency and large exciting angle
Tsai, Y.-C.; Lee, J.-W.; Naono, T.; Lin, Y.-C.; Esashi, M.; Fujii, T.; Gessner, T.
Conference Paper
2013Nanoporous gold for MEMS packing applications
Lin, Y.-C.; Wang, W.-S.; Chen, L.Y.; Chen, M.W.; Gessner, T.; Esashi, M.
Journal Article
2013Solid Liquid Interdiffusion Bonding for Micro Devices near Room Temperature
Froemel, J.; Wiemer, M.; Tanaka, S.; Esashi, M.; Gessner, T.
Conference Paper
2012Fabrication of freestanding Pb(Zr,Ti)O film microstructures using Ge sacrificial layer
Lee, J.-W.; Kawai, Y.; Tanaka, S.; Lin, Y.-C.; Gessner, T.; Esashi, M.
Journal Article
2012Low temperature metal interdiffusion bonding for micro devices
Frömel, J.; Lin, Y.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2012A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface
Haubold, M.; Lin, Y.; Frömel, J.; Wiemer, M.; Esashi, M.; Geßner, T.
Journal Article
2012RIE patterning technology of Zr-based metallic glass for MEMS devices fabrication
Tsai, Y.-C.; Lin, Y.-C.; Abe, T.; Esashi, M.; Gessner, T.
Conference Paper
2012Substrate bonding at low temperature by using plasma activated porous gold
Wang, W.-S.; Lin, Y.-C.; Gessner, T.; Esashi, M.
Conference Paper
2011Anodically-bondable LTCC substrates with novel nano-structured electrical interconnection for MEMS packaging
Lin, Y.-C.; Wang, W.-S.; Chen, L.Y.; Chen, M.W.; Gessner, T.; Esashi, M.
Conference Paper
2011Development of the large scanning mirror using Fe-based metallic glass ribbon
Lee, J.-W.; Lin, Y.-C.; Chen, N.; Louzguine, D.V.; Esashi, M.; Gessner, T.
Journal Article
2011Development of the micro-mirror with large scaning angle using FE-based metallic glass thin film
Lee, J.-W.; Lin, Y.-C.; Kaushik, N.; Sharma, P.; Inoue, A.; Esashi, M.; Gessner, T.
Conference Paper
2011Micromirror with large-tilting angle using Fe-based metallic glass
Lee, J.-W.; Lin, Y.-C.; Kaushik, N.; Sharma, P.; Makino, A.; Inoue, A.; Esashi, M.; Gessner, T.
Journal Article
2011ZR-based metallic glass as a novel MEMS bonding material
Lin, Y.-C.; Froemel, J.; Sharma, P.; Inoue, A.; Esashi, M.; Gessner, T.
Conference Paper
2010Fabrication of metal-based nanoporous structures
Lin, Y.-C.; Chen, P.-C.; Chen, L.Y.; Chen, M.W.; Esashi, M.; Gessner, T.
Conference Paper
2010Nanofabrication of reactive structure for low temperature bonding
Lin, Y.; Bräuer, J.; Hofmann, L.; Baum, M.; Frömel, J.; Wiemer, M.; Esashi, M.; Gessner, T.
Conference Paper
2010NEMS/MEMS and passive components integration by using novel LTCC substrate
Frömel, J.; Lin, Y.; Mori, M.; Tanaka, S.; Gessner, T.; Esashi, M.
Conference Paper
2009Characterization of eutectic wafer bonding using gold and silicon
Lin, Y.; Baum, M.; Haubold, M.; Frömel, J.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2009Development and evaluation of AuSi eutectic wafer bonding
Lin, Y.; Baum, M.; Haubold, M.; Frömel, J.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper