Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Biopolymer-Partikel enthaltender Aminoharzschaumstoff
Börner, Frank; Engelmann, Gunnar
Patent
2016Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications
Kroehnert, K.; Glaw, V.; Engelmann, G.; Jordan, R.; Samulewicz, K.; Hauck, K.; Cronin, R.; Robertson, M.; Ehrmann, O.; Lang, K.-D.
Conference Paper
2016Lignin as component in bio-based epoxy resins
Engelmann, G.; Ganster, J.
Presentation
2016Lignin reinforcement in thermosets composites
Engelmann, Gunnar; Ganster, Johannes
Book Article
2015Fully biobased epoxy resins from lignin
Ganster, Johannes; Engelmann, Gunnar
Journal Article
2015Lignin as component in bio-based epoxy resins
Engelmann, G.; Ganster, J.
Presentation
2014Bio-based epoxy resins with low molecular weight kraft lignin and pyrogallol
Engelmann, G.; Ganster, J.
Journal Article
2014Mikrostrukturiertes Kompositmaterial, Verfahren zu dessen Herstellung, Formkörper hieraus sowie Verwendungszwecke
Erdmann, Jens; Engelmann, Gunnar; Ganster, Johannes
Patent
2014Thermoplastische Polymercompounds mit niedermolekularen Lingninen, Verfahren zu deren Herstellung, Formkörper sowie Verwendungen
Erdmann, Jens; Engelmann, Gunnar; Ganster, Johannes
Patent
2013Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration
Wunderle, B.; Heilmann, J.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.
Conference Paper
2013Development and fabrication of thin film thermo test chip and its integration into a test system for thermal interface characterization
Abo Ras, M.; Engelmann, G.; May, D.; Rothermund, M.; Schacht, R.; Wunderle, B.; Winkler, T.; Michel, B.; Oppermann, H.; Rzepka, S.
Conference Paper
2013Nanocomposites based on aromatic polyesters and organically modified clay
Engelmann, G.; Bonatz, E.; Ganster, J.
Journal Article
2013Preparation of PTT/clay nanocomposites with solid-state polymerized polytrimethylene terephthalate
Engelmann, G.; Bonatz, E.; Ganster, J.; Pinnow, M.; Bohn, A.
Journal Article
2013Reliability of Cu-plated through encapsulant vias (TEV) for 3D-integration
Heilmann, J.; Wunderle, B.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.
Conference Paper
2012Copper filling of TSVs for interposer applications
Jurgensen, N.; Huynh, Q.H.; Engelmann, G.; Ngo, H.-D.; Ehrmann, O.; Lang, K.-D.; Uhlig, A.; Dretschkow, T.; Rohde, D.; Worm, O.; Jager, C.
Conference Paper
2012Lösungsmittelfreie Epoxidharzmischung, Verfahren zu deren Herstellung sowie deren Verwendung
Engelmann, G.; Ganster, J.
Patent
2012Monomer cast polyamide 6 composites and their treatment with high-energy electrons
Engelmann, G.; Gohs, U.; Ganster, J.
Journal Article
2011Basics of lignin
Fink, H.-P.; Ganster, J.; Engelmann, G.
Journal Article
2011Electromigration in electroplated gold micro contacts
Kleff, J.; Engelmann, G.; Oppermann, H.; Reichl, H.
Conference Paper
2011Reliability investigation of large GaAs pixel detectors flip-chip-bonded on Si readout chips
Klein, M.; Hutter, M.; Engelmann, G.; Fritzsch, T.; Oppermann, H.; Dietrich, L.; Wolf, M.J.; Brämer, B.; Dudek, R.; Reichl, H.
Journal Article
2010Elektrisches oder elektronisches Bauelement und Verfahren zum Herstellen eines Anschlusses
Wolf, J.; Engelmann, G.; Oppermann, H.; Reichl, H.
Patent
2010Progress in thermal characterisation methods and thermal interface technology within the "Nanopack" project
Wunderle, B.; Ras, M.A.; Klein, M.; Mrossko, R.; Engelmann, G.; May, D.; Wittler, O.; Schacht, R.; Dietrich, L.; Oppermann, H.; Michel, B.
Conference Paper
2009Lignin als Polymerwerkstoff
Engelmann, G.; Ebert, A.; Fink, H.-P.
Conference Paper
2008Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chips
Klein, M.; Hutter, M.; Oppermann, H.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R.; Reichl, H.
Conference Paper
2008High aspect ratio TSV copper filling with different seed layers
Wolf, M.J.; Dretschkow, T.; Wunderle, B.; Jürgensen, N.; Engelmann, G.; Ehrmann, O.; Uhlig, A.; Michel, B.; Reichl, H.
Conference Paper
2008Profile of the wafer level ECD gold bumps under variable parameters
Jing, X.M.; Engelmann, G.; Chen, D.; Wolf, J.; Ehrmann, O.; Reichl, H.
Journal Article
2008Verfahren zur Herstellung einer Lotmetallisierung
Hutter, M.; Engelmann, G.; Töpper, M.; Oppermann, H.
Patent
2007Reliability Investigation of Large GaAs Pixel Detectors Flip Chip Bonded on Si Readout Chips
Klein, M.; Oppermann, H.; Hutter, M.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R; Reichl, H.
Conference Paper
2007UBM-PAD, Loetkontakt und Verfahren zur Herstellung einer Loetverbindung
Jurenka, C.; Wolf, J.; Engelmann, G.; Reichl, H.
Patent
2007Verfahren zum Herstellen einer Mikrostruktur oder Nanostruktur und mit Mikrostruktur oder Nanostruktur versehenes Substrat
Oppermann, H.; Wolf, J.; Jordan, R.; Schmidt, R.; Engelmann, G.
Patent
2007Verfahren zum Herstellen einer nanoporoesen Schicht
Oppermann, H.; Dietrich, L.; Engelmann, G.; Wolf, J.
Patent
2006Flip chip bumping technology - Status and update
Wolf, M.J.; Engelmann, G.; Dietrich, L.; Reichl, H.
Conference Paper, Journal Article
2006Precise flip chip assembly using electroplated AuSn20 and SnAg3.5 solder
Hutter, M.; Oppermann, H.; Engelmann, G.; Dietrich, L.; Reichl, H.
Conference Paper
2005Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging
Jurenka, C.; Kim, J.Y.; Wolf, M.J.; Engelmann, G.; Ehrmann, O.; Yu, J.; Reichl, H.
Conference Paper
2005Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps
Oppermann, H.; Hutter, M.; Klein, M.; Engelmann, G.; Töpper, M.; Wolf, J.
Conference Paper
2005Investigation of Different Flip Chip Assembly Processes Using Au/Sn Microbumps
Hutter, M.; Thomas, T.; Jordan, R.; Engelmann, G.; Oppermann, H.; Reichl, H.; Wang, Y.; Howlader, M.; Higurashi, E.; Suga, T.
Conference Paper
2005Lead Free Solder / UBM Phase Reactions in Electroplated Bumps
Engelmann, G.; Jurenka, C.; Wolf, M.J.; Dietrich, L.
Conference Paper
2005Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops
Oppermann, H.; Hutter, M.; Engelmann, G.; Reichl, H.
Conference Paper
2005Passive Alignment Flip Chip Assembly Using Surface Tension of Liquid Solder and Micromechanical Stops
Oppermann, H.; Hutter, M.; Engelmann, G.; Reichl, H.
Conference Paper
2005W-band flip-chip VCO in thin-film environment
Töpper, M.; Schmückle, F.J.; Lenk, F.; Hutter, M.; Klein, M.; Oppermann, H.; Engelmann, G.; Riepe, K.; Heinrich, W.
Conference Paper
2004Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps
Hutter, M.; Hohnke, F.; Oppermann, H.; Klein, M.; Engelmann, G.
Conference Paper
2004Dextran carbamates - materials for microencapsulation
Engelmann, G.; Jobmann, A.; Rafler, G.
Journal Article
2004Flip Chip Assembly Using AuSn Solder Bumps for GaAs Applications
Oppermann, H.; Hutter, M.; Jordan, R.; Klein, M.; Engelmann, G.; Wolf, J.; Reichl, H.
Conference Paper
2004High precision passive alignment flip chip assembly using self alignment and micromechanical stops
Hutter, M.; Oppermann, H.; Engelmann, G.; Reichl, H.
Conference Paper
2004Investigation of solder bumps, flip chip assembly, reliability and passive alignment using Au/Sn
Hutter, M.; Klein, M.; Engelmann, G.; Oppermann, H.
Book Article
2002Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications
Hutter, M.; Oppermann, H.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Hydrophobe Staerkecarbamate und Verfahren zu ihrer Herstellung
Engelmann, G.; Bonatz, E.; Bechthold, I.; Rafler, G.
Patent
2001Preparation of starch carbamates in homogeneous phase using different mixing conditions
Engelmann, G.; Bonatz, E.; Bechthold, I.; Rafler, G.
Journal Article
2000Characteristics of fritting contacts utilized for micromachined wafer probe cards
Itoh, T.; Suga, T.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Reichl, H.
Journal Article
1999Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology
Töpper, M.; Dietrich, L.; Engelmann, G.; Fehlberg, S.; Gerlach, P.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H.
Conference Paper
1998Gold and gold-tin wafer bumping by electrochemical deposition for flip chip and TAB
Dietrich, L.; Engelmann, G.; Ehrmann, O.; Reichl, H.
Conference Paper
1998Mask aligners in advanced packaging
Töpper, M.; Tönnies, D.; Wolf, J.; Engelmann, G.; Reichl, H.
Journal Article
1997Optical analysis of 3D-microstructures produced by additive technologies
Bombach, C.; Großer, V.; Gentzsch, S.; Engelmann, G.; Michel, B.
Conference Paper
1997Spin coating in UV depth lithography and 3D microfabrication
Engelmann, G.; Dietrich, L.; Renger, E.; Gentzsch, S.; Reichl, H.
Conference Paper
1996Reliability investigations of different bumping processes for flip chip and TAB applications
Jung, E.; Klöser, J.; Nave, J.; Engelmann, G.; Dietrich, L.; Zakel, E.; Reichl, H.
Conference Paper
19953D structures for microsystem technology using advanced proximity lithography
Cullmann, E.; Löchel, B.; Engelmann, G.; Reyerse, C.
Journal Article
1994Investigation of self-alignment during the flip-chip assembly using eutectic gold-tin metallurgy
Oppermann, H.H.; Zakel, E.; Engelmann, G.; Reichl, H.
Conference Paper
1994Magnetically driven microstructures fabricated with multilayer electroplating
Löchel, B.; Maciossek, A.; Wagner, B.; Engelmann, G.; Quenzer, H.J.
Conference Paper
1994Manufacture of 3D structures for micro systems with advanced shadow casting lithography
Cullmann, E.; Löchel, B.; Engelmann, G.
Conference Paper
1993Investigations of flip chip interconnections on green tape ceramic substrates
Klöser, J.; Zakel, E.; Engelmann, G.; Distler, H.
Conference Paper
1993Untersuchungen einer Flip-Chip-Bond-Technologie auf Green-Tape-Keramik-Multilayer-Substraten
Klöser, J.; Zakel, E.; Engelmann, G.; Distler, H.; Reichl, H.
Conference Paper
1992Microactuators with moving magnets for linear, torsional or multiaxial motion
Wagner, B.; Engelmann, G.; Simon, J.; Benecke, W.
Conference Paper