Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2013Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films in Cu/low-k interconnects
Wojcik, H.; Hossbach, C.; Kubasch, C.; Verdonck, P.; Barbarin, Y.; Merkel, U.; Bartha, J.W.; Hübner, R.; Engelmann, H.-J.; Friedemann, M.
Journal Article
2013An experimental methodology for the in-situ observation of the time-dependent dielectric breakdown mechanism in Copper/low-k on-chip interconnect structures
Yeap, K.B.; Gall, M.; Sander, C.; Niese, S.; Liao, Z.; Ritz, Y.; Rosenkranz, R.; Mühle, U.; Gluch, J.; Zschech, E.; Aubel, O.; Beyer, A.; Hennesthal, C.; Hauschildt, M.; Talut, G.; Poppe, J.; Vogel, N.; Engelmann, H.-J.; Stauffer, D.; Major, R.; Warren, O.
Conference Paper
2012Strain mapping of tensile strained transistors by dark-field off-axis electron holography
Sickmann, J.; Schuster, J.; Richter, R.; Wuerfel, A.; Geisler, H.; Engelmann, H.-J.; Lichte, H.
Conference Paper
2011Characterization of small Cu grains using the conical dark-field technique in the transmission electron microscope
Hübner, R.; Engelmann, H.-J.; Zschech, E.; Zschech, E.
Journal Article
2011Interface formation in the US-wedge/wedge-bond process of AlSi1/CuNiAu contacts
Geissler, U.; Funck, J.; Schneider-Ramelow, M.; Engelmann, H.-J.; Rooch, I.; Müller, W.H.; Reichl, H.
Journal Article
2010Challenges to quantitative energy-dispersive X-ray spectrometry and its application to graded embedded silicon-germanium for high-performance complementary metal oxide semiconductor devices
Hübner, R.; Engelmann, H.-J.; Zschech, E.
Journal Article
2010Conical dark-field analysis for small grain characterization in narrow Cu interconnect structures: Potential and challenges
Hübner, R.; Engelmann, H.-J.; Zschech, E.
Conference Paper
2010Small grain and twin characterization in sub-100 nm Cu interconnects using the conical dark-field technique in the transmission electron microscope
Hübner, R.; Engelmann, H.-J.; Zschech, E.
Conference Paper
2008Novel carbon-cage-based ultralow-k materials: Modeling and first experiments
Zagorodniy, K.; Chumakov, D.; Täschner, C.; Lukowiak, A.; Stegmann, H.; Schmeißer, D.; Geisler, H.; Engelmann, H.-J.; Hermann, H.; Zschech, Ehrenfried
Journal Article
2008Process control and physical failure analysis for sub-100NM CU/Low-K structures
Zschech, Ehrenfried; Huebner, R.; Potapov, P.; Zienert, I.; Meyer, M.A.; Chumakov, D.; Geisler, H.; Hecker, M.; Engelmann, H.-J.; Langer, E.
Conference Paper
2006FIB-Präparation und TEM-Analytik an AlSi1 Bondkontakten
Geißler, U.; Engelmann, H.-J.; Urban, I.; Rooch, H.
Journal Article