Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
20103-D thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Töpper, M.; Ndip, I.; Erxleben, R.; Brusberg, L.; Nissen, N.; Schröder, H.; Yamamoto, H.; Todt, G.; Reichl, H.
Conference Paper
2010Design and Characterization of a Low Profile Miniaturized UHF PIFA for Compact Wireless Sensor Nodes
Ohnimus, F.; Erxleben, R.; Tschoban, C.; Ndip, I.; Niedermayer, M.; Scholtz, H.; Bonim, T.; Guttowski, S.; Lang, K.-D.
Conference Paper
2010Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling
Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Conference Paper
2010GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects
Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Conference Paper
2010High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures
Erxleben, R.; Ndip, I.; Brusberg, L.; Schroeder, H.; Toepper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2010Managing the return-currents of signal vias in organic and silicon substrates
Ndip, I.; Löbicke, K.; Bierwirth, M.; Tschoban, C.; Curran, B.; Erxleben, R.; Ohnimus, F.; Maaß, U.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010Simulation, measurement and analysis of electromagnetic band gap structures for noise suppression in electronic systems
Ndip, I.; Bierwirth, M.; Tschoban, C.; Maab, U.; Erxleben, R.; Guttowski, S.; Reichl, H.
Conference Paper
2010A small form-factor and low-cost opto-electronic package for short-reach 40 Gbit/s serial speed optical data links
Kropp, J.R.; Lott, J.A.; Ledentsov, N.N.; Otruba, P.; Drögemüller, K.; Fiol, G.; Bimberg, D.; Ndip, I.; Erxleben, R.; Maaß, U.; Klein, M.; Lang, G.; Oppermann, H.; Schröder, H.; Reichl, H.
Conference Paper
2009A comparative study of microstrip, stripline and coplanar lines on different substrate technologies for high-performance applications
Erxleben, R.; Ndip, I.; Brusberg, L.; Schröder, H.; Töpper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper